Abstract: The present disclosure relates to a pressure sensitive adhesive assembly suitable for bonding to a substrate provided with an uneven surface, wherein the pressure sensitive adhesive (PSA) assembly comprises a polymeric foam layer comprising a polymeric base material, and having a complex viscosity comprised between 2,000 Pa·s to 80,000 Pa·s, when measured at 120C according to the test method described in the experimental section. The present disclosure is also directed to a method of applying a pressure sensitive adhesive assembly to a substrate provided with an uneven surface, and uses thereof.

Abstract: A sublimation transfer sheet including a backing layer positionable between overlapping end portions of the sublimation transfer sheet, method of using the same, and object decorated with method of using the same. Preferably, the backing layer is an absorbent layer. Also preferably, the backing layer is secured to a side of a release layer facing away from a side of the release layer having dyes or inks thereon.

Abstract: Apparatuses and methods for applying a transfer material onto the surface of an article are disclosed, including apparatuses and methods of transfer printing on and/or decorating three-dimensional articles, as well as the articles printed and/or decorated thereby. In some cases, the apparatuses and methods involve providing a deposition device, such as a printing device; providing a transfer component; depositing a material onto a portion of the transfer component with the deposition device; modifying the portion of the transfer component with the transfer material thereon to conform the transfer component to at least a portion of the surface of the three-dimensional article; and transferring the transfer material onto the surface of the article.

Abstract: Wafers are aligned with one another by reference to features formed on or in each wafer. A method includes forming a first pivot-notch, a first stop-notch, and a first bias-notch in a first wafer by reference to first features formed on or in the first wafer. Also formed is a second pivot-notch, a second stop-notch, and a second bias-notch in a second wafer by reference to second features formed on or in the second wafer. A first wafer is mounted in an aligning device, wherein a two-contact element enters into the first pivot-notch, and a single-contact element enters the first stop-notch. The second wafer is mounted in the aligning device, wherein the two-contact element enters into the second pivot-notch, and the single-contact element enters the second stop-notch. A biasing force is exerted onto surfaces of the first and second bias-notches to align the first features with the second features.

Abstract: The present invention includes a method for the attachment of a bracket to a panel structure comprising providing an adhesive for attaching the bracket to the panel structure; placing the bracket in a desired location on the panel structure; heating the adhesive; and hardening the adhesive so the bracket is adhered to the panel structure.

Abstract: The invention relates to a novel type of sacrificial polymer or support material for 3D printing, comprising a block copolymer consisting of: at least one partially or totally hydrophilic elastomeric block, with a Tg of less than 30° C. and comprising at least one hydrophilic monomer, and at least one water-soluble thermoplastic block with a Tg of greater than 30° C. and comprising at least one monomer bearing a carboxyl group, said copolymer being extrudable and granulable, said copolymer being partially or totally soluble in water or in aqueous medium, and the mass proportion of the thermoplastic block being greater than 50% of the weight of said copolymer.

Abstract: Embodiments include a system and method for applying a masking material to a glass unit. In an embodiment, the method can include applying a masking material to a roller, cutting the masking material on the roller, and transferring the masking material from the roller to a glass unit. Other embodiments are also included herein.

Abstract: An apparatus for the transverse welding of a tape traveling in a machine direction, comprising: a stationary structure, a rotary structure rotatable with respect to the stationary structure about a rotation axis perpendicular to said machine direction, a plurality of welding units carried by said rotary structure and spaced apart in a circumferential direction, wherein each of said welding units comprises an inner welding element fixed relative to the rotary structure and an outer welding element cyclically movable with respect to the rotary structure between a release position and an operative position, and vice versa, wherein each of said outer welding elements during the movement from said release position to said operative position, and vice versa, performs an angular rotation movement about a respective radial axis perpendicular to said rotation axis, and a linear translation movement along said radial axis.

Abstract: A method of binding a first item to a second item includes: loading the first item and the second item into a sealed chamber defined by a housing; dispensing an adhesive agent through a dispenser in the chamber at a location where the first item contacts the second item; and directing a curing source to cure the adhesive agent with a curing device.

Abstract: A graft copolymer comprising: a core polymer comprising a crosslinked or non-crosslinked polysaccharide, a plurality of primary graft polymers covalently grafted to the core polymer, a plurality of secondary graft polymers covalently grafted to each primary graft polymer, an injectable dermal aesthetic formulation comprising such a graft copolymer and a method of preparing such a graft copolymer.

