Patents Examined by Mark A. Osole
  • Patent number: 4983247
    Abstract: A layer of a neat resin in powder form is deposited either on a mold surface or on a bulk thermoplastic composite fiber reinforced sheet. The resin layer is adjacent to an insulated wall of a compression mold. The bulk sheet is preheated and compression deformed with the powdered resin. The heat from the sheet flows to and melts the powder layer producing a resin rich layer. The insulated wall permits the heat of the sheet to be retained sufficiently to melt the powdered resin. In the alternative, the neat resin powder may be replaced with a preformed film of thermoplastic resin compatible with the sheet resin. A structural homogeneous integral molecular bond is formed between the neat resin layer and the sheet.
    Type: Grant
    Filed: August 7, 1989
    Date of Patent: January 8, 1991
    Assignee: General Electric Company
    Inventor: Bang M. Kim