Patents Examined by Malcolm Barnes
  • Patent number: 12646650
    Abstract: An instrument transformer for high current and/or high voltage conversion includes a housing and at least an active part, which is electrically insulated by an isolation material. The isolation material includes or is a paste and/or pulp. A method for producing the instrument transformer includes the filling of a housing of the instrument transformer with paste and/or pulp, particularly with paste and/or pulp including paper material and/or cellulose, solved in a solvent, particularly at least one ionic liquid.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: June 2, 2026
    Assignee: HSP Hochspannungsgeräte GMBH
    Inventor: Fabrizio Negri
  • Patent number: 12640299
    Abstract: An electronic component, such as, for example, a transformer, includes a core, a first wire, and a second wire. The first wire is wound at least in part about at least a portion of the core in a first winding. The second wire is wound at least in part about at least a portion of the core in a second winding such that the first winding and the second winding alternate at least in part along at least a portion of the core. The electronic component includes windings that are intertwined about the core to form an intertwined spiral winding. Such a configuration can both improve electrical characteristics of the electronic component while reducing a height of the electronic component. Further, methods of manufacturing such components and customizing same are disclosed.
    Type: Grant
    Filed: January 13, 2023
    Date of Patent: May 26, 2026
    Assignee: Coilcraft, Incorporated
    Inventors: Andrew Klesyk, Lawrence B. Lestarge, Scott Hess, Hyeonchul Park
  • Patent number: 12640305
    Abstract: A coil component includes a coil part having a structure in which interlayer insulating films 51 to 55 and coil patterns CP1 to CP4 are alternately stacked in the coil axis direction and magnetic element bodies M1 to M4 embedding therein the coil part. A radial width of a part of the interlayer insulating film that is positioned between the magnetic element body M1 positioned in the inner diameter area of the coil part and the innermost turn of the coil pattern CP4 is larger than radial widths L11, L21, and L31 of parts of the interlayer insulating films 52 to 54 that are positioned between the magnetic element body M1 and the innermost turns of the coil patterns CP1 to CP3.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: May 26, 2026
    Assignee: TDK Corporation
    Inventors: Masanori Suzuki, Nobuya Takahashi, Akira Motohashi, Naoaki Fujii, Masaki Yoneyama, Tomonaga Nishikawa
  • Patent number: 12640304
    Abstract: To prevent a short-circuit failure by controlling the flow of a solder in a surface-mount type coil component. A coil component includes a coil part in which conductor layers and interlayer insulating layers are alternately stacked. The conductor layers respectively have coil conductor patterns embedded in the coil part and electrode patterns exposed from the coil part. The interlayer insulating layers each protrude from the plurality of electrode patterns at a part between the electrode patterns, and the flow of a solder in the stacking direction is suppressed by the protruding parts. This makes it possible to prevent a short-circuit failure due to the flow of a solder in the stacking direction.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: May 26, 2026
    Assignee: TDK Corporation
    Inventors: Yuuichi Kawaguchi, Naoaki Fujii, Tomonaga Nishikawa
  • Patent number: 12640302
    Abstract: Structures, devices, and methods for wireless power transfer systems are described. A structure can include a plurality of strands arranged into a first coil layer and a second coil layer. The plurality of strands can be formed on a parallel path surrounding a center of the structure. The plurality of strands can extend away from the center on the first coil layer. The plurality of strands can extend towards the center on the second coil layer. For every fixed interval along a length of the structure, a first strand among the plurality of strands can be looped from the first coil layer to the second coil layer and a second strand among the plurality of strands can be looped from the second coil layer to the first coil layer.
    Type: Grant
    Filed: February 3, 2023
    Date of Patent: May 26, 2026
    Assignee: Renesas Electronics America Inc.
    Inventors: Sheng Yuan, Shangfeng Jiang, Weiwei Zhou, Jiangjian Huang, Bo Tang
  • Patent number: 12633446
    Abstract: A wrapping post (10) for connection to a coil body of an electromagnetic coil, the wrapping post (10) having a rod-shaped post body (11) formed from a wire part and has a polygonal cross section or circular cross section, and the post body (11) being provided with a row arrangement (15) of surface elements on its surface (13, 14) in the longitudinal direction (16), the surface elements extending transversely to the longitudinal direction (16) and being at least partly formed as recesses (17), the recesses (17) only extending over a partial circumference of the post body (11) in the circumferential direction, the recesses (17) extending in the circumferential direction between adjacent longitudinal edges (18, 19) of the polygonal cross section in such a manner that the recesses (17) are spaced apart from the longitudinal edges (18, 19) or extend over a partial circumference of the circular cross section.
    Type: Grant
    Filed: August 4, 2021
    Date of Patent: May 19, 2026
    Assignee: BERKENHOFF GMBH
    Inventors: Waldemar Schroeder, Ivo Zunke
  • Patent number: 12633449
    Abstract: Disclosed herein is a chip-type coil component that includes a magnetic element body, a coil pattern embedded in the magnetic element body, and a terminal electrode connected to the coil pattern and exposed to a mounting surface of the magnetic element body. A recessed part obtained by removing a part of the magnetic element body is formed in an upper surface of the magnetic element body positioned on a side opposite the mounting surface to function as a directional mark.
