Abstract: A mold for a display device, comprises a supporting frame; the supporting frame comprising at least one depressed pattern forming part on a first side of the supporting frame, and an organic layer removing part which is formed on a circumference of the pattern forming part, the pattern forming part depressed regions of different depths, the mold having light-blocking and light-transmitting portions corresponding to certain of the depressed pattern forming parts.

Abstract: An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition.