Abstract: An object of the present invention is to provide a polycarbonate resin composition which satisfies mechanical properties, flame retardancy, and appearance of molded articles at a higher level. The flame-retardant polycarbonate resin composition of the present disclosure contains, based on 100 parts by weight of a resin component consisting of (A) 40 to 100 parts by weight of a polycarbonate resin (component A) and (B) 60 to 0 parts by weight of a polyester resin (component B), (CI) 0 to 30 parts by weight of a polymer obtained by polymerizing at least one selected from the group consisting of an aromatic vinyl monomer, a vinyl cyanide monomer, and an alkyl (meth) acrylate monomer (component CI), (CII) 1 to 10 parts by weight of an impact modifier other than the component CI (component CII), (D) 1 to 20 parts by weight of phosphazene having 98.5 mol % or more of phosphazene cyclic trimer (component D), and (E) 0.05 to 2 parts by weight of dripping inhibitor (component E).

Abstract: A moisture-curable composition is shown and described herein. The moisture-curable composition comprises a moisture-curable resin and a moisture scavenger selected from a cyanoalkylalkoxysilane. The inclusion of the cyanoalkylalkoxysilane in the moisture-curable composition has been found to effectively scavenge moisture and control the rate of curing and viscosity increase in the composition.

Abstract: The adhesive composition includes: a cyclic organosilazane compound of the following general formula (1): wherein R1s each independently represent a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and p represents an integer of 3 to 8; and a hydrolyzable group-containing organosilicon compound containing an alkoxysilane compound of the following general formula (2) and/or a partial hydrolytic condensate thereof: R2x—Si(OR3)4-x ??(2) wherein R2 represents an unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms and optionally having an oxygen atom, R3 represents an unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and x represents an integer of 0 to 2.

Abstract: A silicone-polycarbonate copolymer has the formula Xg[ZjYo]c, where each X is an independently selected silicone moiety having a particular structure, each Y is an independently selected polycarbonate moiety, each Z is an independently selected siloxane moiety, subscript c is from 1 to 150, subscript g is >1, 0?j<2, and 0<o<2, with the proviso that j+o=2 in each moiety indicated by subscript c. Methods of preparing the silicone-polycarbonate copolymer are also disclosed. Further, a sealant is disclosed, the sealant comprising the silicone-polycarbonate copolymer and a condensation-reaction catalyst.

Abstract: To provide a siliceous film manufacturing composition that can fill a narrow and a high aspect ratio trench and can produce a thick siliceous film. [Means for Solution] The present invention provides a siliceous film manufacturing composition that comprises, (a) a block copolymer having a linear and/or cyclic polysilane backbone block with or more silicon atoms and a polycarbosilane backbone block with or more silicon atoms, and (b) a solvent.

Abstract: The present invention relates to a method for producing mineral particles grinding a mineral material in the presence of a specific anionic polymer. The polymer used is obtained by means of polymerisation in the presence of sodium hypophosphite, disodium dipropionate trithiocarbonate and at least one radical-generating compound. The invention also relates to an aqueous composition comprising particles of ground mineral material and such a polymer, in particular a paper coating slip composition.

Abstract: Disclosed herein is a resin composition including an ethylene-acrylic acid alkyl ester copolymer (L), a graft copolymer (M), and a styrene-based elastomer (N), wherein the graft copolymer (M) is obtained by a reaction among an ethylene-acrylic acid alkyl ester copolymer (A), a monomer component (B) containing at last one monomer selected from the group consisting of a (meth)acrylic acid alkyl ester monomer and an aromatic vinyl monomer, and t-butyl peroxymethacryloyloxyethyl carbonate (C), and a weight ratio between the ethylene-acrylic acid alkyl ester copolymer (A) and the monomer component (B) ((A)/(B)) is 50/50 to 98/2. The resin composition is capable of reducing squeaking noises generated by contact between a thermoplastic resin molded body and leather.

Abstract: Block-modified polysiloxanes and compositions comprising the block-modified polysiloxanes are useful in the field of textile finishing. Emulsions comprising the compositions have a very small and narrowly distributed particle size which increases penetration, and provide good softening properties coupled with good hydrophilicity.

Abstract: A water-based adhesive which comprises a dispersed polymer and an emulsified silicone resin polymer. The adhesive is postcrosslinkable via reactive groups.

