Patents Examined by M. L. Moore
  • Patent number: 4946929
    Abstract: A novel series of articles useful as implants and prostheses and methods for their preparation and use are provided which utilize polyanhydride polymeric matrices as a general class of materials. These articles are biocompatible, non-inflammatory and degrade predictably into non-toxic residues after introduction in-vivo. The articles may be formed in any desired dimensions and configuration and may take specific shape as vascular or skin grafts, as biodegradable sutures or as orthopedic appliances such as bone plates and the like.
    Type: Grant
    Filed: June 15, 1987
    Date of Patent: August 7, 1990
    Assignee: Massachusetts Institute of Technology
    Inventors: Patricia D'Amore, Kam W. Leong, Robert S. Langer
  • Patent number: 4946935
    Abstract: A novel fluorine-containing aromatic compound of the formula: ##STR1## wherein X is ##STR2## in which R.sub.f is a perfluoroalkyl group having 1 to 10 carbon atoms, R.sub.f ' is a perfluoroalkyl group having 1 to 12 carbon atoms, p is an integer of 1 to 3, q is an integer of 0 to 3, r is 0 or 1, s is an integer of 0 to 5 and t is an integer of 0 to 5,Y is X, a hydrogen atom, an alkyl group having 1 to 8 carbon atoms or a fluoroalkyl group having 1 to 8 carbon atoms, andeach A is independently ##STR3## in which D is an amino, carboxyl, hydroxyl, methyl or haloformyl group, and n is an integer of 1 or 2, or ##STR4## can be used to derive various compounds, some of which are useful for preparing a fluorine-containing epoxy compound or polyimide with good properties.
    Type: Grant
    Filed: April 4, 1988
    Date of Patent: August 7, 1990
    Assignee: Daikin Industries, Ltd.
    Inventors: Yohnosuke Ohsaka, Tsutomu Kobayashi, Motonobu Kubo
  • Patent number: 4943682
    Abstract: Described is a process for producing, in particulate form, aromatic polyimides based on one or more 2,2-bis[4-(aminophenoxy)-phenyl]hexafluoropropanes. The process involves forming, heating and agitating in a medium composed of dipolar aprotic solvent and liquid aromatic hydrocarbon solvent, a homogeneous solution of a polyamic acid derived from a substantially equimolar mixture of (i) an aromatic tetracarboxylic dianhydride and (ii) a 2,2-bis[4-(aminophenoxy)phenyl]hexafluoropropane, such that a separate phase of particulate aromatic polyimide is formed in such medium. The process avoids difficulties caused by the tendency of the wet polyimide polymer to agglomerate into stringy or tacky masses which can foul reactor and agitator surfaces.
    Type: Grant
    Filed: December 15, 1988
    Date of Patent: July 24, 1990
    Assignee: Ethyl Corporation
    Inventors: W. Dirk Klobucar, Allan A. Eisenbraun, Ronald C. Zumstein
  • Patent number: 4942216
    Abstract: Polyaryl ether ketones essentially consist of(A) 55-95 mol % of repeating units of the general formula ##STR1## where s and t are each 0, 1, 2 or 3 and Q and T are each --O-- or --CO--, or their C.sub.1 -C.sub.6 -alkyl, C.sub.1 -C.sub.6 alkoxy, aryl, chlorine or fluorine derivatives substituted in the nucleus, and(B) 5-45 mol % of repeating units of the general formula II ##STR2## where Ar.sup.1, Ar.sup.2, Ar.sup.3, ar.sup.4 and Ar.sup.5 independently of one another are each a phenylene, biphenylene or naphthylene group or a C.sub.1 -C.sub.6 -alkyl, C.sub.1 -C.sub.6 -alkoxy, aryl, chlorine or fluorine derivative of this group, Q' and T' are each --O--or --CO-- and s' and t' are each 0, 1, 2 or 3, with the proviso that one or more of the groups Ar.sup.1, Ar.sup.2, Ar.sup.3, Ar.sup.4 and Ar.sup.5 are a biphenylene or naphthylene group or a C.sub.1 -C.sub.6 -alkyl, C.sub.1 -C.sub.6 -alkoxy, aryl, chlorine or fluorine derivative of such a group and, if Ar.sup.
