Abstract: In the case of a process for the manufacture of contact strips, in particular for electrolyzers (membrane cells), the objective is to provide a solution that allows to create a cheap but also extremely efficient method for the manufacture of such contact strips at a high electrical efficiency. This objective is achieved by applying the roll bonding method to attach a copper strip to a titanium strip.

Abstract: A device for centering and internal clamping of tubular parts such as metal conduits, placed end-to-end so as to be welded to form metal pipelines is provided.

Abstract: An iso-grid composite component includes a spacer transverse to a uni-tape ply bundle, the spacer interrupted by the uni-tape ply bundle.

Abstract: Disclosed herein is a hard film containing boron and carbon, wherein the hard film includes a plurality of concave portions and a plurality of convex portions formed on a surface of the hard film, and wherein carbon concentration in the concave portion is higher than that in the convex portion and boron concentration in the convex portion is higher than that in the concave portion. Further, disclosed herein is a method of manufacturing a sliding part having a hard film containing boron and carbon disposed over a substrate; wherein the hard film is manufactured by using at least one of an unbalanced magnetron sputtering method or a high power pulsed magnetron sputtering method, both sputtering methods using a target containing at least one of elements of silicon, chromium, titanium, and tungsten and a boron carbide target.

Abstract: The present invention relates to a method and apparatus of forming a sputter target assembly having a controlled solder thickness. In particular, the method includes the introduction of a bonding foil, between the backing plate and the sputter target, wherein the bonding foil is an ignitable heterogeneous stratified structure for the propagation of an exothermic reaction.

Abstract: There is provided a flux for soldering and a soldering process which form better solder connection without the occurrence of the poor connection nor the insulation degradation. Such flux which is placed between a solder portion formed on a first electrode and a second electrode when the first electrode is soldered to the second electrode contains: a liquid base material made of a resin component which is dissolved in a solvent, an active component which removes an oxide film, and a metal powder made of a metal of which melting point is higher than that of a solder material which forms the solder portion, and the flux contains the metal powder in an amount in the range between 1% and 9% by volume based on a volume of the flux.

Abstract: When electrodes of a BGA plated by electroless Ni plating are soldered with solder balls of a lead-free solder, peeling of soldered joints readily takes place under an external impact. When a BGA electrode plated by electroless Ni plating is soldered with a lead-free solder to which 0.03-0.1 mass percent of P is added, the growth of brittle SnNi intermetallic compounds formed on the portion being soldered and a P layer on the electroless Ni plating surface is suppressed, resulting in an increased bonding strength.

Abstract: The present invention relates to a method of making cutting tools comprising a substrate having a hard phase and a binder phase, the method comprising forming green powder compacts using powder metallurgical techniques, charging the green powder compacts, placed on one or several trays, in a furnace and sintering the green powder compacts wherein the furnace comprises an insulation package, at least three individually controlled heating elements located inside the insulation package including a vertical heating element, an upper horizontal heating element arranged in an upper part of the furnace, and a lower horizontal heating element arranged in a lower part of the furnace, wherein operating the at least three heating elements such that an average controlled cooling rate from a sintering temperature down to at least a solidification temperature of the binder phase is 0.1-4.0° C./min, and a sintering furnace operable to obtain a controlled cooling rate.

Abstract: An air cushion pad includes at least two sheet members, which are made of resilient materials. Each sheet member forms a plurality of hollow tubes projecting therefrom and the tubes are connected to each other by a substantially flat plate. The tubes of one sheet member and the tubes of the other sheet member are alternately fit to each other in an opposing manner to form the air cushion pad. When an external impact force is applied in a top down manner, the air cushion pad absorbs the impact force and undergoes sideways deformation so as to convert the impact force into a transverse to thereby realize shock absorption and eliminate damage caused by downward action of the impact force to provide the function of protection.

Abstract: Methods for fabricating sub-lithographic, nanoscale linear microchannel arrays over surfaces without defined features utilizing self-assembling block copolymers, and films and devices formed from these methods are provided. Embodiments of the methods use a multi-layer induced ordering approach to align lamellar films to an underlying base film within trenches, and localized heating to anneal the lamellar-phase block copolymer film overlying the trenches and outwardly over the remaining surface.

Abstract: Compositions, structures and methods that relate to films having switchable reflectivity and anti-reflectivity depending on ambient conditions, such as temperature. A film with switchable reflectivity and anti-reflectivity includes a nanostructured first layer having nanopillars associated with nanowells. A hydrogel occupies at least a portion of the nanowells. As the hydrogel moves from a dehydrated state to a hydrated state, the surface of the film switches from being reflective to being anti-reflective in a repeatable and reversible process.

