Patents Examined by Mark W. Milstead
  • Patent number: 6031060
    Abstract: Terminally functionalized silicone polymers prepared using protected functionalized initiators and processes for preparing the same. The silicone polymers includes protected, functionalized silicone polymers, such as mono-functional, homotelechelic, heterotelechelic, macromonomer, and radial polymers. The protected functionalized polymers can be optionally deprotected to afford functionalized silicone polymers.
    Type: Grant
    Filed: May 20, 1998
    Date of Patent: February 29, 2000
    Assignee: FMC Corporation
    Inventors: Robert James Letchford, James Anthony Schwindeman, Roderic Paul Quirk
  • Patent number: 6025455
    Abstract: A process of producing a hydrophobic organosilica sol which comprises aging a reaction mixture at 0 to 100.degree. C. in the state that an alkali present in the reaction mixture is removed or is neutralized with an acid in an equivalent amount or more, thereby forming a silylation-treated silica sol having a hydrophobic colloidal silica dispersed therein, the reaction mixture comprising: (a) a hydrophilic colloidal silica having a specific surface area of 5.5 to 550 m.sup.2 /g in SiO.sub.2 concentration of 5 to 55% by weight, (b) a silylating agent of a disiloxane compound and/or monoalkoxysilane compound in a millimolar ratio of 0.03 to 2 in terms of Si atom per 100 m.sup.2 of a surface of the hydrophilic colloidal silica, and (c) a medium, as a residue thereof, comprising a mixed solvent comprising a hydrophobic organic solvent having a solubility of water of 0.1 to 12% by weight and an alcohol having 1 to 3 carbon atoms in a weight ratio of 0.
    Type: Grant
    Filed: May 26, 1998
    Date of Patent: February 15, 2000
    Assignee: Nissan Chemicals Industries, Ltd.
    Inventors: Keiko Yoshitake, Takafumi Yokoyama
  • Patent number: 6020424
    Abstract: The present invention provides a screen printable thermosetting composition for forming thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition comprises by weight from about 35% to about 75% of a thermal curing vinyl terminated siloxane material, from about 0.005% to about 5% catalyst, from about 10% to about 30% hydrocarbon solvent and from about 20% to about 70% conductive filler.
    Type: Grant
    Filed: June 30, 1997
    Date of Patent: February 1, 2000
    Assignee: Ferro Corporation
    Inventors: Jesus E. Osuna, Keith M. Mason, Vernon E. Stygar
  • Patent number: 6020389
    Abstract: The present invention pertains to a process for foaming mixtures of bifunctionally-ending di-organopolysiloxanes and acyloxsilane cross-linking agents, involving the addition to the mixture of sufficient quantities of an ammonium, amino, sodium or potassiumn hydrocarbonate.
    Type: Grant
    Filed: April 10, 1998
    Date of Patent: February 1, 2000
    Assignee: Heidelberger Bauchemie GmbH
    Inventor: Rudolf Hoheneder
  • Patent number: 6020264
    Abstract: In-line thickness measurement of a dielectric film layer on a surface of a workpiece subsequent to a polishing on a chemical-mechanical polishing machine in a polishing slurry is disclosed. The workpiece includes a given level of back-end-of-line (BEOL) structure including junctions. The measurement apparatus includes a platen and an electrode embedded within the platen. A positioning mechanism positions the workpiece above the electrode with the dielectric layer facing in a direction of the electrode. A slurry dam is used for maintaining a prescribed level of a conductive polishing slurry above the electrode, the prescribed level to ensure a desired slurry coverage of the workpiece. A capacitance sensor senses a system capacitance C in accordance with an RC equivalent circuit model, wherein the RC equivalent circuit includes a resistance R representative of the slurry and workpiece resistances and the system capacitance C representative of the dielectric material and junction capacitances.