    Type: Grant
    Filed: November 16, 2022
    Date of Patent: May 19, 2026
    Assignee: TDK Corporation
    Inventors: Yuuichi Kawaguchi, Masanori Suzuki, Tomonaga Nishikawa, Mitsuo Natori, Osamu Nakada
  • Patent number: 12626855
    Abstract: In the coil component, the external terminal and the metal magnetic powder-containing resin constituting the element body are not in direct contact with each other, and thus high ESD resistance is obtained. That is, even when a high transient voltage is applied between the pair of external terminals, insulation breakdown is less likely to occur, and an improvement in breakdown voltage with respect to the transient voltage can be realized.
    Type: Grant
    Filed: October 12, 2022
    Date of Patent: May 12, 2026
    Assignee: TDK CORPORATION
    Inventors: Shota Otsuka, Takashi Kudo, Kyohei Tonoyama, Taiji Matsui, Ken Satoh, Miyuki Asai
  • Patent number: 12609229
    Abstract: The element body includes a main surface, and a side surface located on imaginary planes orthogonal to the main surface. The external electrode includes first, second and third electrode portions. The first electrode portion is exposed at the main surface. The second electrode portion is continuous with the first electrode portion and exposed at the main surface. The second electrode portion is located to extend from the first electrode portion to the imaginary planes when viewed in a direction orthogonal to the main surface. The third electrode portion is continuous with the first electrode portion and is separated from the second electrode portion in the direction orthogonal to the main surface. The third electrode portion includes outer edges coinciding with the imaginary planes when viewed in the direction orthogonal to the main surface. The element body includes a part between the second electrode portion and the third electrode portion.
    Type: Grant
    Filed: October 12, 2022
    Date of Patent: April 21, 2026
    Assignee: TDK CORPORATION
    Inventors: Youichi Kazuta, Junichiro Urabe, Toshinori Matsuura, Noriaki Hamachi, Yuichi Takubo, Yuto Shiga, Kazuya Tobita
  • Patent number: 12609230
    Abstract: The present disclosure provides a semiconductor structure and a fabrication method thereof. The semiconductor structure includes: a base, wherein the base is provided with a first surface and a second surface that are opposite to each other; a magnetic core, wherein the magnetic core is located in the base, and an orthographic projection of the magnetic core on the first surface is a closed ring pattern; a dielectric layer, wherein the dielectric layer is located on the second surface; and a solenoid-shaped metal layer, wherein the metal layer is located in the base and the dielectric layer and is wound around the magnetic core; the metal layer is an integrated structure; the metal layer and the magnetic core are spaced apart from each other; part of the metal layer is exposed on the first surface.
    Type: Grant
    Filed: May 6, 2022
    Date of Patent: April 21, 2026
    Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventor: Tong Wu
  • Patent number: 12609235
    Abstract: The mainline pattern and the pair of bypass patterns in the multilayer inductor can be regarded as three inductors connected in parallel in the element body. That is, in the multilayer inductor, paralleling of the inductance is realized in the element body by the mainline pattern and the pair of bypass patterns. Therefore, the inductance value of the multilayer inductor as a whole can be reduced.
    Type: Grant
    Filed: March 22, 2023
    Date of Patent: April 21, 2026
    Assignee: TDK CORPORATION
    Inventors: Noriaki Hamachi, Toshinori Matsuura, Junichiro Urabe, Kazuya Tobita, Yuto Shiga, Youichi Kazuta, Yuichi Takubo, Shunya Suzuki, Xuran Guo, So Kobayashi
  • Patent number: 12603216
    Abstract: A coil component includes an element assembly including a coil conductor formed by winding a conductor coated with an electrically insulating film and a magnetic portion containing metal magnetic particles and resin, and an outer electrode electrically connected to an exposed surface, exposed on a surface of the element assembly, of an extended part of the coil conductor and disposed on a surface of the element assembly. The metal magnetic particles include first and second metal magnetic particles. A particle size distribution of the magnetic particles, calculated in accordance with a circle equivalent diameter obtained from a cross-sectional image in a cross section of the magnetic portion, has at least two peaks and at least one bottom. The first magnetic particles are larger than or equal to the bottom having a minimum frequency, and the second metal magnetic particles are smaller than the bottom having the minimum frequency.
    Type: Grant
    Filed: March 24, 2023
    Date of Patent: April 14, 2026
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Keiichi Ishida
  • Patent number: 12603219
    Abstract: A coil component includes a body, a substrate, a first coil, a second coil, a plurality of conductive vias connecting an innermost turn of the first coil and an innermost turn of the second coil to each other, a first external electrode connected to one end of the first coil, and a second external electrode connected to one end of the second coil, wherein the innermost turn of the first coil includes a first region having a line width, narrower than a line width of an adjacent outer turn, and the innermost turn of the second coil includes a second region having a line width, narrower than a line width of an adjacent outer turn, and at least one of the plurality of conductive vias is connected to the first region, and at least one of the other conductive vias is connected to the second region.
