Abstract: An EMI shielding enclosure, for an electronic assembly, comprising a ground plane of a printed circuit connected to a shaped EMI shielding cover. The cover results from thermoforming a composite sheet of several layers, including a carrier for a fibrous metal mat that has fibers substantially surrounded by a fiber-coat. Connection of the cover to the ground plane, to form the EMI shielding enclosure, requires the fiber-coat to adhere to the printed circuit in the vicinity of the ground plane.
Type:
Grant
Filed:
May 1, 1998
Date of Patent:
July 18, 2000
Assignee:
3M Innovative Properties Company
Inventors:
Donald M. Yenni, Jr., Jose P. de Souza, Mark G. Baker