Patents Examined by M. Shulman
  • Patent number: 6053003
    Abstract: Defrost water evaporating apparatus for a refrigerator. The apparatus has a plurality of bottom walls for separating a lower space from a refrigerating compartment, a base pan assembled to an underside of the refrigerator, a partition integrally formed at the base pan for partitioning the lower space into first and second space, a drain tube for guiding a defrost water into the first space, a condenser fixing structure for making the defrost water directly contact with a condenser, thereby evaporating the defrost water by a heat exchange with the condenser. The fixing structure has a couple of condenser fixing portions and an extending portion for increasing an actual heat exchange area of the condenser.
    Type: Grant
    Filed: July 16, 1998
    Date of Patent: April 25, 2000
    Assignee: Daewoo Electronics Co., Ltd.
    Inventors: Joon-Ho Song, Woo-Yeub Choi
  • Patent number: 6009721
    Abstract: An absorption refrigerator is minimized in the size and the weight. A sensible heat exchanger 14 and a cooling fan 19 for cooling the sensible heat exchanger 14 are mounted front and rear opposite to each other to form a cooling unit. At one side of the fan 19, a regenerator 3 and a rectifier 6 are aligned vertically one over the other. At the other side of the fan 19, an evaporator 1 and an absorber 2 of a rectangular configuration are provided side by side. A condenser 9 is laid above the cooling unit. The cooling unit, the evaporator 1, the absorber 2, the condenser 9, the regenerator 3, the rectifier 6, and a set of pumps P1 to P4 all are installed in a main housing 20 of substantially a rectangular parallelopiped shape having a depth reduced axially of the cooling fan 19.
    Type: Grant
    Filed: August 24, 1998
    Date of Patent: January 4, 2000
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Toru Fukuda, Toshimitsu Takaishi, Mitsuru Ishikawa
  • Patent number: 5943880
    Abstract: A refrigerant is directly contacted to a substrate to be processed that was heated so as to quickly cool the substrate. Thus, the temperature of the substrate is dropped to a predetermined temperature level. The substrate is cooled by a cooling device and cooling water. Thus, the cooling temperature can be accurately controlled. In addition, the substrate can be effectively cooled.
    Type: Grant
    Filed: February 13, 1998
    Date of Patent: August 31, 1999
    Assignee: Tokyo Electron Limited
    Inventor: Kiyohisa Tateyama