Abstract: Apparatus for scanning an integrated circuit chip or other device under test (DUT) for defects and for visual alignment of chip electrical leads with leads of an electrical tester for testing the chip circuit(s). The apparatus provides an image forming system to provide a visually perceptible image of the chip for chip scanning and chip lead alignment. The apparatus also provides means to translate the chip in a plane containing the chip and rotate the chip about an axis perpendicular to that plane to facilitate alignment of the chip leads with the corresponding electrical tester leads. A computer or operator views the chip through the image forming system and controls chip translation and rotation for scanning and lead alignment for subsequent chip testing.

Abstract: A probe apparatus tests the electrical characteristics of chips formed on a semiconductor wafer by bringing probes into contact with pads of each chip. The probes, which include ones for power supply potentials, signals, and ground potential, are mounted vertically penetrating a ring block which is attached to the center of a main PCB of a probe card. A tray containing a number of fuses is mounted over the probe card by means of struts. The fuses in the tray connect wires of the main PCB, to which the supply potential of a DC power source is applied, and their corresponding probes. The fuses and the tray can be collectively removed from the probe card to be replaced with new ones.

Abstract: An optical voltage electric field sensor of the type which includes a light source, a polarizer for linearly polarizing an incident light beam emanated from the light source, a phase plate for applying a phase difference to the linearly polarized light beam, a Pockels element for modulating the linearly polarized light beam applied with the phase difference in accordance with a voltage or electric filed applied thereto, an analyzer for separating the modulated light beam into a S-polarized light beam and a P-polarized light beam, a first light-receiving element arranged to receive the S-polarized light beam for converting the S-polarized light beam into a first electric signal V.sub.1 indicative of the intensity of the light beam, and a second light-receiving element arranged to receive the P-polarized light beam for converting the P-polarized light beam into a second electric signal indicative of the intensity of the light beam.

Abstract: A capacitor is connected to an insulating film on a semiconductor wafer. A high-frequency voltage with a bias is applied to the series combination of the semiconductor wafer and the capacitor. The bias voltage is changed stepwise, and the change of the total capacitance is measured. The minority carrier lifetime is calculated from the time-dependent change of the total capacitance.

Abstract: In a digital circuitry apparatus in which clock distribution can be performed with high accuracy even in the case where variations in delay time are caused by variations in the apparatus operating condition, programmed input data set to delay circuits are corrected by a circuit portion for measuring the delay time of a phase shifting adjustment delay circuit with respect to variations in delay time caused by variations in the apparatus operating condition, a first arithmetic operation circuit for calculating the rate of variation on the basis of measured values, and a second arithmetic operation circuit for calculating the quantity of variation on the basis of the rate of variation.

Abstract: A sensor system includes a sensor head, an optical source, and a measurement apparatus. The sensor head includes a beamsplitter having first, second, third, and fourth ports, the beamsplitter being responsive to light selectively applied to the first, second and third ports for passing light of a first polarization state from the first port to the second port, for passing light of a second polarization state from the first port to the third port, for passing light of the second polarization state from the second port to the fourth port, and for passing light of the first polarization state from the third port to the fourth port. The optical source means provides light to the first port.

Abstract: A high frequency magnetic field exposure meter for use in an induction heat sealing operation for heat sealing metal foil elements in closures to containers to be closed by the closures. The meter has a magnetic field sensing coil, a rectifier to convert the a.c. output from the coil to a d.c. output, an integrating circuit to integrate the d.c. output over an exposure period to an h.f. magnetic field, and a display device to indicate the integrated exposure value generated by the integrating circuit. During operation, the meter generates a quantitative reading indicating exposure to the h.f. magnetic flux as an integral of the magnetic flux, which generates the induction heating currents, over the exposure period during the induction heat sealing operation, and the reading provides a useful measure of the induction heating generated in an induction heat sealable closure.

Abstract: A probe assembly for testing an integrated circuit includes a probe card of insulating material with a central opening, a rectangular frame with a smaller opening attached to the probe card, four separate probe wings each comprising a flexible laminated member having a conductive ground plane sheet, an adhesive dielectric film adhered to the ground plane, and probe wing traces of spring alloy copper on the dielectric film. Each probe wing has a cantilevered leaf spring portion extending into the central opening and terminates in a group of aligned individual probe fingers provided by respective terminating ends of said probe wing traces. The probe fingers have tips disposed substantially along a straight line and are spaced to correspond to the spacing of respective contact pads along the edge of an IC being tested. Four spring clamps each have a cantilevered portion which contact the leaf spring portion of a respective probe wing, so as to provide an adjustable restraint for one of the leaf spring portions.

Abstract: A digital storage oscilloscope capable of acquiring and displaying input signals over a wide range of frequencies, and automatically establishing, by menu setups or user selection, any of a number of cycles of an input signal for viewing. An input analog electrical signal is sampled at a constant rate and then stored in a fast-acquisition memory. A DSP and a CPU combine to provide an automatic time base which maintains constant width of displayed signals without changing the sampling rate. The time period of one cycle of signal is measured, and the number of digitized samples is reduced or increased by the DSP to provide constant number of samples in order to maintain a constant-width display despite any changes in the input signal frequency. Additionally, the oscilloscope horizontal display axis may be expressed in degrees per division as well as time per division.

Abstract: An electron beam emitting face (11) is exposed downward through a round hole (22) made in a support table (20) on which an electron beam irradiation unit (10) is mounted. Below the electron beam emitting face (11) a bottomed cylindrical member (60) is disposed on a performance board (24) mounted on a test head (40) with an opening of the bottomed cylindrical member facing the electron beam emitting face. A ring-shaped circuit board (53) is mounted on the upper end of the bottomed cylindrical member (60) and a ring-shaped airtight coupling mechanism (70) is provided, with the ring-shaped circuit board held between it and the bottomed cylindrical member. The ring-shaped airtight coupling mechanism (70) is airtightly connected to the support table to hold vacuous a space opposite the electron beam emitting face and the inside of the bottomed cylindrical member (60).