    Type: Grant
    Filed: January 31, 1997
    Date of Patent: February 1, 2000
    Assignee: International Business Machines Corporation
    Inventors: Naftali Eliahu Lustig, William L. Guthrie, Thomas E. Sandwick
  • Patent number: 6017995
    Abstract: A suspension for the solvent-free production of silicone resin-bonded papers based on sheet silicates, which consists of:(a) 100 parts by weight of a sheet silicate,(b) 100 to 10,000 parts by weight of water,(c) 0.1 to 5 parts by weight of at least one silane of formula (I):(R'O).sub.a SiR.sub.4-a (I)in which R denotes substituted or unsubstituted hydrocarbon radicals having 1 to 20 carbon atoms and R' denotes C.sub.1-10 -alkyl, aryl, alkylaryl or hydrogen and a assumes a value from 1 to 3, and/or the partial hydrolysis product thereof,(d) 1 to 50 parts by weight of a pulverulent silicone resin of formula (II):(R'O).sub.b SiR.sub.C O.sub.(4-b-c)/2 (II)in which R and R.sup.1 have the abovementioned meaning and b assumes a value from 0 to 0.5 and c a value from 0.7 to 1.3, with the proviso that at least 5 parts by weight of the silicone resin of formula (II) are used per part by weight of the compound of formula (I),(e) 0.
    Type: Grant
    Filed: May 7, 1998
    Date of Patent: January 25, 2000
    Assignee: Wacker-Chemie GmbH
    Inventors: Guenter Beuschel, Holger Rautschek
  • Patent number: 6015457
    Abstract: Processes for producing poly (hydrido siloxane) copolymers and processes for producing solutions of such copolymers for coating semiconductor substrates are provided. The copolymers have the general formula: (HSiO.sub.1.5).sub.a (HSiO(OR)).sub.b (SiO.sub.2).sub.c, wherein R is a mixture of H and an alkyl group having between 1 and 4 carbon atoms; a+b+c=1; 0.5<a<0.99; 0.01<b<0.5; and 0<c<0.5. Processes for producing the copolymers use alkoxysilanes as starting materials. Processes for producing coating solutions include removal of water and alcohol. Films of such coating solutions are useful as planarizing dielectric layers.
    Type: Grant
    Filed: March 12, 1998
    Date of Patent: January 18, 2000
    Assignee: AlliedSignal Inc.
    Inventors: Roger Y. Leung, Tadashi Nakano
  • Patent number: 6013729
    Abstract: There is disclosed a moisture-curable elastomer composition obtained by dynamic heat treatment of a mixture comprising(a) an ethylene-.alpha.-olefin-unconjugated diene copolymer rubber,(b) a silicon-based crosslinking agent having two or more SiH groups within the molecule,(c) a hydrosilylation catalyst and(d) a hydrolyzable silane group-containing thermoplastic resin. Also disclosed is an elastomer composition resulting from molding of the above elastomer composition, followed by contacting with water, preferably in the presence of a silanol catalyst, to thereby cause crosslinking of the hydrolyzable silane group-containing thermoplastic resin. The elastomer composition of the present invention is excellent in rubber elasticity at high temperatures, low temperature impact resistance and oil resistance and have good moldability.
    Type: Grant
    Filed: April 1, 1998
    Date of Patent: January 11, 2000
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventors: Motoyoshi Tsujimoto, Tsuyoshi Iwasa
  • Patent number: 6008284
    Abstract: A fast curing alkoxy-functional room temperature vulcanizing (RTV) composition which is curable in the presence of moisture comprising polymers comprising on average at least 1.2 alkoxysilyl chain terminations per molecule, a tetraalkoxytitanium compound, a filler, and an alkoxysilane, each component being added in amounts to satisfy defined molar ratios.
    Type: Grant
    Filed: December 23, 1997
    Date of Patent: December 28, 1999
    Assignee: Dow Corning Corporation
    Inventors: Kimberly Kay Nylund, Richard Alan Palmer
  • Patent number: 6001945
    Abstract: An exchange reaction of hydroxyl and alkoxysilane is used as a polymerization avenue yielding hyperbranched polymers. A monomer containing hydroxy alcohol functionality and alkoxy functionality attached to a silicon atom in the monomer is employed, and a simple exchange reaction with driving off of alcohol by-product leads to the desired hyperbranched polymerization and materials.
