Abstract: Blends of diaminoisopropylbenzene (DAIBP) and diaminoethylbenzene (DAEB) are provided for curing epoxy resins. The cured epoxy resins have increased tensile strength and slightly lower glass transition temperatures as compared with resins cured with either diamine alone.

Abstract: The silicone rubber compositions of the present invention for treatment of fiber structures are cured by a condensation reaction and are thus free from drawbacks of addition reaction curing type. The compositions contain mercaptoalkyl group-containing di- or trialkoxysilanes and aliphatic monohydroxy alcohols. As a result, even when inorganic filler content is increased in dispersion, viscosity stability was excellent, and high-strength films are readily obtained. Condensation reaction-curable silicone rubbers for treatment of fiber structure are provided which have excellent abrasion resistance and a pot life above 8 hours.

Abstract: A modified ethylenic random copolymer derived from 100 parts by weight of a base ethylenic random copolymer composed of 25 to 75 mole % of ethylene and 75 to 25 mole % of an alpha-olefin having 3 to 20 carbon atoms and grafted thereto, (a) 0.2 to 50 parts by weight of an unsaturated carboxylic acid having 3 to 10 carbon atoms or an anhydride or ester thereof, (b) 0.2 to 200 parts by weight of a styrene-type hydrocarbon having 8 to 12 carbon atoms, or (c) 0.2 to 300 parts by weight of an unsaturated silane compound having 2 to 20 carbon atoms, said modified ethylenic random copolymer having an intrinsic viscosity [.eta.], measured in decalin at 135.degree. C., of 0.01 to 1.5 dl/g and a molecular weight distribution (Mw/Mn), measured by gel permeation chromatography, of not more than 4.

Abstract: Infusible and insoluble polycarbosilanes, readily pyrolyzed into silicon carbide ceramic materials, e.g., SiC fibers, are produced by hardening a fusible polycarbosilane containing at least two .tbd.SiH groups per molecule via intimately contacting such fusible polycarbosilane with an effective hardening amount of the vapors of sulfur.

Abstract: An alkoxysilane bearing amic acid or derivative thereof is formed by reacting an aromatic or aliphatic dianhydride and an aminoalkyltrialkoxysilane or aminoaryltrialkoxysilane, or reacting an aromatic or aliphatic dianhydride and a diamine to form an amic acid which is reacted with an aminoalkylenetrialkoxysilane. A thin, hard protective silica glass network is formed by reacting the alkoxysilane bearing amic acid with an alkoxysilane, preferably tetraalkoxysilane, and an epoxy bearing silane coupling agnet in an acid catalyzed sol-gel process involving hydrolysis and condensation, which provides an amide/ester modified silica network. In a variation of this process, a polyamic acid bearing anhydride termination is prepared by reacting an excess of a dianhydride with a diamine. The product of this reaction when reacted with an aminoalkylenetrialkoxysilane provides an alkoxysilane bearing oligomeric polyamic acid.

Abstract: This invention relates to sulfur containing organopolysiloxane waxes containing(1) at least three mole percent of siloxane units of the formula ##STR1## (2) at least one mole percent of siloxane units selected from the formulas ##STR2## (3) and from 0 to 96 mole percent of siloxane units have the formula ##EQU1## where R is a monovalent hydrocarbon radical having from 1 to 10 carbon atoms, R.sup.1 is an alkyl radical linked to silicon having an average of at least 25 carbon atoms, R.sup.2 is a multivalent radical selected from a hydrocarbon radical having from 2 to 10 carbon atoms which is free of aliphatic unsaturation, a hydrocarbon ether or a hydrocarbon thioether, a is an integer of from 0 to 2, b is an integer of 1 or 2, c is an integer of 1 or 2, d is an integer of from 0 to 2, e is an integer of from 0 to 3, and the sum of a+b is 1, 2 or 3, and the sum of c+d is 1, 2 or 3.

Abstract: Thermoplastic molding compositions are provided which comprise a polyester resin alone or in combination with a poly(etherester) elastomer, a poly(etherimide ester) elastomer, or a mixture of the foregoing modified with a multi-stage polyorganosiloxane/polyvinyl-based graft polymer which exhibit materially enhanced impact strength, particularly at low temperatures, while maintaining other desirable properties without showing any tendency to delaminate. Particularly noteworthy are reductions in surface gloss and the substantially complete elimination of mottling.