    Type: Grant
    Filed: February 10, 1989
    Date of Patent: July 17, 1990
    Assignee: BASF Aktiengesellschaft
    Inventors: Gerhard Heinz, Robert R. Lieder, Juergen Koch
  • Patent number: 4939228
    Abstract: Described herein are solutions for coating compositions comprising at least one select polyarylethersulfone dissolved in a solvent comprising methylene chloride or N,N-dimethylformamide. These solutions are useful for preparing films, adhesives anisotropic membranes or hollow fibers.
    Type: Grant
    Filed: July 28, 1988
    Date of Patent: July 3, 1990
    Assignee: Amoco Corporation
    Inventors: Lloyd M. Robeson, Louis M. Maresca
  • Patent number: 4937317
    Abstract: A high temperature polyimide composition prepared by reacting 4,4'-isophthaloyldiphthalic anhydride with metaphenylenediamine is employed to prepare matrix resins, adhesives, films, coatings, moldings, and laminates.
    Type: Grant
    Filed: November 2, 1988
    Date of Patent: June 26, 1990
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: J. Richard Pratt, Terry L. St. Clair, Donald J. Progar
  • Patent number: 4935490
    Abstract: Aromatic polyimides of the formula: ##STR1## where --Ar-- is ##STR2## --Ar'-- is ##STR3## --Ar"-- is ##STR4## where --Z, and --Z.sub.1, independently are --Cl, --Br or --I; where --X, --X.sub.1, --X.sub.2 and --X.sub.3 independently are --CH.sub.3 or --C.sub.2 H.sub.5 ; and --Y,--Y.sub.1,--Y.sub.2 and --Y.sub.3 are primary or secondary alkyl groups having 3 to 12 carbon atoms, provided that when m is greater than 0, r is 0 and that when L is greater than 0, r and s are 0, are disclosed. These polyimides are very soluble, even in weak solvents such as toluene.
    Type: Grant
    Filed: April 13, 1988
    Date of Patent: June 19, 1990
    Assignee: E. I. DuPont de Nemours and Company
    Inventor: Richard A. Hayes
  • Patent number: 4931540
    Abstract: This invention relates to new fluorine-containing polyimides, polyamide-acids/esters, polyamides, addition polyimides and imide oligomers which exhibit low melting points, better solubilities, low dielectric constants, superior thermal and thermal oxidative stability, and improved processing characteristics.The products of this invention are characterized by the fact that they are derived from 4,4'-bis[2-(3,4-(dicarboxyphenyl)hexafluoroisopropyl]diphenyl ether dianhydride.
    Type: Grant
    Filed: November 24, 1987
    Date of Patent: June 5, 1990
    Assignee: Hoechst Celanese Corporation
    Inventors: Werner H. Mueller, Dinesh N. Khanna, Rohitkumar H. Vora, Ruediger J. Erckel
  • Patent number: 4931530
    Abstract: There are disclosed a process for producing an aromatic (poly)etherketone or an aromatic (poly)ethersulfone having an ether group represented by the formula --Y--Ar--O--Ar--Y-- which process comprises reacting an aromatic halogen compound having at least one active halogen group represented by the formula --Y--Ar--X, where Y denotes a ketone group or a sulfone group; Ar denotes a phenylene group or a nuclear-substituted product thereof; and X denotes a halogen atom which is bonded at the ortho- or para-position relative to Y, with a specified salt of an alkali metal, and an aromatic polyetherketone polymer which has a repeating unit represented by formula (I) ##STR1## and which has a crystalline melting point not lower than 390.degree. C. and an intrinsic viscosity of 0.7 to 2.0 dl/g (sulfuric acid at 25.degree. C.).
    Type: Grant
    Filed: September 20, 1989
    Date of Patent: June 5, 1990
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Isaburo Fukawa, Tsuneaki Tanabe
  • Patent number: 4931539
    Abstract: Highly-soluble, fully-cyclized siloxane polyimides, which contain at least in part, polymerized units derived from 4,4'-[2,2,2-trifluoro-1-(trifluoromethyl) ethylidene]-bis(1,2-benzenedicarboxylic acid anhydride), (6FDA), are disclosed. The polymeric compositions, their preparation and film/coating products are described.
