Patents Examined by Matthew D Sieger
  • Heat pump module and drying apparatus using the same
    Patent number: 8495822
    Abstract: A heat pump module and a drying apparatus having the same are provided. The heat pump module may include a housing, an evaporator provided in the housing that condenses humid air introduced into the housing via evaporation of a refrigerant, a condenser provided in the housing that heats the air having passed through the evaporator via condensation of the refrigerant, and at least one condensed water guide or remover provided in the housing that removes condensed water generated on a surface of the evaporator therefrom.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: July 30, 2013
    Assignee: LG Electronics Inc.
    Inventors: Na Eun Kim, Cheol Soo Ko, Young Min Kim