Abstract: Provided is a silicone adhesive composition having (A) a condensation product of a linear or branched diorganopolysiloxane having a silicon atom-bonded hydroxy group and/or a silicon atom-bonded alkoxy group having 1 to 10 carbon atoms at a terminal and having no alkenyl group, a linear or branched diorganopolysiloxane having at least two alkenyl groups, and an organopolysiloxane comprising an R13SiO0.5 unit and an SiO2 unit and having a silicon atom-bonded hydroxy group and/or a silicon atom-bonded alkoxy group having 1 to 6 carbon atoms, (B) an organohydrogenpolysiloxane having at least three SiH groups and an average polymerization degree of 80 or less in an amount of 0.1 to 5 parts by mass, relative to 100 parts by mass of component (A), and (C) a platinum group metal catalyst in a catalytic amount.

Abstract: A thermoplastic resin composition of the present invention comprises: about 100 parts by weight of a thermoplastic resin including a polyester resin; about 50-150 parts by weight of glass fibers; and about 1-10 parts by weight of a polyether-ester copolymer, wherein the polyether-ester copolymer has a melt volume flow rate (MVR) of about 30-120 cm3/10 min as measured under conditions of 230° C. and 2.16 kg based on ISO 1133. The thermoplastic resin composition is excellent in impact resistance, appearance characteristics, metal joining properties, and the like.

Abstract: Upcycling process for producing acidic, end-equilibrated siloxanes bearing acetoxy groups and having chain lengths of greater than 3 silicon atoms from end-of-life silicones by thermal digestion in an acidic reaction medium comprising acetic anhydride, acetic acid and at least one further Brønsted acid having a pKa of <4, the digestion taking place in a reactor having a volume of at least 1 liter.

Abstract: A polymer composition that contains an aromatic polymer in combination with a tribological formulation is provided. The polymer composition may exhibit a low degree of surface friction that minimizes the extent to which a skin layer is peeled off during use of a part containing the composition (e.g., in a camera module). For example, the polymer composition may exhibit a dynamic coefficient of friction of about 1.0 or less and/or a wear depth may be about 500 micrometers or less as determined in accordance with VDA 230-206:2007.

Abstract: Silicon-based protective film for adhesive or self-adhesive elements, characterized in that said protective film is based on silicone and has a level of extractible silicone less than or equal to 100 ng/cm2, preferably less than or equal to 50, preferably less than or equal to 20 ng/cm2, and even more preferably less than 10 ng/cm2, the method of production thereof and uses thereof.

Abstract: The present invention provides a barrier material formation composition comprising a silane oligomer, at least a part of the silane oligomer being modified with a metal alkoxide.

Abstract: A silicone pressure sensitive adhesive composition is curable to form a silicone pressure sensitive adhesive. The silicone pressure sensitive adhesive composition can be coated on a substrate and cured to form a protective film. The protective film can be adhered to an anti-fingerprint coating on display glass, such as cover glass for a smartphone.

Abstract: Methods are disclosed for forming a Silicon Metal Oxide film using a mono-substituted TSA precursor. The precursors have the formula: (SiH3)2N—SiH2-X, wherein X is selected from a halogen atom; an isocyanato group; an amino group; an N-containing C4-C10 saturated or unsaturated heterocycle; or an alkoxy group.

Abstract: A polydiorganosiloxane having both a silicon bonded aliphatically unsaturated group and a silicon bonded poly(meth)acrylate polymer or copolymer, and method for preparation of this polydiorganosiloxane are disclosed. The method preserves the aliphatically unsaturated groups when grafting the poly(meth)acrylate to the polydiorganosiloxane. This polydiorganosiloxane is useful in hydrosilylation reaction curable compositions, such as pressure sensitive adhesive compositions.

Abstract: A fluoro(poly)ether group-containing silane compound represented by any of the formulae (A1), (A2), (B1), (B2), (C1), or (C2). In the formulae, PFPE is each independently at each occurrence a group represented by the formula: —(OC3F6)d—, wherein the repeating unit OC3F6 of the formula includes a branched structure, and d is an integer of 2 or more and 200 or less. The symbols are as defined in the description.

Abstract: A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same, a thermally conductive resin composition contains an addition reaction type silicone resin, a thermally conductive filler, an alkoxysilane compound, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to an alkoxysilane compound, and contains 55 to 85% by volume of the thermally conductive filler. A thermally conductive resin composition contains an addition reaction type silicone resin, an alkoxysilane compound, a thermally conductive filler, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to the alkoxysilane compound, and exhibits thermal conductivity of 5 W/m*K or more after curing.