    Type: Grant
    Filed: March 6, 1989
    Date of Patent: June 5, 1990
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Richard A. Hayes
  • Patent number: 4929716
    Abstract: Disclosed are polyoxyalkylene polyimide polyester polymers that have utility as thermoplastic molding compositions, diacid monomers useful for making said polyester polymers and poly(oxy alkylene) polyimides. The latter two compounds have utility as hot melt adhesives.
    Type: Grant
    Filed: December 31, 1987
    Date of Patent: May 29, 1990
    Assignee: General Electric Company
    Inventors: John A. Tyrell, Russell J. McGready
  • Patent number: 4927903
    Abstract: The present invention relates to diphenol monoesters of carboxylic acids, a process for their preparation, their use for the preparation of polyester-carbonates, the polyester-carbonates obtainable according to the invention and flame-repellent moulding compositions containing these polyester-carbonates.
    Type: Grant
    Filed: May 9, 1986
    Date of Patent: May 22, 1990
    Assignee: Bayer Aktiengesellschaft
    Inventors: Manfred Schreckenberg, Rolf Dhein, Hans Rudolph, Nouvertne Werner
  • Patent number: 4925910
    Abstract: Copolycondensate molding materials are obtainable by polycondensation offrom 2 to 98 mol % of 2,2-di-(4'-hydroxyphenyl)-propane (A),from 2 to 98 mol % of 4,4'-dihydroxydiphenyl sulfone (B) andfrom 0 to 96 mol % of (C) ##STR1## where R.sup.1 and R.sup.2 are each H, C.sub.1 -C.sub.6 -alkyl or C.sub.1 -C.sub.6 -alkoxy, X is a chemical bond, --S--, --O--, --CO--, CR.sup.3 R.sup.4 (where R.sup.3 and R.sup.4 are different when n and p are each 0), or SO.sub.2 -- only when n or p is 0), R.sup.3 and R.sup.4 are each H, C.sub.1 -C.sub.6 -alkyl, C.sub.1 -C.sub.6 -alkoxy, aryl or halogen-substituted alkyl of 1 to 4 carbon atoms, m is 0 or 1, and n and p are each 0, 1, 2, 3, or 4,with from 1 to 100 mol % of (D) ##STR2## where R.sup.5 and R.sup.6 have the same meaning as R.sup.1 and R.sup.2, and v and w are each 0, 1, 2, 3 or 4, and from 0 to 99 mol % of (E) ##STR3## where R.sup.7 -R.sup.10 are each Cl or F or have the same meanings as R.sup.1 and R.sup.2, q is 0 or 1, r, s, t and n are each 0, 1, 2, 3 or 4, Z.sub.
    Type: Grant
    Filed: April 9, 1987
    Date of Patent: May 15, 1990
    Assignee: BASF Aktiengesellschaft
    Inventor: Gerhard Heinz
  • Patent number: 4925916
    Abstract: Described herein are amide and/or imide containing polymers based on novel monomers that contain isoalkylidene bridges. These polymers have excellent toughness combined with high temperature stability, low water absorption, and good melt-fabricability.
    Type: Grant
    Filed: November 18, 1987
    Date of Patent: May 15, 1990
    Assignee: Amoco Corporation
    Inventors: James E. Harris, Abe Berger, Vilas M. Chopdekar, Markus Matzner, James Spanswick
  • Patent number: 4925915
    Abstract: This invention relates to new fluorine-containing polyimides, polyamide-acids/esters, polyamides, addition polyimides and imide oligomers which exhibit low melting points, better solubilities, low dielectric constants, superior thermal and thermal oxidative stability, and improved processing characteristics.The product of this invention are characterized by the fact that they are derived from 4,4'-bis[2-(amino(halo)phenoxyphenyl)-hexafluoroisopropyl]diphenyl ether.
    Type: Grant
    Filed: November 24, 1987
    Date of Patent: May 15, 1990
    Assignee: Hoechst Celanese Corp.
