Abstract: A field and/or customer replaceable packaged refrigeration heat sink module is suitable for use in standard electronic component environments. The field replaceable packaged refrigeration heat sink module is self-contained and is specifically designed to have physical dimensions similar to those of a standard air-based cooling system, such as a fined heat sink or heat pipe. As a result, the field replaceable packaged refrigeration heat sink module can be utilized in existing electronic systems without the need for board or cabinet/rack modification or the “plumbing” associated with prior art liquid-based cooling systems.

Abstract: In a method of generating a third gas flow of medium pressure and medium temperature, which can be particularly employed as cooling air for a gas turbine, from a first gas flow of high-pressure and high temperature, a high effectiveness with simultaneous simple process control is achieved in an arrangement wherein the reduction is undertaken by stepwise energy exchange between the first gas flow and a second gas flow of low pressure and low temperature in a cascade consisting of a plurality of energy exchangers connected in series.