Patents Examined by Mae Shulman.
  • Multistage thermoelectric cooling device
    Patent number: 5966939
    Abstract: A multiple thermoelectric cooling device in which both ends of thermoelectric elements in first and second cooling units are soldered to the corresponding electrodes. In the first cooling unit, the melting point of a solder for soldering is higher, while in the second cooling unit the melting point of another solder for soldering is lower. Thus, in case soldering is performed in the second cooling unit with the same placed on the first cooling unit, the soldered connection in the first cooling unit will not be remelted.
    Type: Grant
    Filed: March 2, 1998
    Date of Patent: October 19, 1999
    Assignee: Aisin Seiki Kabushiki Kaisha
    Inventor: Hitoshi Tauchi