    Type: Grant
    Filed: July 15, 1998
    Date of Patent: December 14, 1999
    Assignee: Dow Corning Corporation
    Inventors: Gary Thomas Decker, Daniel Graiver, Arthur James Tselepis
  • Patent number: 6001943
    Abstract: The present invention provides a silicone gel composition for use in sealing and filling of electrical and electronic parts, which are characterized by the fact that when said composition is cured, said composition forms a silicone gel in which the loss elastic modulus at a temperature of 25.degree. C. and a shear frequency of 0.1 Hz is 1.0.times.10.sup.2 to 1.0.times.10.sup.4 Pa, and in which the complex elastic modulus is 1.0.times.10.sup.5 Pa or less, and a silicone gel which is characterized by the fact that in a silicone gel which seals or fills electrical or electronic parts, the loss elastic modulus of this silicone gel at a temperature of 25.degree. C. and a shear frequency of 0.1 Hz is 1.0.times.10.sup.2 to 1.0.times.10.sup.4 Pa, and the complex elastic modulus is 1.0.times.10.sup.5 Pa or less.
    Type: Grant
    Filed: January 28, 1998
    Date of Patent: December 14, 1999
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Hiroji Enami, Yuji Hamada, Akihiro Nakamura, Takeaki Saiki
  • Patent number: 6001918
    Abstract: A silicone gel composition comprising: (A) 100 parts by weight of an organopolysiloxane containing at least two alkenyl groups per molecule and having a viscosity of 0.01 to 100 Pa.s at 25.degree. C.; (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule and having a viscosity of 0.001 to 10 Pa.s at 25.degree. C. in an amount sufficient to provide from 0.2 to 5 moles of silicon-bonded hydrogen atoms per one mole of alkenyl groups in component (A); (C) 0.01 to 15 parts by weight of a silica powder having a specific surface area of at least 50 m.sup.2 /g; (D) 0.0001 to 1.0 part by weight of a diamine compound represented by the following general formula: R.sup.1.sub.2 N--R.sup.2 --NR.sup.1.sub.2 wherein each R.sup.1 is independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R.sup.
    Type: Grant
    Filed: July 6, 1998
    Date of Patent: December 14, 1999
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Hiroji Enami, Akihiro Nakamura, Yuji Hamada, Takeaki Saiki
  • Patent number: 5998563
    Abstract: Photosensitive orientation material providing unidirectional LC alignment to generate a high pretilt angle for various LC compounds, and superior thermal stability, and being suitable for mass production, especially for active matrix LC displays, including polysiloxane, and a derivative of a cinnamoyl group.
    Type: Grant
    Filed: May 22, 1998
    Date of Patent: December 7, 1999
    Assignee: LG Electronics Inc.
    Inventors: Grit Pirwitz, Horst Zaschke, Andrea Hohmuth, Yuriy Reznikov, Oleg Yaroshchuk, Igor Cerus
  • Patent number: 5994461
    Abstract: A high voltage electrical insulator formed from a curable liquid silicone rubber composition, and subsequently cured, a composition consisting essentially of(A) 100 weight parts of a fluid mixture of polyorganosiloxane comprising(a) at least 5 weight percent of a polyorganosiloxane resin comprising repeating units selected from the group consisting of SiO.sub.4/2 and RSiO.sub.3/2, where R is a monovalent hydrocarbon group, and(b) polydiorganosiloxane having a viscosity in the range from about 100 mPa.multidot.s to 100,000 mPa.multidot.s, that contains at least 2 silicon-bonded alkenyl groups in each molecule,(B) 1 to 100 weight parts microparticulate silica,(C) polyorganohydrogensiloxane that contains at least 2 silicon-bonded hydrogen atoms in each molecule, in a quantity that provides a value from 0.
    Type: Grant
    Filed: June 25, 1998
    Date of Patent: November 30, 1999
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Akito Nakamura, Yasumichi Shigehisa, Yuichi Tsuji
  • Patent number: 5994436
    Abstract: A ductile, gamma radiation resistant olefin polymer composition, including (a) an olefin in polymer, (b) an amount of N,N-dialkylhydroxylamine which is effective to increase the ductility of the composition, and (c) a polysiloxane which contains sterically hindered piperidino groups and which is present in an amount effective to increase the gamma radiation resistance of the composition. The composition may be used to manufacture sterilizable articles including food packaging and medical articles.
