Patents Examined by Mary I Omori
  • Patent number: 11103862
    Abstract: A honeycomb filter includes a pillar-shaped honeycomb structure having porous partition walls provided, surrounding a plurality of cells which serve as fluid through channels extending from an inflow end face to an outflow end face, and porous plugging portions provided either at the ends on the inflow end face or the outflow end face of the cells, wherein the plugging portions are composed of a porous material, the honeycomb structure has a central region and a circumferential region and a ratio of an area of the circumferential region with respect to that of the central region ranges from 0.1 to 0.5, and a plugging length L1 in the cell extending direction of a central plugging portion in the central region is smaller than a plugging length L2 of a circumferential plugging portion in the circumferential region, L1 ranges from 3 to 6 mm, and L2 from 7 to 9 mm.
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: August 31, 2021
    Assignee: NGK Insulators, Ltd.
    Inventor: Fumihiko Yoshioka
  • Patent number: 11047038
    Abstract: A metallization for a thin-film component includes at least one layer composed of an Mo-based alloy containing Al and Ti and usual impurities. A process for producing a metallization includes providing at least one sputtering target, depositing at least one layer of an Mo-based alloy containing Al and Ti and usual impurities, and structuring the metallization by using at least one photolithographic process and at least one subsequent etching step. A sputtering target is composed of an Mo-based alloy containing Al and Ti and usual impurities. A process for producing a sputtering target composed of an Mo-based alloy includes providing a powder mixture containing Mo and also Al and Ti and cold gas spraying (CGS) of the powder mixture onto a suitable support material.
    Type: Grant
    Filed: August 10, 2015
    Date of Patent: June 29, 2021
    Assignee: Plansee SE
    Inventors: Harald Koestenbauer, Judith Koestenbauer, Gerhard Leichtfried, Joerg Winkler, Moo Sung Hwang, Martin Kathrein, Elisabeth Eidenberger
  • Patent number: 11033849
    Abstract: The honeycomb structure includes a pillar-shaped honeycomb structure body that includes a porous partition wall. When the thickness (?m) of the partition wall is defined as T1 and, among pores formed in the partition wall, the value of an average pore diameter (?m) of specific pores whose pore diameters measured by a mercury press-in method are 20 to 100 ?m is defined as D(20 to 100), T1/D(20 to 100) that is a value obtained by dividing T1 by D(20 to 100) is not less than 2.4, a ratio of a pore volume of the specific pores to an overall pore volume of the partition wall is 5 to 45%, and a ratio of a pore volume of large pores whose pore diameters are not less than 100 ?m to the overall pore volume of the partition wall is not more than 5%.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: June 15, 2021
    Assignee: NGK Insulators, Ltd.
    Inventors: Tomohiro Ishioka, Hirotaka Yamamoto
  • Patent number: 11027269
    Abstract: A plugged honeycomb structure, including: a plurality of honeycomb segments, a bonding layer and a circumferential wall disposed to surround circumference of a honeycomb segment bonded body where the plurality of honeycomb segments are bonded, wherein in the bonding layer, the bonding layer at a part that bonds the honeycomb segments disposed in contact with the circumferential wall is a circumferential bonding layer, and the bonding layer at a part that bonds the honeycomb segment including a center of gravity in a cross section orthogonal to the extending direction of cells of the honeycomb segment bonded body or at a position closest to the center of gravity and another honeycomb segment adjacent to the honeycomb segment is a center bonding layer, and a bonding strength A1 of the circumferential bonding layer is larger than a bonding strength A2 of the center bonding layer.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: June 8, 2021
    Assignee: NGK Insulators, Ltd.
    Inventor: Kazuya Yuki
  • Patent number: 11020733
    Abstract: A honeycomb structure includes a pillar-shaped honeycomb structure body having porous partition walls surrounding a plurality of cells which extend from a first to a second end face and which form flow channels of a fluid, and a circumferential wall enclosing the partition walls, wherein, specific cell of the cells is provided with a pair of projection which projects into the cell from the partition wall, the projection projects, in at least a pair of opposed partition walls among the partition walls constituting the cell, into the cell from a first and a second side, and which is provided continuously in a direction the cell extends, and in the case where the width of a top part of the projection is denoted by W1, and the width of a bottom part of the projection is denoted by W2, W1>W2 holds, and W2/W1 is 0.5 to 0.9.
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: June 1, 2021
    Assignee: NGK Insulators, Ltd.
    Inventors: Yuki Takamuro, Takashi Kinoshita
  • Patent number: 11014080
    Abstract: A columnar honeycomb structure comprising an outer peripheral side wall having an outer peripheral side surface; a plurality of partition walls that partition and form a plurality of cells penetrating from one bottom surface to another bottom surface to form flow paths, the plurality of partition walls being disposed inside the outer peripheral side wall; and a pair of terminal connection portions arranged on the outer peripheral side wall, wherein the honeycomb structure satisfies a relationship of H1>H2 in which: H1 represents an average height of the entire honeycomb structure; and H2 represents an average height of a portion of the honeycomb structure surrounded by a straight line M1 parallel to a line segment M and located at a distance of 0.1×L1 from the line segment M toward a first direction and a straight line M2 parallel to the line segment M and located at a distance of 0.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: May 25, 2021
    Assignee: NGK Insulators, Ltd.
