Abstract: Disclosed is a photosensitive resin plate which effectively prevents dot gain by covering the photosensitive resin layer with a specific matte layer. The photosensitive resin plate comprises a substrate, a photosensitive resin layer formed on the substrate and a resin matte layer formed on the photosensitive resin layer, wherein the resin matte layer contains a polymerization inhibiting material.
Type:
Grant
Filed:
February 8, 1993
Date of Patent:
October 19, 1993
Assignee:
Nippon Paint Co., Ltd.
Inventors:
Koichi Ueda, Katsuji Konishi, Kazunori Kanda
Abstract: A method of profile lapping adhesion which comprises:coating on a film or sheet, or a substrate, or both of these an adhesive composition which comprises:(a) an epoxy resin or an isocyanate compound,(b) a curing agent for the epoxy resin or the isocyanate compound, and(c) a photopolymerizable vinyl compound:irradiating the adhesvie compoisiton;laminating the sheet or film to the substrate while the sheet or film is wrapped around the substrate; andcuring the adhesive composition.An adhesive composition especially suitable for use in the profile lapping adhesion is provided, which comprises:(a) a photopolymerizable compound which has a number average molecular weight of not less than about 3000 and at least one photopolymerizable double linkage in the molecule;(b) a photopolymerizable monomer which has a molecular weight of about 200-800; and(c) an isocyanate compound.
Abstract: A polyol blend, comprising a low-Tg high-hydroxyl number acrylic copolymer and a high-Tg low-hydroxyl number acrylic copolymer, is disclosed. The low-Tg and high-Tg acrylic copolymers each comprise a hydroxyalkyl acrylate or methacrylate, and a non-hydroxy moiety-containing alkyl methacrylate. The low-Tg copolymer has a hydroxyl number of about 112 to about 187, a number-average molecular weight of about 1500 to about 6000, a polydispersity value of no greater than about 5, and a Tg of about -10.degree. to about 20.degree. C. The high-Tg copolymer has a hydroxyl number of about 35 to about 112, a number-average molecular weight of about 2000 to about 8000, a polydispersity value of no greater than about 5, and a Tg of about 25.degree. to about 100.degree. C. Also disclosed are coating compositions comprising the polyol blend.
Type:
Grant
Filed:
November 14, 1990
Date of Patent:
March 24, 1992
Assignee:
S. C. Johnson & Son, Inc.
Inventors:
John E. Blasko, Robert E. Karabetsos, Douglas B. Rahrig
Abstract: A process for the preparation of polymer particles with an average diameter of from about 0.1 to about 40 microns, which comprises (1) mixing at least one monomer with a free radical polymerization initiator, and an initiator capable of being activated with light, which monomer mixture is dispersed in an aqueous phase containing a surfactant; (2) subjecting the aforementioned mixture of (1) to light irradiation for an effective period of time to accomplish stabilization of the mixture, while initiating photopolymerization of the monomer, and (3) subsequently heating the aqueous phase thereby completing polymerization of the monomer.
Type:
Grant
Filed:
October 23, 1989
Date of Patent:
January 14, 1992
Assignee:
Xerox Corporation
Inventors:
Marcel P. Breton, Traiko E. Petroff, Hadi K. Mahabadi