Abstract: An inverter power cabinet includes a cabinet body and power devices arranged in the cabinet body. The cabinet body includes a low-protection grade installation cavity and an airtight high-protection grade installation cavity hermetically isolated from each other; the power devices include high protection grade power devices arranged in the low-protection grade installation cavity and low-protection grade power devices arranged in the high-protection grade installation cavity; the low-protection grade installation cavity has an outer cold air inlet and an inner hot air outlet in communication with outside world, and a first fan is provided in the low-protection grade installation cavity; and the inverter power cabinet includes a heat exchanger configured to dissipate heat of the high-protection grade installation cavity.

Abstract: One embodiment provides a system, including: an image display device comprising: a front side, a back side, a top side, a bottom side, a left side, and a right side; and a first guide mechanism disposed on the back side; a housing, comprising a base and an upper element; the upper element comprising: a groove running lengthwise and open at both ends; a back-plate running lengthwise and adjacent to the groove; and the back-plate having a second guide mechanism; wherein the image display device interfaces with the housing via the first guide mechanism and the second guide mechanism. Other aspects are described and claimed.

Abstract: A poke-through device for installation in a hole in a floor structure, the poke-through device including a body defining an interior. The body including a length bounded by an upper end and a lower end, the body including a central axis extending along its length. A mounting frame including a pair of opposed end lobes separated by at least one divider. One of the pair of lobes has a first electrical device mounting surface and the other of the pair of lobes including a second electrical device mounting surface. The first and second electrical mounting surfaces are angled toward the central axis. The first and second electrical device mounting surfaces each including an opening adapted to receive therein an electrical device. A first intumescent member is disposed at the body upper end, and an electrical box is secured to the body lower end. A fire resistant gasket is disposed between the electrical box and the body lower end.

Abstract: An apparatus for providing immersion cooling in a circuit card environment includes a circuit card having first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, respectively, which are different from one another. A thermal energy transfer device is operatively connected to an area of the circuit card correlated with a selected one of the first and second circuit card subassemblies. The thermal energy transfer device at least partially induces the respective one of the first and second operating temperatures to the selected circuit card subassembly. The thermal energy transfer device transversely overlies at least a supermajority of the selected circuit card subassembly and is laterally spaced from the other circuit card subassembly. A system and method for providing immersion cooling are also provided.

Abstract: High thermal performance microelectronic modules containing thermal extension levels are provided, as are methods for fabricating such microelectronic modules. In various embodiments, the microelectronic module includes a module substrate having a substrate frontside and a substrate backside. At least one a microelectronic device, such as a semiconductor die bearing radio frequency circuitry, is mounted to the substrate frontside. A substrate-embedded heat spreader, which is thermally coupled to the microelectronic device, is at least partially contained within the module substrate, and extends to the substrate backside. A thermal extension level is located adjacent the substrate backside and extends away from the substrate backside to terminate at a module mount plane. The thermal extension level contains a heat spreader extension, which is bonded to and in thermal communication with the substrate-embedded heat spreader.

Abstract: A recess in a metal housing accommodating a high frequency package includes a first space and a second space and has a winners podium shape in cross-sectional view. A thermally conductive material is sandwiched between the metal housing having heat dissipating fins and the high frequency package.

Abstract: A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure with a bore extending into the layer stack. The bore includes a first bore section with a first diameter and a connected second bore section with a second diameter differing from the first diameter. The component carrier further comprises a thermally conductive material filling substantially the entire bore. The bore is in particular formed by mechanical drilling.

Abstract: Embodiments disclosed herein include systems and methods for mounting electrical components in electrical systems. In one example, there is provided a heat-generating electrical component and base assembly configured to be secured to a component wall. The assembly comprises a base including an upper portion having a recess and a lower portion having a floating electrical connector, a heat-generating electrical component secured in the recess of the base and including an electrical lead in electrical communication with the floating electrical connector, and a gasket circumscribing a perimeter of the lower portion.

Abstract: Apparatuses, systems and methods associated with design of cold plates for cooling electrical systems are disclosed herein. In embodiments, a cold plate may include a base and a lid affixed to a side of the base via a braze joint, wherein the braze joint may extend around a perimeter of the lid. The lid may include a dam having a perimeter located inside of the perimeter of the lid, wherein the dam may be compressed against the side of the base and may be liquid-tight to the side of the base, and wherein a cavity may be located between the base and the lid within the perimeter of the dam to provide a circulation passage for a liquid coolant. Other embodiments may be described and/or claimed.

Abstract: A hybrid power control unit for a vehicle according to the present disclosure includes: a capacitor module; first and second coolers disposed on opposite sides of the capacitor module, the coolers including flow paths extending along lengthwise directions of the capacitor module; a plurality of power modules each being installed between the branch flow paths of one of the first and the second coolers; a low DC-DC converter (LDC) module disposed on one of the first and second coolers to be in contact with a remaining one of the branch flow paths of the cooler having the LDC module; a gate board having a top surface being electrically connected to the power modules; and a control board having a top surface being electrically connected to the gate board and the LDC module.