    Type: Grant
    Filed: December 28, 2022
    Date of Patent: April 14, 2026
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byeong Cheol Moon, Han Lee, Boum Seock Kim, Sang Jin Kim
  • Patent number: 12597549
    Abstract: A winding assembly for a transformer device includes a first and second coil with a plurality of windings, and a first set and a second set of thermally conductive plates. The first and second coils include a plurality of interleaved sets of turns. The plates of the first and second sets of the thermally conductive plates are interleaved with the sets of turns of the first and second coils respectively, and are disposed adjacent to one of the sets of turns of the first and second coils respectively, to transfer heat away from the coils. The first and second coils and the first and second sets of thermally conductive plates are encased in the resin dielectric material.
    Type: Grant
    Filed: March 9, 2023
    Date of Patent: April 7, 2026
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kapila Warnakulasuriya
  • Patent number: 12592334
    Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a package with integrated inductors. In selected examples, the package includes a core layer having a core thickness and through holes. The package further includes inductor structures within the through holes, such that an inductor structure has a length exceeding the core thickness.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: March 31, 2026
    Assignee: Intel Corporation
    Inventors: Numair Ahmed, Kyu Oh Lee, Sri Chaitra Jyotsna Chavali, Vijaya Boddu, Krishna Bharath, Robert L. Sankman
  • Patent number: 12586714
    Abstract: An inductor component is capable of suppressing formation of a leak path between vertical wires. Such an inductor component includes an element body that includes a plurality of magnetic powders, at least one of which contains an Fe element as a main component, and has a first principal surface and a second principal surface; an inductor wire that is provided in the element body and extends along a plane parallel to the first principal surface; a vertical wire that is provided in the element body, is connected to an end of the inductor wire, and extends to the first principal surface in a direction orthogonal to the first principal surface; and a conductive protection film that covers at least a part of a side surface of the vertical wire extending along a direction orthogonal to the first principal surface and has a higher hardness than the vertical wire.
    Type: Grant
    Filed: October 13, 2022
    Date of Patent: March 24, 2026
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yoshimasa Yoshioka
  • Patent number: 12586711
    Abstract: A coil component includes: a body including a molded portion having one surface and the other surface opposing each other, and a cover portion disposed on the one surface of the molded portion; a wound coil disposed between the molded portion and the cover portion in the body, and having first and second lead-out portions extending to one surface of the body; a first recess portion disposed in the one surface of the body; a first external electrode disposed on the one surface of the body to be connected to the first lead-out portion, and disposed along a surface of the first recess portion to have a first groove disposed therein; and a second external electrode disposed on the one surface of the body and connected to the second lead-out portion.
    Type: Grant
    Filed: May 3, 2022
    Date of Patent: March 24, 2026
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyung Ho Kim, Sung Jin Park, Jin Hwan Kim
  • Patent number: 12573888
    Abstract: A wireless power transfer system is configured in such a way that: the power transmitter coil and the power receiver coil each include a coil unit, the coil unit being a pair of coils arranged side by side in a horizontal direction; each of the coils in the coil unit has a shape formed by being wound in a horizontal plane and those coils are configured in such a way that magnetic fields generated by currents are oriented oppositely to each other; a connecting portion is provided on outside diameter sides of adjacent longer sides of the pair of coils, the longer sides being opposed to each other; and the coils are wound to be substantially point-symmetric about a substantially central point of the connecting portion as a point of symmetry in such a way that coil widths of all longer sides of the pair of coils are substantially equal.
    Type: Grant
    Filed: February 28, 2023
    Date of Patent: March 10, 2026
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Norihito Kimura, Makoto Hashimoto, Kazutaka Kimura, Tomokiyo Suzuki, Masaki Kanesaki
  • Patent number: 12573534
    Abstract: A coil component includes a drum-shaped core including a core part having a circumferential surface including a first side surface and a second side surface parallel to each other; and a coil including two wires wound around the core part in the same direction. The coil has a first twisted wire part having the two wires twisted together on the first side surface, and a second twisted wire part having the two wires twisted together on the second side surface. The first twisted wire part and the second twisted wire part are identical in shape.
    Type: Grant
    Filed: July 18, 2024
    Date of Patent: March 10, 2026
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yasuhiro Itani, Seiji Karimori, Katsuyuki Takahashi, Masashi Miyamoto
  • Patent number: 12573542
    Abstract: A coil component includes: a body; a coil portion including a coil pattern disposed in the body and first and second lead portions exposed to a first surface of the body to be spaced apart from each other; and first and second external electrodes disposed on the first surface of the body and spaced apart from each other and connected to the first and second lead portions, respectively, wherein in a cross-section perpendicular to the first surface of the body, a curved portion having a radius of curvature of 1 ?m or more is formed in a region in which each of the first and second lead portions and an outermost turn of the coil pattern are connected to each other.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: March 10, 2026
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Ji Cho, Jae Hun Kim, Ji Man Ryu