Abstract: A production method of a multi-layer printed wiring board containing the following steps (1)-(5): (1) a temporary fitting preparatory step including conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) a temporary fitting step for temporarily fitting the adhesive sheet to the circuit board, including partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) a laminating step including heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) a thermal curing step including forming an insulating layer by thermally curing the prepreg, and (5) a detachin

Abstract: Methods of fabricating a polymeric implantable device from a PLLA/PDLA blend such as a stent with improved fracture toughness are disclosed. The blend is melt processed to allow formation of stereocomplex crystallites, which are nucleation sites for crystal growth. A polymer construct is formed from the melt processed blend and device is formed from the polymer construct. The stereocomplex crystallites result in an in increase in nucleation density and reduced crystal size, which increases fracture toughness of the formed device.

Abstract: To provide a pressure-sensitive adhesive sheet which protects a ground, thin, fragile adherend from “warping” and which can be removed from the fragile adherend after the completion of backgrinding without damaging and contaminating the fragile adherend. The pressure-sensitive adhesive sheet 5 includes a base layer A, a pressure-sensitive adhesive layer A, a base layer B, and a pressure-sensitive adhesive layer B arranged in this order, in which: the base layer A has a product of its Young's modulus at 25° C. and its thickness of 1.0×105 to 4.0×105 N/m and a product of its Young's modulus at 80° C. and its thickness of 2.8×105 N/m or less; the pressure-sensitive adhesive layer A has a shear modulus at 80° C. of 0.2 MPa or less; the base layer B has a product of its Young's modulus at 25° C. and its thickness of smaller than that of the base layer A and has, upon 80° C.

Abstract: A work conveying mechanism according to the present invention includes a rotation drum in which an adsorbing pad for adsorbing an absorber is provided. The work conveying mechanism rotates the rotation drum and arranges the absorber on a third web being conveyed. In an outer shape of the work adsorbed by the adsorbing pad, an outer edge portion thereof is closer to a shaft center side of the rotation drum than a central portion thereof is. A work conveying mechanism includes a roller mechanism provided on a side of the third web opposite to the rotation drum side and configured to locate the third web on the adsorbing pad side. At a passing point, the roller mechanism arranges an outer edge portion of the third web in a width direction on a shaft center side of the rotation drum closer than a central portion thereof is.

Abstract: Until now, an orientation pattern has been projected onto the skin by means of lasers. The stringers provided with an adhesive film are then positioned by hand on the skin and fixed by pressure weights. A precision of ±3 mm is thus achieved. The fine positioning takes place by means of comb templates. The templates are set one after the other, pressure weights being removed from the stringers after each setting, so a manual orientation of the stringers is made possible. The weights are then set again. The imprecision is still ±1.4 mm. This procedure is very time-consuming and not precise enough. It is therefore proposed to use a gantry robot with a gripper beam to position the stringers, the gantry robot cooperating with a loading unit and a heating station. The time spent is thus substantially reduced and the precision of the product is decisively increased.

Abstract: Provided is a method of manufacturing a wiring board, in which: a composite adhesive sheet 20 is attached to one of the surfaces of a support substrate 10, and a double-sided CCL 30 is attached to the other surface. Then, in an integrated state of the above components, a multilayer wiring structure including a conductive layer and a resin insulating layer is formed on a metal layer 33 of the double-sided CCL 30 by a known build-up method. A thermally foamable adhesive layer 22 of the composite adhesive sheet 20 is then heated, thereby thermally decomposing a thermal foaming agent to generate gas, and the support substrate 10 is separated from the remaining bonded body. Thereafter, a carrier foil layer 32b and a copper foil layer 32a of a carrier-foil coated copper foil 32 are mechanically peeled from each other at a boundary between both the layers, thereby obtaining a wiring board 1.

Abstract: A postage label dispensing system for dispensing adhesive-backed postage labels comprising (i) a means for stripping the adhesive-backed face material from the liner material of a label material, (ii) a first cutting apparatus, downstream of the stripping means, for cutting the face material to a desired length and producing an adhesive backed postage label having a postage indicia printed thereon, (iii) a means for attaching re-lining material to the adhesive backed postage label (iv) a second cutting apparatus, downstream of the lining means, for cutting the re-lining material to dispense at least one lined postage label, and (v) a processor for controlling the operation of the first and second cutting apparatus. A deflector guide is disposed between the stripping and re-lining means and is re-positionable to engage and disengage the adhesive backed postage labels produced by the upstream stripping station.

Abstract: A label for application to a surface having at least one compound curve is provided. The label comprises a heat shrinkable film having an inner surface and outer surface and a layer of pressure sensitive adhesive on the inner surface of the heat shrinkable film.

Abstract: In a mold in which a pattern is formed of a fine concavo-convex shape, two or more of alignment marks for determining a relative positional relation between a substrate and a mold are formed concentrically. Moreover, a damaged mark is identified from the positional information and shape of the respective marks, and an alignment between the mold and the substrate to which a resin film is applied is carried out excluding the damaged mark.

Abstract: A heat and pressure consolidated laminate, and method for producing the same, is provided that includes in superimposed relationship a decorative layer consisting essentially of a leather material, an underlay layer, a substrate, and an optional backer layer. The substrate has a first surface and a second surface opposite one another. The underlay layer includes one or more cellulosic sheets impregnated with a thermosetting resin, and is disposed between the decorative layer and the first layer of the substrate. The backer layer includes one or more cellulosic sheets impregnated with a thermosetting resin, and is disposed contiguous with the second surface of the substrate.

