Patents Examined by M. Shulman
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Patent number: 6070427Abstract: A shipping and storage system for exothermic materials where the risk of reaching unacceptably high temperatures is alleviated comprising,a) a container vessel,b) a heat sink material inside the vessel and adapted to hold and be in intimate contact with one or more packages of exothermic material, the heat sink material having an effective high heat capacity and latent heat of melting and/or vaporization such that it absorbs all of the energy produced by the exothermic material, if it reacts by reaching its reaction initiation temperature, andc) optional cooling means in the vessel and surrounding the heat sink material and packaged exothermic material.Type: GrantFiled: October 10, 1997Date of Patent: June 6, 2000Assignee: National Starch and Chemical Investment Holding CorporationInventors: Brett M. Fine, Bruce E. Kurtz
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Patent number: 6053003Abstract: Defrost water evaporating apparatus for a refrigerator. The apparatus has a plurality of bottom walls for separating a lower space from a refrigerating compartment, a base pan assembled to an underside of the refrigerator, a partition integrally formed at the base pan for partitioning the lower space into first and second space, a drain tube for guiding a defrost water into the first space, a condenser fixing structure for making the defrost water directly contact with a condenser, thereby evaporating the defrost water by a heat exchange with the condenser. The fixing structure has a couple of condenser fixing portions and an extending portion for increasing an actual heat exchange area of the condenser.Type: GrantFiled: July 16, 1998Date of Patent: April 25, 2000Assignee: Daewoo Electronics Co., Ltd.Inventors: Joon-Ho Song, Woo-Yeub Choi
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Patent number: 6009721Abstract: An absorption refrigerator is minimized in the size and the weight. A sensible heat exchanger 14 and a cooling fan 19 for cooling the sensible heat exchanger 14 are mounted front and rear opposite to each other to form a cooling unit. At one side of the fan 19, a regenerator 3 and a rectifier 6 are aligned vertically one over the other. At the other side of the fan 19, an evaporator 1 and an absorber 2 of a rectangular configuration are provided side by side. A condenser 9 is laid above the cooling unit. The cooling unit, the evaporator 1, the absorber 2, the condenser 9, the regenerator 3, the rectifier 6, and a set of pumps P1 to P4 all are installed in a main housing 20 of substantially a rectangular parallelopiped shape having a depth reduced axially of the cooling fan 19.Type: GrantFiled: August 24, 1998Date of Patent: January 4, 2000Assignee: Honda Giken Kogyo Kabushiki KaishaInventors: Toru Fukuda, Toshimitsu Takaishi, Mitsuru Ishikawa
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Patent number: 5987910Abstract: An insulated freight-transport container has a pair of longitudinally extending and parallel side walls, a top wall bridging the side walls, a front end wall bridging the side walls and connected to the top wall, and a rear end wall formed by a sill and a lintel attached to the top wall and defining a door opening therewith. A pair of doors are engageable with the opening to close same and a floor is formed of upper and lower skins and a body of insulation therebetween. The floor extends horizontally longitudinally from the door sill to the front end wall and bridges the two side walls. It is recessed below an upper edge of the door sill. A plurality of longitudinally extending rails fixed to the top door skin define a plurality of longitudinally extending air-conducting passage and have an upper surface level with the upper edge of the door sill.Type: GrantFiled: December 2, 1997Date of Patent: November 23, 1999Assignee: Waggonbau Elze GmbH & Co. Besitz KGInventors: Horst Kothe, Wolfgang Graaff
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Patent number: 5943880Abstract: A refrigerant is directly contacted to a substrate to be processed that was heated so as to quickly cool the substrate. Thus, the temperature of the substrate is dropped to a predetermined temperature level. The substrate is cooled by a cooling device and cooling water. Thus, the cooling temperature can be accurately controlled. In addition, the substrate can be effectively cooled.Type: GrantFiled: February 13, 1998Date of Patent: August 31, 1999Assignee: Tokyo Electron LimitedInventor: Kiyohisa Tateyama