Abstract: A light-coupling device includes an interposer, an optical chip, an optical waveguide element and a fiber array connector. The waveguide element is fixed in a locating slot formed by a top recess on the interposer. The optical chip includes a waveguide layer with a light-emitting surface located aside the optical chip. The optical waveguide element includes an incident surface facing the light-emitting surface, an emergent surface located atop, and a reflective surface located inside. The fiber array connector includes an optical waveguide lens and a plurality of fibers. The optical waveguide lens faces the emergent surface. One of both horizontal sides of the optical waveguide lens is a tilted reflective surface while the other is a light-coupling surface aligned with the fibers.

Abstract: The configuring of a micromirror to suppress a resonance of the micromirror. As part of the configuring process, the micromirror is subjected to multiple actuation frequencies, and the micromirror response is measured in response to at least some of these actuation frequencies. A resonant frequency of the micromirror is then determined using at least some of the measured mechanical responses. Then, depending on this determined resonant frequency of the micromirror, notch filter parameters are selected. There is more than one possibility for notch filter parameters, where the selected possibility depends on the determined resonant frequency. The notch filter is then configured with the selected notch filter parameters.

Abstract: Various embodiments of the present disclosure are directed towards a semiconductor device including a dielectric structure disposed on a first substrate. An edge coupler is disposed within the dielectric structure and comprises a plurality of optical core segments. A deflector structure is disposed within the dielectric structure and is laterally adjacent to the edge coupler. The deflector structure is configured to redirect an optical signal traveling along a first direction to a second direction towards the edge coupler.

Abstract: Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include a PIC in a first layer including an insulating material, wherein the PIC has an active surface and an opposing backside, and wherein the PIC is embedded in the insulating material with the active surface facing up; a conductive pillar in the first layer; an integrated circuit (IC) in a second layer, wherein the second layer is on the first layer and the second layer includes the insulating material, wherein the IC is embedded in the insulating material in the second layer, and wherein the IC is electrically coupled to the active surface of the PIC and the conductive pillar; and an optical component optically coupled to the active surface of the PIC and extending through the insulating material in the second layer.

Abstract: Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include a PIC in a first layer including an insulating material, wherein the PIC has an active side and an opposing backside, and wherein the PIC is embedded in the insulating material with the active side facing up; an optical component optically coupled to the active surface of the PIC and extending at least partially through the first layer; and an integrated circuit (IC) in a second layer, wherein the second layer is on the first layer, wherein the second layer includes the insulating material, wherein the IC is embedded in the insulating material in the second layer, and wherein the IC is electrically coupled to the active side of the PIC.

Abstract: An optical device has five elements fabricated on one substrate. The first has an active waveguide structure supporting a first mode. The second has a passive waveguide supporting a second mode. The third has a passive waveguide supporting a third mode. The fourth element has a heatsink thermally coupled to the first element. The fifth element, at least partly butt-coupled to the first element, has an intermediate waveguide supporting an intermediate mode. The effective mode area of the third mode is larger than that of the second mode; A tapered waveguide structure in the second or fifth element facilitates efficient adiabatic transformation between the second mode and the intermediate mode. A tapered waveguide structure in at least one of the second and third elements facilitates efficient adiabatic transformation between the second mode and the third mode. No adiabatic transformation occurs between the intermediate mode and the first mode.

Abstract: A connector assembly includes an electrical connector, a metal shielding cage, a heat sink and a fastening member. The electrical connector includes an insulating body and a number of conductive terminals configured to be mounted on a circuit board. The insulating body includes a mating slot. The metal shielding cage is shielded on a periphery of the electrical connector. The metal shielding cage includes a receiving chamber in communication with the mating slot for receiving a mating connector along a first direction. The first direction is perpendicular to the circuit board. The heat sink is fixed to the metal shielding cage. The fastening member passes through the circuit board and is fastened to the heat sink.

Abstract: An optical transceiver includes a housing, a release component, a bottom cover and a handle. The housing includes a terminal portion and a first engagement component connected to each other. The first engagement component detachably engages a second engagement component of an elastic arm of a cage. The release component is in an accommodation space of the terminal portion. The bottom cover includes a main portion and an elastic component connected to each other. The main portion is fixed to the terminal portion. The elastic component extends from the main portion into the accommodation space and exerts an elastic force on the release component so that the release component is positioned at or moved to an original position. The handle is movably disposed on the terminal portion for pushing the release component so as to detach the second engagement component from the first engagement component.

Abstract: A pre-connector is configured to detachably fix to an optical fiber group. The pre-connector includes a shell assembly and a limiting member. The shell assembly is configured to accommodate one end of the optical fiber group. The limiting member is clamped in the shell assembly and is configured to press against the optical fiber group to fix the optical fiber group to the shell assembly. The present disclosure further provides a connector including the pre-connector.

Abstract: Aspects and techniques of the present disclosure relate to a multi-fiber ferrule dust cap for use on a multi-fiber fiber optic connector. The multi-fiber ferrule dust cap is configured to cover an end face of a multi-fiber ferrule to protect ends of optical fibers mounted within the multi-fiber ferrule from contamination and/or damage. No portion of the multi-fiber ferrule dust cap covers a connector body of the multi-fiber fiber optic connector.