Abstract: One aspect relates to a method for producing an electronic module assembly. According to the method, a curable first mass extending between a substrate assembly and a module housing is cured while a circuit carrier of the substrate assembly has at least a first temperature. Between a side wall of the module housing and the substrate assembly, an adhesive connection is formed by curing a curable second mass. Subsequent to curing the first mass, the circuit carrier is cooled down to below a second temperature lower than the first temperature. Embodiments of the electronic module assembly are also described.

Abstract: Example embodiments relate to a manufacturing device of an anti-reflecting structure and a method for manufacturing the anti-reflecting structure. The manufacturing device of an anti-reflecting structure includes a carrier film on which a stamp structure is formed, an unwinding unit which unwinds the carrier film, a substrate support unit which provides a target substrate to the carrier film, a pressing unit which applies pressure to the carrier film so that a resin provided in the stamp structure is provided to the target substrate, and a winding unit which winds the carrier film from which an anti-reflecting pattern is transferred to the target substrate, wherein the pressing unit includes a chamber which stores the target substrate, and a vent hole formed in the chamber, and air within the chamber is discharged through the vent hole to lower the air pressure in the chamber and apply pressure to the carrier film.

Abstract: A technique for stable, high-speed treatment of reinforcement fiber. In a state where a unidirectional fiber bundle is held between a supporting surface of a support and a pressing surface of a resonator ultrasonically vibrating in a pressing direction perpendicular to the supporting surface, a pressed part of the unidirectional fiber bundle pressed by the pressing surface is moved in a longitudinal direction of the unidirectional fiber bundle. By doing so, the unidirectional fiber bundle can be stably treated at high speed when the unidirectional fiber bundle is opened or impregnated with a resin.

Abstract: A number of variations may include a product that may include a final part that may include a first part that may include a first face and may define at least one through hole and a second part that may include a second face, at least one stake, and at least one energy director that may be disposed between the first face and the second face wherein the first face and the second face may be abutted against one another and the at least one stake may be passed through the at least one through-hole and the first part and the second part have been ultrasonically staked and ultrasonically welded such that an ultrasonically welded interface may be formed between the first part and the second part.

Abstract: The present invention is an equipment and a method for handling web materials, in particular for recombining portions as are cut out from an essentially continuous web material machine-directionally offset with this web.

Abstract: A method of making a temporary tattoo that in one embodiment art is placed onto a non-stick panel. An absorbent layer with an adhesive side down is placed over the art where the adhesive sticks to both the art and the non-stick panel. An impermeable layer with an adhesive side is stuck completely over the art and at least partially covering the absorbent layer. The then combined art stuck to the absorbent layer in turn stuck to the impermeable layer is removed from the non-stick panel and is placed on the skin for a predetermined period of time while the art is transferred onto the skin using only skin generated moisture captured in the absorbent layer by the impermeable layer.

Abstract: A method is used for a pair of bonding composite materials that are each provided with a melting material and a heat-resistant material. Each heat-resistant material includes a heat-resistant member and a binder member. The ceramic separators have ceramic layers that face each other and that are bonded. An ultrasonic wave is applied to the composite materials while applying a pressure thereto with a processing member. Also heat is applied to the binder members with a heating member. Here, the heater heats the binder members to a temperature that is greater than or equal to the glass transition temperature of the binder members and less than the melting point of the binder members.

Abstract: During a method for forming a structural panel, a core structure is formed that includes a plurality of corrugated ribbons and a plurality of walls. Each of the corrugated ribbons is laterally between a respective adjacent pair of the walls. Each of the corrugated ribbons includes a plurality of baffles and a plurality of porous septums. Each of the porous septums is longitudinally between a respective adjacent pair of the baffles. The forming of the core structure includes bonding a first of the walls to a first of the corrugated ribbons and subsequently bonding a second of the walls to the first of the corrugated ribbons. The core structure is bonded to a first skin. The core structure is bonded to a second skin. The core structure is vertically between the first skin and the second skin, and the first skin is configured with a plurality of perforations.

Abstract: A method for ultrasonic welding of materials, comprising generating ultrasonic waves in a welding assembly; transmitting the generated waves along the welding assembly in a first direction; receiving the generated waves in a sonotrode, the waves entering the sonotrode while propagating along the first direction; causing the received waves within the sonotrode to propagate along a second direction, perpendicular to the first direction; and oscillating a welding surface of the sonotrode using peaks and valleys of the waves propagating in the second direction.

Abstract: A method and apparatus for forming pouches and/or bags is disclosed. A seal and/or insert is crushed using a multiphase sealer or crusher.