Abstract: According to the present invention, a technique for controlling the flow of plastic encapsulant which is applied over an integrated circuit (I/C) chip wire bonded to wire pads formed on a chip carrier substrate is provided. This technique includes applying a barrier material to the substrate surrounding the wire bond pads, which barrier material is in the form of two walls projecting upwardly from the surface thereof, and defining a well between the walls to confine the flow of the encapsulant material. This prevents the encapsulant material from flowing past a desired defined boundary and covering the circuit connection pads which are not intended to be covered.
Type:
Grant
Filed:
March 17, 1998
Date of Patent:
February 9, 1999
Assignee:
International Business Machines Corporation
Inventors:
James W. Fuller, Jr., Mary Beth Fletcher, Joseph Alphonse Kotylo, Jeffrey Alan Knight, David Michael Passante, Allen F. Moring