Abstract: A columnar illumination component includes a columnar body and a light-emitting component. The columnar body has two first side portions, and two second side portions. Each of the first side portions is adjoined to the second side portions, each of the second side portions is adjoined to the first side portions, and an elongated channel is jointly defined by the first side portions and the second side portions. The light-emitting component is located inside the elongated channel, and includes two light guides and two light source modules where the light guides are respectively fixed on the first side portions. The light source modules are respectively fixed on the second side portions, and each of the light source modules emits lights towards one of the light guides, and outputs the lights outwardly through the light guide.

Abstract: A photoelectric signal conversion device includes an optical module (100), an adapter module (200), and a host (300). The optical module (100) includes a first electrical connection structure (110), a photoelectric signal conversion component (102), and an optical signal connection structure (120). The first electrical connection structure (110) and the optical signal connection structure (120) are connected to the photoelectric signal conversion component (102). The adapter module (200) arranged in the host (300) includes an insertion slot (201), a second electrical connection structure (220/220a), and a third electrical connection structure (230). The second electrical connection structure (220/220a) in the insertion slot (201) is electrically connected to the third electrical connection structure (230). The third electrical connection structure (230) is in the host (300) and coupled to the host (300). The insertion slot (201) is outside the host (300).

Abstract: An electronic package comprising: an active element; a first substrate; and a second substrate, the first substrate comprising a plurality of conductive tracks on a first surface, the second substrate comprising a plurality of conductive tracks on a second surface, the active element being provided on the first surface of the first substrate, the second substrate being provided overlying the first surface of the first substrate such that a face of the second substrate which is opposite to the second surface is in contact with the first surface, the second substrate having an opening to allow access to the active element and being positioned on the first substrate such that at least some of the plurality of conductive tracks on the first surface are exposed, the active element being electrically connected to at least some of the plurality of tracks on the first substrate and the plurality of tracks on the second substrate.

Abstract: Methods and systems for removing coatings from optical fibers. A system includes a gas source for providing gas, and a heater configured to heat the gas. The system includes a holder comprising first and second attachment features. The attachment features secure a coated optical fiber along a removal path. The system includes at least one nozzle connected to the gas source. The at least on nozzle is aimed in a nozzle direction that is towards the removal path at a pitch, such that the nozzle is non-perpendicular towards the removal path. The nozzle directs a continuous stream of the heated gas towards the coated optical fiber causing the coating of the coated optical fiber to be removed. The methods and systems may employ a second nozzle that may be offset from the first nozzle angularly and/or laterally with respect to the removal path.

Abstract: The invention relates to a set of modular raceways (10) for structured optical-fiber cabling and installation in data centers, telecommunication rooms, wiring rooms and the like, the raceways (10) comprising expandable modules (20), (30), (40), (50), (60), (70), (80), (90), (110), (111) and (112) formed by at least one central profile (11) with pairs of longitudinal connections (CLI) and (CL2) for coupling to end profiles (13).

Abstract: A fiber optic connector for terminating a drop cable comprises a housing having a front end portion and a rear end portion spaced apart along a longitudinal axis of the fiber optic connector; an inner connector configured to be received in the housing; a cable clamp insert configured to clamp onto the drop cable and be received in the housing, the cable clamp insert extending along the longitudinal axis; and a cable clamp retainer configured to couple to the rear end portion of the housing whereby the cable clamp retainer pushes the cable clamp insert forward in the housing. The cable clamp retainer is configured to apply an increasing force to create a tight connection between the housing and the cable clamp insert.

Abstract: An apparatus includes an aperture disposed through an outer layer, a folding prism adjacent to the aperture, and a multi-mode optical fiber on which the folding prism is disposed. The aperture and the folding prism are insertable into a trench disposed through a waveguide of an edge emitting integrated laser, the aperture is configured to allow a light beam that is emitted by the waveguide, through the aperture, and the folding prism is configured to redirect the allowed light beam to the multi-mode optical fiber.

Abstract: A packaging and assembly of a parallel optical link is disclosed. The packaging and assembly may have four major parts: assembly of the optical transceiver die, 2.5D package assembly, package attachment to a system printed circuit board, and optical coupling attachment. A frame and a removable lid may be attached to the optical transceiver die. The lid may protect the optical transceiver array of the optical transceiver die, and the frame may help in aligning optical coupling assembly with the optical transceiver array.

Abstract: An object of the present invention is to achieve a low delay core applicable to a Master channel of a Master-Slave CPE (MS-CPE) transmission method with a general-purpose refractive index distribution structure. An optical fiber according to the present invention is a single-mode optical fiber, and has an SI-type refractive index distribution structure, in which a clad region relative refractive index difference ? (%) with respect to a core region refractive index, a radius a (?m) of the core region, and a group delay time difference ?? between the Master channel and the Slave channel satisfy “Mathematical Expression 19” and “Mathematical Expression 20”, or has a W-type refractive index distribution structure, in which a mode field diameter MFD is 9.5 to 10.

Abstract: A cable clamp for use with telecommunication cables. The cable clamp is a two piece design comprising a top plate and a bottom plate. The cable clamp having a first closing mechanism arranged on a first end thereof and a second closing mechanism arranged on a second end thereof. The top plate includes a gasket arranged on an inner surface thereof. The bottom plate includes a first and second gasket arranged on a top surface thereof. The cables are in contact with the gaskets from both plates, thus securing them in a predetermined position for prepping and splicing.