Abstract: A storage device carrier system includes a linear array of mounting trays, wherein each mounting tray is configured to removeably receive a storage device. A velocity-increasing longitudinal cooling channel is configured to provide cooling air to the linear array of mounting trays.

Abstract: According to one embodiment, a power-module assembly includes a power-module stack having coolant chambers interleaved with power modules and supply and return manifold channels extending axially along the stack. An endcap has a major side defining recessed inlet and outlet manifold cavities aligned with the channels and inlet and outlet ports disposed on one or more minor sides that are perpendicular to the major side.

Abstract: A system and method to ensure the proper operation of a power supply unit in an electronic device. The electronic device has a chassis with a length and a width that includes one area having electronic components. A system fan is located in the chassis relative to the electronic components to generate air flow in the direction of the length of the chassis through the electronic components. A power supply unit is located in parallel to the system fan relative to the width of the chassis. The power supply unit includes an AC input, a DC output and an internal fan. A controller is operable to control the system fan to reduce the air flow when the power supply unit turns on AC power to the AC input, or wakes up from a cold redundant state and outputs DC power from the DC output.

Abstract: The present invention discloses a water cooling system for a computer, which includes a radiator, a cooling block in fluid communication with the radiator, and a liquid storage tank in fluid communication with the radiator and the cooling block. The radiator, the cooling block and the liquid storage tank are of an integrated structure. The water cooling system of the invention has an integrated structure which does not require user to assemble the components, thereby avoiding incidents such as liquid leakage. The water cooling system is provided with the liquid storage tank that is at least partially exposed outside a water cooling case, thereby increasing the amount of a cooling liquid, improving the heat dissipating efficiency, enabling a user to easily observe the amount of the cooling liquid, and improving the appearance of the water cooling case.

Abstract: A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.

Abstract: A pivot structure assembly including a fixed cover and a hinge module is provided. The hinge module includes a torque element, a first shaft, a second shaft, a first bracket and a second bracket. The torque element is fixed on the fixed cover and has a first and a second axle sleeves, parallely disposed at two opposite sides of the torque element. The first shaft is disposed through the first axle sleeve, and the second shaft is disposed through the second axle sleeve. The first bracket is pivotally disposed on the torque element through the first shaft, and the second bracket pivotally disposed on the torque element through the second shaft. When the first and second brackets rotate relatively to the torque element, the first and second axle sleeves respectively provide different friction forces to the first and second shafts. In addition, an electronic device is also mentioned.

Abstract: The subject of the invention is an electronic architecture (10) intended to supply an electric machine for automotive vehicle, the electronic architecture (10) comprising at least: an electronic power unit (100); a thermal dissipator (200) supporting the electronic power unit (100); an electronic control unit (300) configured to control the said electronic power unit (100); a support (400) of the electronic control unit supporting the electronic control unit (300) and arranged between the electronic power unit (100) and the electronic control unit (300); and an electrical connector (500) comprising at least one power trace intended to be connected electrically to at least some electrical elements (phase ?, B+, B?) of the electric machine and/or of an electrical energy source, the electrical connector (500) being arranged between the electronic power unit (100) and the support (400) of the electronic control unit and configured to electrically connect the electronic power unit (100) and/or the electronic co

Abstract: An immersion cooling apparatus includes an immersion tank in which an electronic device is disposed and in which a secondary refrigerant is stored, the electronic device being dipped into and cooled down by the secondary refrigerant, a housing in which the immersion tank is disposed and in which a primary refrigerant is stored, the immersion tank being dipped into and cooled down by the primary refrigerant, and a driver that rotates the immersion tank, wherein the immersion tank being rotatably attached to an interior of the housing, the immersion tank having an inner circumferential surface and an outer circumferential surface, the inner circumferential surface being positioned facing the electronic device, the outer circumferential surface being positioned on an opposite side of the inner circumferential surface, each of the inner circumferential surface and the outer circumferential surface having a plurality of projections.

Abstract: Cooling units are configured to be installed in a datacenter, such as in a row configured to receive server racks. The cooling units include chilling coils configured to cool air passing across the chilling coil. The cooling units when installed supply cooled air and include one or more cooling unit components located beneath or installed in a raised floor of the datacenter.

Abstract: A cold-air bypass apparatus may include (1) a mount configured to couple the cold-air bypass apparatus to a drive-plane board housed within a storage-system chassis and (2) a baffle configured to direct a portion of an airflow through an opening in the drive-plane board from below the drive-plane board to above the drive-plane board. The drive-plane board may include (1) a front drive section that includes storage-drive connectors coupled to the drive-plane board, (2) a rear drive section that includes additional storage-drive connectors coupled to the drive-plane board, and (3) the opening located between the front drive section and the rear drive section that allows air to flow from below the drive-plane board to above the drive-plane board. Various other apparatus, systems, and methods for directing air in a storage-system chassis are also disclosed.