Patents Examined by Mat Kelley
  • Bi-level injection molded leadframe
    Patent number: 5909037
    Abstract: A x-y array of light emitting diodes has insert molded leadframes to minimize manufacturing costs during assembly.
    Type: Grant
    Filed: January 12, 1998
    Date of Patent: June 1, 1999
    Assignee: Hewlett-Packard Company
    Inventors: Pradeep Rajkomar, William J. Beecher