    Type: Grant
    Filed: December 18, 1997
    Date of Patent: November 30, 1999
    Assignee: Montell North America Inc.
    Inventor: Teresa A. Pierson
  • Patent number: 5990185
    Abstract: A preformed stabilizer composition based on a precursor stabilizer obtainable by reacting a silicon atom containing compound of formula R.sub.n SiX.sub.4-n or R.sub.n Si((--OSi(R.sup.1).sub.2).sub.p X).sub.4-n wherein the R groups are independently saturated or unsaturated hydrocarbyl groups, at least one R group being an olefinically unsaturated hydrocarbyl group; R.sup.1 is a hydrocarbyl group, X is a C.sub.1 to C.sub.10 alkoxy group, n is an integer from 1 to 3 and p is an integer greater than zero, with a polyether polyol having an average molecular weight in excess of 400 and a hydroxyl number in the range 20 to 280 is used to manufacture polymer polyol compositions having a combination of (a) high polymer content, from 30 weight percent to 60 weight percent, (b) lower viscosities, typically less than 9,000 centipose, (c) product stability such that 100% passes through a 150 mesh screen, and (d) up to 100% of the polymer solids content passes through a 700 mesh screen.
    Type: Grant
    Filed: March 19, 1998
    Date of Patent: November 23, 1999
    Assignee: The Dow Chemical Company
    Inventor: Graeme Douglas Fogg
  • Patent number: 5985371
    Abstract: The invention provides a primer composition comprising (I) an organoalkoxysilane or siloxane, (II) an organohydrogensiloxane having an SiH group and an alkoxysilyl group, and (III) an organic titanate. Also provided is a primer composition comprising (A) an alkenyl-containing organopolysiloxane, (B) an organopolysiloxane, (C) an organoalkoxysilane or siloxane, (D) an organohydrogensiloxane having an SiH group and an alkoxysilyl group, (E) a platinum catalyst, (F) an organic titanate, and (G) an organic peroxide. The primer compositions have sufficient adhesion to join thermoset silicone rubber to various substrates.
    Type: Grant
    Filed: December 4, 1997
    Date of Patent: November 16, 1999
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazutoshi Fujioka, Takashi Kondou
  • Patent number: 5985991
    Abstract: The invention relates to a RTV silicone composition having increased hot oil resistance upon curing. The RTV silicone composition comprises a polydiorganosiloxane, an acyloxy-functional crosslinker, a metal salt of a carboxylic acid catalyst, a filler, and a metal acetate. In a preferred embodiment a metal acetylacetonate is also added.
    Type: Grant
    Filed: June 10, 1997
    Date of Patent: November 16, 1999
    Assignee: Dow Corning Corporation
    Inventors: Philip David Beljanski, Peter James Houck, Loren Dale Lower
  • Patent number: 5986018
    Abstract: A liquid curable resin composition comprising a dialkylpolysiloxane particles with at least two urethane bonds and/or urea bonds in the terminal groups. The resin composition exhibits superior shelf life in a liquid state and produces cured products having a slippery surface. It is suitable as a coating material for optical fibers, particularly as a ribbon matrix material and a bundling material.
    Type: Grant
    Filed: February 20, 1998
    Date of Patent: November 16, 1999
    Assignees: DSM N.V., JSR Corporation
    Inventors: Yoshikazu Yamaguchi, Zen Komiya, Takashi Ukachi
  • Patent number: 5981641
    Abstract: Provided are a thermally conductive silicone composition, a thermally conductive material and a thermally conductive silicone grease, wherein a liquid silicone, an aluminum nitride powder and a zinc oxide powder are comprised, and wherein the total amount of those powders are from 500 to 1,000 parts by weight per 100 parts by weight of the liquid silicone and the ratio of the zinc oxide powder to the sum total of the aluminum nitride powder and the zinc oxide powder is from 0.05 to 0.5 by weight.
    Type: Grant
    Filed: August 8, 1997
    Date of Patent: November 9, 1999
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takayuki Takahashi, Masahiko Minemura, Takashi Ohkawara