    Inventor: Naoya Takase
  • Patent number: 10988832
    Abstract: A titanium-containing structure made of a titanium material includes: a package made of a commercially pure titanium material; and a filler packed into the package, wherein an internal pressure of the package is 10 Pa or less, the pressure being an absolute pressure, and wherein the filler includes at least one selected from titanium sponge, titanium briquette, and titanium scrap, and the filler has the same type of a chemical composition of the commercially pure titanium material. This titanium-containing structure enables production of a titanium product by performing hot working and eliminating the conventional melting step and forging step.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: April 27, 2021
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Yoshihisa Shirai, Hideki Fujii, Tomoyuki Kitaura
  • Patent number: 10987891
    Abstract: The invention relates to a method for producing a folding core (50, 190, 300, 360, 370, 380) for a lightweight structure, wherein in a first method step bending lines (70, 170, 180) are applied onto a deformable flat semi-finished product (40).
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: April 27, 2021
    Inventor: Karsten Pietsch
  • Patent number: 10961635
    Abstract: A light-weight composite material with enhanced structural characteristics includes, in one embodiment, a compositionally modulated nanolaminate coating electrically deposited into an open, accessible void structure of a porous substrate. As a result of including a nanolaminate within the void structure, the composite can include a greater amount of nanolaminate material per unit volume than can be achieved by depositing a nanolaminate material solely on a two-dimensional surface. In addition, the nanolaminate material as well as other material electrodeposited to form the composite is compositionally modulated so that discontinuities between layers are minimized and potentially eliminated. The light-weight but structurally enhanced composite material can be used in a number of different applications including, but not limited to, ballistic applications (e.g., armor panels or tank panels), automotive protection applications (e.g., car door panels, racing shells) and sporting equipment applications (e.g.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: March 30, 2021
    Assignee: MODUMETAL, INC.
    Inventor: John D. Whitaker
  • Patent number: 10953394
    Abstract: A honeycomb structure, including: a honeycomb structure body having a porous partition walls which are disposed to define a plurality of cells and a circumferential wall, wherein the partition walls are provided with protrusions which protrude to extend into the cells and are continuously disposed in an extending direction of the cells, the cells have a polygonal shape in a cross section orthogonal to the extending direction of the cells, the plurality of cells include a plurality of specific cells having at least one place where two sides each of which is provided with a different number of protrusions intersect each other, and in the cross section orthogonal to the extending direction of the cells, disposition directions of the shapes of the cells including the protrusions in the specific cells are different in one specific cell and other specific cells other than the one specific cell.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: March 23, 2021
    Assignee: NGK Insulators, Ltd.
    Inventor: Yoichi Aoki
  • Patent number: 10950570
    Abstract: There is provided a bonding wire that improves bonding reliability of a ball bonded part and ball formability and is suitable for on-vehicle devices. The bonding wire for a semiconductor includes a Cu alloy core material, and a Pd coating layer formed on a surface of the Cu alloy core material, and is characterized in that the Cu alloy core material contains Ni, a concentration of Ni is 0.1 to 1.2 wt. % relative to the entire wire, and a thickness of the Pd coating layer is 0.015 to 0.150 ?m.
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: March 16, 2021
    Assignees: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD., NIPPON MICROMETAL CORPORATION
    Inventors: Tetsuya Oyamada, Tomohiro Uno, Hiroyuki Deai
  • Patent number: 10941303
    Abstract: Embodiments of the disclosure provide a chamber component for use in a plasma processing chamber apparatus. The chamber component may include a coating layer that provides a fluorine-rich surface. In one embodiment, a chamber component, for use in a plasma processing apparatus, includes a body having an outer layer comprising yttria having a coating layer formed thereon, wherein the coating layer comprises a yttrium fluoride containing material.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: March 9, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Mats Larsson, Yogita Pareek, Jianqi Wang, Kevin A. Papke
  • Patent number: 10906236
    Abstract: An article includes a body that has a solid shell that encloses an interior region. The interior region has a solid sub-region, a lattice sub-region, and a hollow sub-region that are exclusive of each other and distributed based on load path. In an example, the article is a spoiler cap, such as for the spoiler on a vehicle.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: February 2, 2021
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Hongyi Xu, David D. Friske, Siddharthan Selvasekar, Ellen Lee, Ching-Hung Chuang, John Jeffrey Pfeiffer
  • Patent number: 10858751
    Abstract: A surface-treated steel sheet for cans forming a coating of a compound containing chiefly Zr and containing F, the amount of Zr being 80 to 200 mg/m2 and the amount of F being not less than 12 mg/m2 in the coating on the surface that becomes the outer surface side of the can. The surface-treated steel sheet is capable of effectively preventing the resin coating from peeling on the outer surface side of the can at dented portions.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: December 8, 2020
    Assignees: TOYO SEIKAN CO., LTD., TOYO KOHAN CO., LTD.