Abstract: A method for producing a surface on a component, which has regions having different wettabilities with respect to a solder. The method includes forming a first metallic layer on the component and forming a second metallic layer on the first metallic layer, the second metallic layer preventing oxidation of the first metallic layer. The method furthermore includes removing the second metallic layer with the aid of a laser in a predefined surface region for exposing the first metallic layer, and oxidizing the exposed first metallic layer on the surface, which results in a wettability with respect to a solder in the predefined surface region that is less than in a surface region adjacent to the predefined surface region.

Abstract: A solder is deposited on a heat sink. The solder is first reflowed at a first temperature that is below about 120° C. The solder is second heat aged at a temperature that causes the first reflowed solder to have an increased second reflow temperature. The heat aging process results in less compressive stress in a die that uses the solder as a thermal interface material. The solder can have a composition that reflows and adheres to the die and the heat sink without the use of organic fluxes.

Abstract: A coated article is described. The coated article includes a substrate, a magnesium oxide-alumina compound layer formed on the substrate, and an anti-fingerprint layer formed on the magnesium oxide-alumina compound layer. The anti-fingerprint layer is a layer of magnesium-aluminum-oxygen-fluorine having the chemical formula of MgAlOxFy, wherein 0<x<2.5, 0<y<5. A method for making the coated article is also described.

Abstract: The disclosed embodiments concern a curved structural part composed of a composite material with reinforced, continuous fibers whose cross section includes at least two wings, with said fibers extending from one wing to the other, with said structural part having a variation in the width of its section parallel to the local radius of curvature. The structural element that results from assembling the parts in the disclosed embodiments therefore has local widening of the section at the connections between the parts constituting a structural element, such as an aircraft fuselage frame, and widening at the connection with the floor profiles, if such a profile is used to make an aircraft fuselage structure. The disclosed embodiments also concern a process for manufacturing such a part, as well as a device for advantageously implementing such a process.

Abstract: The present invention provides a friction stir welder that includes a stage on which at least two material pieces to be welded are mounted and stacked, a pressing member that covers and presses end faces of the material pieces to be welded that are mounted and stacked on the stage, and a rotary tool that is inserted into the stacked material pieces to be welded while rotating, so that a plastic flow is generated at an interfacing portion as well as in the vicinity thereof between the rotary tool and the material pieces to be welded, thereby to joint the material pieces to be welded to each other.

Abstract: A cutting tool with a substrate which is coated with a coating layer containing TiaAlbNbdMe(C1-xNx), where M represents one or more elements selected from among Si, W, Mo, Ta, Hf, Cr, Zr and Y, where 0.1?a?0.7, 0?b?0.8, 0.02?d?0.25, 0?e?25, a+b+d+e=1.0 and 0?x?1 and is provided with a rake face; a flank face; a cutting edge between the rake face and the flank face; and droplets on the surface of the coating layer. The droplets include finer droplets having particle diameters of 300 nm or less; and coarser droplets having particle diameters of 1000 nm or more. The flank face has a higher percentage of the finer droplets than the rake face. An Nb content in the coarser droplets on the flank face is higher than an Nb of the coarser droplets on the rake face.

Abstract: A unitized assembly comprises a fiber metal laminate having at least one additive layer deposited thereonto such as by friction stir welding. The fiber metal laminate comprises metallic and non-metallic plies and having an innermost metallic ply. The innermost metallic ply and the additive layer are each sized and configured to facilitate the generation of thermal energy sufficient to deposit the first additive layer to the innermost metallic ply during the friction stir welding process. The additive layer is sized and configured to minimize thermal loads in the innermost metallic ply during deposition thereof. The unitized assembly may be formed using a stock member such as a metallic plate from which the innermost metallic ply may be machined. The metallic and non-metallic plies may be laid up over the innermost metallic ply. The substructure elements may be machined from the metallic plate.

Abstract: A method for securing electronic components, in particular power semiconductor components such as diodes, transistors or thyristors, and connection elements, to a substrate by pressure sintering. The method includes: applying a pastelike layer, made up of a metal powder and a solvent, to a supporting film; drying the pastelike layer; applying at least one component to the dried layer; subjecting the at least one component, the supporting film and the dried layer to pressure, as a result of which the adhesive force between the layer and the component becomes greater than that between the layer and the supporting film; lifting off the at least one component, with the layer adhering to it, from the supporting film; positioning the component, with the layer adhering to it, to the substrate; and subjecting the substrate and the component to pressure, for connecting them by sintering.

Abstract: A basecoat including a pigment blend, the pigment blend including at least a calcined clay and a hyper-platy clay, the hyper-platy clay having a shape factor of at least about 40:1.