Patents Examined by Matthew Dias
  • Electrically conductive adhesives
    Patent number: 10629323
    Abstract: Disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) electrically conductive powders comprised of silver particles and surface coated copper particles, and optional (c) solvent.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: April 21, 2020
    Assignee: DUPONT ELECTRONICS, INC.
    Inventors: Minfang Mu, Dan Feng, Jose Manuel Rodriguez-Parada