Abstract: A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a board having a receiving surface opposite to a substrate fixed at one side thereof, a plurality of chucking members located between the receiving surface of the board and the substrate, and a substrate separation device to separate the substrate from the chucking members. The substrate separation device includes a pusher for pushing the substrate to separate the substrate from the chucking members, and a base plate installed at the receiving surface of the board, the base plate having an installation space to install the pusher formed therein. The pusher protrudes out of the base plate through an inlet and outlet port located at one end of the installation space to pressurize the substrate.

Abstract: A smoking article, which provides lower amounts of total particulate matter in a latter portion of its puff count, includes a cylinder of smoking material, a combustible hollow tube within the cylinder of smoking material, and a heat sink at a downstream end of the hollow tube. The smoking article also includes a filter system attached to the cylinder of smoking material having a sorbent material and at least one downstream segment of filtering material.

Abstract: A method for producing an electric-wave-transmissible transferring member capable of expressing a metallic luster pattern having a sharp outline. A peel layer (3) is formed on a base sheet (2) throughout the entire surface of the sheet. Next, a water-soluble pattern layer (4) is partially formed thereon. Next, an electric-wave-transmissible metallic luster layer (5) is formed thereon and throughout the entire surface thereof. Next, a protective layer (6) is formed thereon and throughout the entire surface thereof, or is formed thereon and, partially, in the region where the water-soluble pattern layer (4) is not formed. Next, the workpiece is subjected to a heating treatment and then a water-washing treatment to peel and remove the water-soluble pattern layer (4), and the electric-wave-transmissible metallic luster layer (5) and the protective layer (6) formed over the layer (4). Next, an adhesive layer (7) is wholly or partially formed on the workpiece.

Abstract: An encapsulation method of an environmentally sensitive electronic element is provided. A first substrate is provided, wherein at least one first alignment mark and a plurality of environmentally sensitive electronic elements are formed on the first substrate. A second substrate is provided, wherein at least one second alignment mark and a plurality of limiting cavities are formed on the second substrate. A plurality of cover lids is respectively disposed in the limiting cavities. An adhesive is formed on the cover lids. The first substrate and the second substrate are laminated together with the first alignment mark and the second alignment mark as reference, so that the environmentally sensitive electronic elements are sealed in the adhesive and located between the first substrate and the second substrate. The second substrate and the cover lids are separated from each other.

Abstract: A method of manufacturing an optical waveguide device is provided which provides the excellent smoothness of a light receiving end surface and a light emitting end surface formed by cutting and which provides excellent productivity. A laminate of a film element (2) and a board (1) is prepared. The film element (2) includes at least one future optical waveguide portion. The board (1) is stacked on the film element (2). The laminate is die-cut from the side of the board (1). This provides an optical waveguide device including the die-cut board (1) and an optical waveguide formed thereon. A cutting die used for the die-cutting includes at least blades (3) for forming the light receiving end surface (20a) and the light emitting end surface (20b) of the optical waveguide. The blades (3) are flat blades including blade surfaces having an arithmetic means roughness (Ra) of less than 0.02 ?m.

Abstract: A method of producing nanoporous material includes the steps of providing a liquid, providing nanoparticles, producing a slurry of the liquid and the nanoparticles, removing the liquid from the slurry, and producing a monolith.

Abstract: A manufacturing method for an absorptive article according to the present invention includes: placing a continuum of the elastic members 4A and 5A in a desired layout, on at least one surface of a web 7A being transported continuously, while swinging the continuum of the elastic members 4A and 5A in a direction crossing a moving direction of the web 7A; feeding the web 7A on which the continuum of the elastic members 4A and 5A are placed, between a first roll 8, which is rotating in the moving direction, and a second roll 9; and pressing the continuum of the elastic members 4A and 5A, and the web 7A between the first roll 8 and the second roll 9.

Abstract: An apparatus for manufacturing an absorbent article includes a guide mechanism having a feeding portion for feeding an elastic member. The feed portion is alternately movable in a first direction and a second direction, and the elastic member is brought into contact with a web conveyed in a machine direction and is ananged in a waveform. The first direction is from a center portion of the web to a first end portion in a cross direction crossing the machine direction. The second direction is from the center portion to a second end portion opposite to the first end portion. A distance between the feeding portion and a nip point at which the elastic member comes in contact with the web is largest when the nip point exceeds a position in the waveform where an angle between the machine direction and a tangent to the waveform is largest.

Abstract: Included is a tip end portion being a feeding position from which a filiform elastic member is fed. By an arm member guiding the elastic member, the tip end portion is alternately moved in a first direction and a second direction, and thereby the elastic member is brought into contact with the web and is arranged in a gather waveform. Here, the first direction is from the center portion of a web being conveyed in a predetermined direction and having sequentially-arranged component parts forming one part of an absorbent article, to a first end portion in a cross direction crossing with a conveyance direction, and the second direction is from the center to a second end portion which is an end portion opposite to the first end portion. At this time, in a planar view of a composite web, when a nip point exceeds a position where an angle between the conveyance direction and a tangent to the gather waveform is largest, a distance between the tip end portion and the nip point is largest.

Abstract: A method of making a multi-layer circuit board that has a first film and at least two more films, second and third films, each being made of a thermoplastic polymer capable of forming an optically anisotropic melt phase, the first film having a low melting point, the second and third films having respective melting points higher than the melting point of the first film and at least one of the second and the third films having a circuit pattern thereon, and the first to third films are thermo compressed together with the first film interposed between the second and third films. This method entails causing at least one of the circuit patterns on one of the second and third films to contact an opposing surface of the other of the second and third films through the first film during the thermo compression bonding of the first to third films.