    Inventors: Mitsuhide Aihara, Wataru Kurokawa, Munemitsu Hirotsu, Kunihiro Yoshimura, Satoko Harada, Kousuke Sasaki, Masahiko Matsukawa, Miwa Uchikawa, Keisuke Yoshida
  • Patent number: 10851711
    Abstract: A temperature-following layer may be applied to a surface of components within an internal combustion engine. The temperature-following layer follows the temperature swing of adjacent gases (for example, in a combustion chamber). The temperature-following layer may be applied directly to a substrate, or the temperature-following layer may be an outer layer of a multi-layer thermal barrier coating. The multi-layer thermal barrier coating may include, for example, an insulating layer, a sealing layer bonded to the insulating layer, and a porous temperature-following layer disposed on the sealing layer. The sealing layer is substantially non-permeable and configured to seal against the insulating layer.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: December 1, 2020
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Tobias A Schaedler, Sloan Smith, Christine M Lihn, Scott M Biesboer, Russell P Durrett, Peter P Andruskiewicz, IV
  • Patent number: 10837124
    Abstract: A gallium nitride substrate has a surface with a diameter of not less than 100 mm, a difference being not less than 0.1 cm?1 and not more than 2 cm?1 between maximum and minimum values of wave numbers at a maximum peak of peaks corresponding to an E2H phonon mode in micro-Raman scattering mapping measurement at each of square regions having sides each having a length of 2 mm, the square regions being located at a total of five locations including a central location and four circumferential edge locations on the surface of the gallium nitride substrate, a difference being not more than 2 cm?1 between maximum and minimum values of the wave numbers at the maximum peak of the peaks corresponding to the E2H phonon mode at all of measurement points in the five locations.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: November 17, 2020
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Makoto Kiyama, Ryu Hirota, Seiji Nakahata
  • Patent number: 10835982
    Abstract: A sprocket wheel, which is a machine component configured to slide relative to a bushing while being in contact with the bushing in an outer peripheral surface, includes a base made of a first metal, and an overlay that covers the base so as to constitute the outer peripheral surface. The surface of the overlay constituting the outer peripheral surface has been smoothed. Such a smoothed surface of the overlay makes the sprocket wheel less damaging to the bushing.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: November 17, 2020
    Assignee: KOMATSU LTD.
    Inventors: Masayuki Ohishi, Masaharu Amano
  • Patent number: 10828631
    Abstract: A honeycomb structure includes a pillar-shaped honeycomb structure body having porous partition walls, wherein the partition walls have projecting portions, in the cells of 10% or more of the plurality of cells, the projecting portions project into the cells, a tip curvature radius R of an apex of each of the projecting portions is from 0.01 to 0.1 mm, side surfaces of the projecting portions are inclined to the surfaces of the partition walls at an inclination angle of 40 to 70°, and a relation of 0.04?H/A?0.4 is satisfied.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: November 10, 2020
    Assignee: NGK Insulators, Ltd.
    Inventor: Takashi Kinoshita
  • Patent number: 10828630
    Abstract: A honeycomb structure has grooves dented inwardly from the surfaces of the partition walls along a cell direction An open width of an open end of the groove is 0.015-0.505 mm and smaller than the open width a length of one side of each of the cells with the grooves, a bottom width of a bottom of the groove is 0.01-0.5 mm and smaller than the open width, a height from the bottom of the groove to the open end is 0.01-0.05 mm, a thickness of the partition wall in a groove portion is 50 ?m or more, a ratio of the number of the cells with the grooves to the number of the total cells is 80% or more, and a value obtained by subtracting the open frontal area when the grooves excluded from the open frontal area when the grooves included is 0.1-8.0%.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: November 10, 2020
    Assignee: NGK Insulators, Ltd.
    Inventors: Shogo Obata, Shogo Hirose
  • Patent number: 10773207
    Abstract: A conductive honeycomb structure, comprising: a columnar ceramic honeycomb structure portion comprising an outer peripheral side wall and partition walls each disposed inside the outer peripheral side wall and defining a plurality of cells penetrating from one bottom surface to another bottom surface to form flow paths; a pair of electrode layers disposed on an outer surface of the outer peripheral side wall across a central axis of the honeycomb structure portion; and a pair of metal terminals joined to the respective electrode layers via one or more welded portions, wherein each of the one or more welded portions comprises a welded area of from 2 to 50 mm2.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: September 15, 2020
    Assignee: NGK Insulators, Ltd.
    Inventor: Takashi Noro