Patents Examined by Marrin M. Lateef
  • Computer fan assembly
    Patent number: 6311767
    Abstract: A computer fan assembly is described which may be constructed so as to be suitable for use in enclosures for notebook computers or laptops. A heat pipe may be secured to a housing of the computer fan assembly. The heat pipe may be located in a position so that heat is transferred away from the heat pipe by air passing through the housing. Heat may, for example, be conducted from the heat pipe and then convected by means of fins to the air passing through the housing.
    Type: Grant
    Filed: May 26, 1999
    Date of Patent: November 6, 2001
    Assignee: Intel Corporation
    Inventors: Shuji Inoue, Toshiki Ogawara, Michinori Watanabe