Abstract: Thin coatings of normally solid materials are applied to target substrates using an inductively coupled plasma. Particles of the coating material are vaporized by plasma heating, and pass through an orifice to a first vacuum zone in which the particles are accelerated to a velocity greater than Mach 1. The shock wave generated in the first vacuum zone is intercepted by the tip of a skimmer cone that provides a second orifice. The particles pass through the second orifice into a second zone maintained at a higher vacuum and impinge on the target to form the coating. Ultrapure coatings can be formed.

Abstract: Aqueous solution of alkali or ammonium acrylate is applied to a prefabricated fibrous substrate, and the acrylate is subjected to polymerization in two steps, namely the first step in which the acrylate is polymerized by means of a radical polymerization initiator and the second step which is subsequent to the first step and in which the unpolymerized acrylate is polymerized by means of heat treatment at 100.degree.-250.degree. C.

Abstract: Photoluminescent materials useful for detection of infrared light are constructed using a base material of strontium sulfide. Barium sulfate is used to increase brightness of output light of the materials, whereas lithium floride is used to allow the material to be fused together. Samarium and either cerium oxide or europium oxide are used in specific examples for providing electron traps in the photoluminescent material. An infrared sensing device or card may be constructed using the material. The photoluminescent material is made according to a process involving heating of the material to a fusing point, grinding the material after cooling, and reheating the material to below the fusing temperature. The material is then placed in a transparent binder and applied to a substrate. An alternate process involves applying the components of the photoluminescent material to a substrate of aluminum oxide and fusing the components onto the substrate.

Abstract: An improved method for improving the adhesion of microelectronic coatings to substrates uses a new silane adhesion promoter and hydroxylic solvent combination. An improved silane adhesion promoter contains an aqueous solvent composition containing a hydroxylic solvent.