Patents Examined by Malcolm Barnes
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Patent number: 12683062Abstract: An inductor device includes a first wire and a second wire. The first wire includes a first sub-wire and a second sub-wire. The first sub-wire is disposed in a first area. The second sub-wire is disposed in a second area, and the first sub-wire and the second sub-wire are located on different layers. The second wire includes a third sub-wire and a fourth sub-wire. The third sub-wire is disposed in the second area, and located below the second sub-wire. The fourth sub-wire is disposed in the first area, the third sub-wire and the fourth sub-wire are located on different layers, and the fourth sub-wire is located above the first sub-wire.Type: GrantFiled: June 7, 2022Date of Patent: July 14, 2026Assignee: Realtek Semiconductor CorporationInventors: Chieh-Pin Chang, Cheng-Wei Luo
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Patent number: 12683060Abstract: This wound core is a wound core including a wound core main body obtained by stacking a plurality of polygonal annular grain-oriented electrical steel sheets in a side view, and the grain-oriented electrical steel sheet has planar portions and bent portions that are alternately continuous in a longitudinal direction, and in at least one bent portion, the crystal grain size Dpx (mm) of the grain-oriented electrical steel sheet is FL/4 or more. Here, FL the an average length (mm) of the planar portions.Type: GrantFiled: October 26, 2021Date of Patent: July 14, 2026Assignee: NIPPON STEEL CORPORATIONInventors: Yusuke Kawamura, Takahito Mizumura
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Patent number: 12683068Abstract: A coil device includes a bobbin, a main core, and wires. A connection portion located between a first bobbin flange portion and a second bobbin flange portion includes a raised portion protruding along a direction perpendicular to a first axis more than the connection portion located between a first terminal block and a first bobbin flange portion. Communication wire portions connecting first wires of a proximal first coil and first wires of a distal first coil are arranged in a wiring space formed between second wires wound in contact with an upper end of the raised portion and an outer surface of the winding core portion or the bobbin.Type: GrantFiled: March 27, 2023Date of Patent: July 14, 2026Assignees: TDK CORPORATION, TDK XIAMEN CO., LTD.Inventors: Hiroshi Maeda, Shoichi Tani, Takahiro Hirai, Xiao Jie, Danling Luo, Xuesong Guo
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Patent number: 12671025Abstract: A coil component including: a body; a coil portion including first and second lead-out terminals and disposed in the body; an insulating film disposed between the coil portion and the body and containing a thermosetting resin having a vinyl group; and an external electrode portion disposed on the body and connected to each of the first and second lead-out terminals of the coil portion.Type: GrantFiled: April 27, 2022Date of Patent: June 30, 2026Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan Yang, Yoon Mi Cha, Mi Geum Kim, Tai Yon Cho, Byeong Cheol Moon
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Patent number: 12665113Abstract: An inductor includes: a magnetic core; a coil element including a coil portion and a drawn portion; an electrode member located on a side surface and a bottom surface; and a connection portion connecting the drawn portion and the electrode member. The electrode member includes a bottom plate portion located along the bottom surface, a side plate portion located along the side surface, and a first protruding plate portion connected to the side plate portion and protruding in a direction away from the side surface. The drawn portion extends along the side plate portion or the side surface. The first protruding plate portion includes an edge in contact with the drawn portion in an extending direction of the drawn portion. The connection portion includes a first connection portion in which the drawn portion and the edge of the first protruding plate portion are welded together.Type: GrantFiled: October 15, 2021Date of Patent: June 23, 2026Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventor: Mutsuyasu Otsubo
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Patent number: 12658820Abstract: A power supply module includes a power supply submodule, a plurality of pins, and a second winding unit. The power supply submodule includes a switch, a magnetic core assembly, and a first winding unit including a first winding portion and a second winding portion. The second winding unit includes a third winding portion connected to the first winding portion via some of the plurality of pins to form a first winding, and a fourth winding portion connected to the second winding portion via some of the plurality of pins to form a second winding. The magnetic core assembly, at least the first winding, and the second winding form a magnetic element. The switch is disposed on and electrically connected to the magnetic element. At least one of the plurality of pins is an output pin via which the power supply module powers an intelligent IC load.Type: GrantFiled: May 23, 2022Date of Patent: June 16, 2026Assignee: Delta Electronics (Shanghai) Co., Ltd.Inventors: Pengkai Ji, Yuan Zhou
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Patent number: 12646650Abstract: An instrument transformer for high current and/or high voltage conversion includes a housing and at least an active part, which is electrically insulated by an isolation material. The isolation material includes or is a paste and/or pulp. A method for producing the instrument transformer includes the filling of a housing of the instrument transformer with paste and/or pulp, particularly with paste and/or pulp including paper material and/or cellulose, solved in a solvent, particularly at least one ionic liquid.Type: GrantFiled: June 12, 2020Date of Patent: June 2, 2026Assignee: HSP Hochspannungsgeräte GMBHInventor: Fabrizio Negri