    Inventors: Werner H. Mueller, Dinesh N. Khanna, Rohitkumar H. Vora, Ruediger J. Erckel
  • Patent number: 4923960
    Abstract: The present invention provides novel heat stable polyamide-imide polymers having excellent flow properties which render them more readily processible into fibers, films, sheets and other molded articles. The polymers are prepared by forming the polycondensation product of one of more aromatic diamines, one or more trifunctional acid anhydride monomers, and one or more tetrafunctional aromatic dianhydrides, at least one of said monomers containing the groups ##STR1## linking two aromatic moieties, wherein R is CF.sub.3 or phenyl. In addition to improved flow properties, the polyamide-imide polymers of this invention also exhibit improved solubility properties in most organic solvents, improved resistance to attack by chlorinated solvents such as trichloroethylene as compared with polyimides, improved hydrophobic properties as well as excellent thermal properties including resistance to thermooxidative degradation.
    Type: Grant
    Filed: February 27, 1989
    Date of Patent: May 8, 1990
    Assignee: Hoechst Celanese Corp.
    Inventors: Paul N. Chen, Sr., Rohitkumar H. Vora
  • Patent number: 4923968
    Abstract: A crystalline polyimide polymer having a practical effectiveness that extrusion or injection molding which has so far been applied to thermoplastic resins, but could not have been achieved by conventional polyimides, are possible due to its melting point in the range of 300.degree. C. to 450.degree. C., and a process for producing the polymer, are provided, which polyimide polymer contains the following imide repetition unit (I) in 30% by mol based on the polymer and containing or not containing at least one of other imide repetition units and also having an inherent viscosity of 0.1 to 5 dl/g in conc. sulfuric acid at 30.+-.0.01.degree. C.: ##STR1## wherein X is divalent CO, divalent SO.sub.2 group, S, O or a single bond.
    Type: Grant
    Filed: July 11, 1988
    Date of Patent: May 8, 1990
    Assignee: Chisso Corporation
    Inventors: Kouichi Kunimune, Kazutsune Kikuta, Takao Kawamoto, Shiro Konotsune
  • Patent number: 4923954
    Abstract: Described is a process for producing, in particulate form, aromatic polyimides based on one or more 2,2-bis[4-(aminophenoxy)phenyl]hexafluoropropanes. The process involves forming a solution of an equimolar mixture of (1) an aromatic tetracarboxylic dianhydride and (2) a 2,2-bis[4-(aminophenoxy)phenyl]hexafluoropropane as the sole or predominant aromatic diamine in (3) a solvent composed of (i) tetrahydrofuran, or (ii) one or more alkyltetrahydrofurans having a normal boiling point below 100.degree. C., or (iii) a mixture of (i) and (ii), and heating and agitating such solution in a closed reaction system under super-atmospheric pressure such that a separate phase of particulate aromatic polyimide is formed. The process avoids difficulties caused by the tendency of the wet polyimide polymer to agglomerate into stringy or tacky masses which can foul reactor and agitator surfaces.
    Type: Grant
    Filed: December 23, 1988
    Date of Patent: May 8, 1990
    Assignee: Ethyl Corporation
    Inventors: W. Dirk Klobucar, Adam Nugent, Jr., Ronald C. Zumstein
  • Patent number: 4920193
    Abstract: An asymmetric membrane formed from a sulphonated polyarylethersulphone has a salt rejection of at least 99%. Alternatively, a membrane has a good salt rejection and an acceptable water flux such that the ratio ##EQU1## has the value of at least 0.7. The membranes can be obtained using barium salts of the sulphonated polyarylethersulphone, with the proportion of barium being controlled to be at least 85%, preferably at least 86%, and not more than 91%, preferably not more than 90% of the barium required to react with the sulphonic acid groups on the sulphonated polymer.
    Type: Grant
    Filed: July 19, 1988
    Date of Patent: April 24, 1990
    Assignee: Imperial Chemical Industries PLC
    Inventors: Richard A. Hann, David R. Holmes, John W. Smith
  • Patent number: 4918153
    Abstract: The present invention relates to a copoly(imidineamide) consisting of a copolymer of polyamidines and polyimides having, in the basic chain structure of the polymer, imidine structures represented by formula [I] and the amide structures represented by formula [II]: ##STR1## The copoly(imidine-amide) of the present invention is a polymeric material of excellent heat resistance and processability useful for a wide range of industrial applications.
    Type: Grant
    Filed: March 14, 1989
    Date of Patent: April 17, 1990
    Inventors: Patrick E. Cassidy, James M. Farley, Maryanne Mores