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Patent number: 12640299Abstract: An electronic component, such as, for example, a transformer, includes a core, a first wire, and a second wire. The first wire is wound at least in part about at least a portion of the core in a first winding. The second wire is wound at least in part about at least a portion of the core in a second winding such that the first winding and the second winding alternate at least in part along at least a portion of the core. The electronic component includes windings that are intertwined about the core to form an intertwined spiral winding. Such a configuration can both improve electrical characteristics of the electronic component while reducing a height of the electronic component. Further, methods of manufacturing such components and customizing same are disclosed.Type: GrantFiled: January 13, 2023Date of Patent: May 26, 2026Assignee: Coilcraft, IncorporatedInventors: Andrew Klesyk, Lawrence B. Lestarge, Scott Hess, Hyeonchul Park
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Patent number: 12640305Abstract: A coil component includes a coil part having a structure in which interlayer insulating films 51 to 55 and coil patterns CP1 to CP4 are alternately stacked in the coil axis direction and magnetic element bodies M1 to M4 embedding therein the coil part. A radial width of a part of the interlayer insulating film that is positioned between the magnetic element body M1 positioned in the inner diameter area of the coil part and the innermost turn of the coil pattern CP4 is larger than radial widths L11, L21, and L31 of parts of the interlayer insulating films 52 to 54 that are positioned between the magnetic element body M1 and the innermost turns of the coil patterns CP1 to CP3.Type: GrantFiled: September 7, 2021Date of Patent: May 26, 2026Assignee: TDK CorporationInventors: Masanori Suzuki, Nobuya Takahashi, Akira Motohashi, Naoaki Fujii, Masaki Yoneyama, Tomonaga Nishikawa
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Patent number: 12640304Abstract: To prevent a short-circuit failure by controlling the flow of a solder in a surface-mount type coil component. A coil component includes a coil part in which conductor layers and interlayer insulating layers are alternately stacked. The conductor layers respectively have coil conductor patterns embedded in the coil part and electrode patterns exposed from the coil part. The interlayer insulating layers each protrude from the plurality of electrode patterns at a part between the electrode patterns, and the flow of a solder in the stacking direction is suppressed by the protruding parts. This makes it possible to prevent a short-circuit failure due to the flow of a solder in the stacking direction.Type: GrantFiled: September 7, 2021Date of Patent: May 26, 2026Assignee: TDK CorporationInventors: Yuuichi Kawaguchi, Naoaki Fujii, Tomonaga Nishikawa
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Patent number: 12640302Abstract: Structures, devices, and methods for wireless power transfer systems are described. A structure can include a plurality of strands arranged into a first coil layer and a second coil layer. The plurality of strands can be formed on a parallel path surrounding a center of the structure. The plurality of strands can extend away from the center on the first coil layer. The plurality of strands can extend towards the center on the second coil layer. For every fixed interval along a length of the structure, a first strand among the plurality of strands can be looped from the first coil layer to the second coil layer and a second strand among the plurality of strands can be looped from the second coil layer to the first coil layer.Type: GrantFiled: February 3, 2023Date of Patent: May 26, 2026Assignee: Renesas Electronics America Inc.Inventors: Sheng Yuan, Shangfeng Jiang, Weiwei Zhou, Jiangjian Huang, Bo Tang
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Patent number: 12633446Abstract: A wrapping post (10) for connection to a coil body of an electromagnetic coil, the wrapping post (10) having a rod-shaped post body (11) formed from a wire part and has a polygonal cross section or circular cross section, and the post body (11) being provided with a row arrangement (15) of surface elements on its surface (13, 14) in the longitudinal direction (16), the surface elements extending transversely to the longitudinal direction (16) and being at least partly formed as recesses (17), the recesses (17) only extending over a partial circumference of the post body (11) in the circumferential direction, the recesses (17) extending in the circumferential direction between adjacent longitudinal edges (18, 19) of the polygonal cross section in such a manner that the recesses (17) are spaced apart from the longitudinal edges (18, 19) or extend over a partial circumference of the circular cross section.Type: GrantFiled: August 4, 2021Date of Patent: May 19, 2026Assignee: BERKENHOFF GMBHInventors: Waldemar Schroeder, Ivo Zunke
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Patent number: 12633449Abstract: Disclosed herein is a chip-type coil component that includes a magnetic element body, a coil pattern embedded in the magnetic element body, and a terminal electrode connected to the coil pattern and exposed to a mounting surface of the magnetic element body. A recessed part obtained by removing a part of the magnetic element body is formed in an upper surface of the magnetic element body positioned on a side opposite the mounting surface to function as a directional mark.Type: GrantFiled: November 16, 2022Date of Patent: May 19, 2026Assignee: TDK CorporationInventors: Yuuichi Kawaguchi, Masanori Suzuki, Tomonaga Nishikawa, Mitsuo Natori, Osamu Nakada
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Patent number: 12626855Abstract: In the coil component, the external terminal and the metal magnetic powder-containing resin constituting the element body are not in direct contact with each other, and thus high ESD resistance is obtained. That is, even when a high transient voltage is applied between the pair of external terminals, insulation breakdown is less likely to occur, and an improvement in breakdown voltage with respect to the transient voltage can be realized.Type: GrantFiled: October 12, 2022Date of Patent: May 12, 2026Assignee: TDK CORPORATIONInventors: Shota Otsuka, Takashi Kudo, Kyohei Tonoyama, Taiji Matsui, Ken Satoh, Miyuki Asai
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Patent number: 12609229Abstract: The element body includes a main surface, and a side surface located on imaginary planes orthogonal to the main surface. The external electrode includes first, second and third electrode portions. The first electrode portion is exposed at the main surface. The second electrode portion is continuous with the first electrode portion and exposed at the main surface. The second electrode portion is located to extend from the first electrode portion to the imaginary planes when viewed in a direction orthogonal to the main surface. The third electrode portion is continuous with the first electrode portion and is separated from the second electrode portion in the direction orthogonal to the main surface. The third electrode portion includes outer edges coinciding with the imaginary planes when viewed in the direction orthogonal to the main surface. The element body includes a part between the second electrode portion and the third electrode portion.Type: GrantFiled: October 12, 2022Date of Patent: April 21, 2026Assignee: TDK CORPORATIONInventors: Youichi Kazuta, Junichiro Urabe, Toshinori Matsuura, Noriaki Hamachi, Yuichi Takubo, Yuto Shiga, Kazuya Tobita
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Patent number: 12609230Abstract: The present disclosure provides a semiconductor structure and a fabrication method thereof. The semiconductor structure includes: a base, wherein the base is provided with a first surface and a second surface that are opposite to each other; a magnetic core, wherein the magnetic core is located in the base, and an orthographic projection of the magnetic core on the first surface is a closed ring pattern; a dielectric layer, wherein the dielectric layer is located on the second surface; and a solenoid-shaped metal layer, wherein the metal layer is located in the base and the dielectric layer and is wound around the magnetic core; the metal layer is an integrated structure; the metal layer and the magnetic core are spaced apart from each other; part of the metal layer is exposed on the first surface.Type: GrantFiled: May 6, 2022Date of Patent: April 21, 2026Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.Inventor: Tong Wu
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Patent number: 12609235Abstract: The mainline pattern and the pair of bypass patterns in the multilayer inductor can be regarded as three inductors connected in parallel in the element body. That is, in the multilayer inductor, paralleling of the inductance is realized in the element body by the mainline pattern and the pair of bypass patterns. Therefore, the inductance value of the multilayer inductor as a whole can be reduced.Type: GrantFiled: March 22, 2023Date of Patent: April 21, 2026Assignee: TDK CORPORATIONInventors: Noriaki Hamachi, Toshinori Matsuura, Junichiro Urabe, Kazuya Tobita, Yuto Shiga, Youichi Kazuta, Yuichi Takubo, Shunya Suzuki, Xuran Guo, So Kobayashi
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Patent number: 12603216Abstract: A coil component includes an element assembly including a coil conductor formed by winding a conductor coated with an electrically insulating film and a magnetic portion containing metal magnetic particles and resin, and an outer electrode electrically connected to an exposed surface, exposed on a surface of the element assembly, of an extended part of the coil conductor and disposed on a surface of the element assembly. The metal magnetic particles include first and second metal magnetic particles. A particle size distribution of the magnetic particles, calculated in accordance with a circle equivalent diameter obtained from a cross-sectional image in a cross section of the magnetic portion, has at least two peaks and at least one bottom. The first magnetic particles are larger than or equal to the bottom having a minimum frequency, and the second metal magnetic particles are smaller than the bottom having the minimum frequency.Type: GrantFiled: March 24, 2023Date of Patent: April 14, 2026Assignee: Murata Manufacturing Co., Ltd.Inventor: Keiichi Ishida
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Patent number: 12603219Abstract: A coil component includes a body, a substrate, a first coil, a second coil, a plurality of conductive vias connecting an innermost turn of the first coil and an innermost turn of the second coil to each other, a first external electrode connected to one end of the first coil, and a second external electrode connected to one end of the second coil, wherein the innermost turn of the first coil includes a first region having a line width, narrower than a line width of an adjacent outer turn, and the innermost turn of the second coil includes a second region having a line width, narrower than a line width of an adjacent outer turn, and at least one of the plurality of conductive vias is connected to the first region, and at least one of the other conductive vias is connected to the second region.Type: GrantFiled: December 28, 2022Date of Patent: April 14, 2026Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byeong Cheol Moon, Han Lee, Boum Seock Kim, Sang Jin Kim
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Patent number: 12597549Abstract: A winding assembly for a transformer device includes a first and second coil with a plurality of windings, and a first set and a second set of thermally conductive plates. The first and second coils include a plurality of interleaved sets of turns. The plates of the first and second sets of the thermally conductive plates are interleaved with the sets of turns of the first and second coils respectively, and are disposed adjacent to one of the sets of turns of the first and second coils respectively, to transfer heat away from the coils. The first and second coils and the first and second sets of thermally conductive plates are encased in the resin dielectric material.Type: GrantFiled: March 9, 2023Date of Patent: April 7, 2026Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Kapila Warnakulasuriya