Abstract: The present invention provides a process for the production of silicon-containing polyimide presursors that have a viscosity most suitable for application, and when baked, can form a coating low in hygroscopicity, heat resistant, and having powerful adhesion, and a process for their cured silicon-containing polyimide.A process for the production of silicon-containing polyimide precursors having a logarithmic viscosity number of 0.05 to 5 dl/g by reacting A.sup.1 mol of fluorine-containing diacid anhydride, A.sup.2 mol of a diacid anhydride, B.sup.1 mol of a fluorine-containing diamine, B.sup.2 mol of a diamine, and C mol of an aminosilane with the mixing ratio of them such that A.sup.1, A.sup.2, B.sup.1, B.sup.2, and C are within ranges having prescribed relationships, and a process for the production of a silicon-containing polyimide by baking a solution of said precursor at 50.degree. to 500.degree. C.

Abstract: The invention relates to thermoplastic polycarbonate molding compositions containing polycarbonates, special siloxane-containing graft polymers and, optionally, lower thermoplasts and/or standard additives and to a process for the production of the polycarbonate molding compositions.

Abstract: A polyurethane resin is composed of a polyol component, a polyisocyanate component and optionally, a chain extender component. At least a portion of the polyol component or chain extender component is a siloxane polyol component represented by the following formula (1) and/or formula (2): ##STR1## wherein R means an alkyl group, R' denotes a hydrogen atom or C.sub.1-5 alkyl group, k, l and m stand for 1-250, 0-5 and 0-50 respectively, and n is an integer of 1-3 in the formula (1) and an integer of 2-3 in the formula (2). A thermal recording material containing the polyurethane resin as a heat-resistant layer is also disclosed.

Abstract: A suspension or emulsion polymerization process for the preparation of modified resin useful as a low-stress semiconductor encapsulant which comprises reacting a silicone oil or a silicone resin an having at least two silanol groups or hydrolyzable alkoxy groups with a silane coupling agent having at least two hydrolyzable alkoxy groups to form a suspension or emulsion of a reactive intermediate product, azeotropically distilling the resulting suspension or emulsion to produce a distrilled intermediate product, and adding an epoxy resin or a phenol resin to the distilled intermediate product to produce a matrix having insoluble and infusible spherical particles.

Abstract: Thermoplastic resin compositions are blended with a novel silicone-based flame retardant which also imparts good impact resistance and low temperature ductility on the thermoplastic resins. Polyorganosiloxanes are grafted with vinyl-based polymers, such as bromostyrenes, capable of exhibiting flame retarding properties and then blended with normally flammable thermoplastic resins.

Abstract: Organopolysiloxane compositions curable into elastomeric state, whether in single- or two-component form, comprise an .alpha., .omega.-dihydroxypolydiorganopolysiloxane oil, a crosslinking agent therefor, optionally, inorganic fillers and an adhesion promoter, and a catalytically effective amount of a pentacoordinated tin monochelate produced by reacting a tin bischelate with an organic carboxylic acid.

Abstract: A curable composition comprising (a) an amic acid compound and/or an imide compound each containing a silicon atom having at least one hydrolyzable group and (b) an organosilane compound represented by the formula (I): ##STR1## wherein R.sup.1 -R.sub.6, which may be the same or different, are alkyl groups of 1-10 carbon atoms or aryl groups of 6-10 carbon atoms. Said composition is suitably used for the formation of a protective film for a transparent substrate or a color filter in liquid crystal display devices.

Abstract: A new group of silane compounds in which silicon atoms are linked together by a hydrocarbon chain and which comprise phenyl groups substituted with an epoxy group or an ethenyl group. The compounds of the present invention have the formula ##STR1## where R.sub.1 is selected from the group consisting of: (a) an aliphatic hydrocarbon group containing 2 to 10 carbon atoms, and(b) a group having the formula ##STR2## where n=1 to 3m=0 to 5;R.sub.2 and R.sub.2 ' are each selected from the group consisting of an alkyl group containing 1 to 4 carbon atoms, an unsubstituted aryl group, and a substituted aryl group; and R.sub.3 is selected from the group consisting of: ##STR3## where R.sub.4, R.sub.5, and R.sub.6 ae each selected from the group consisting of H, an alkyl group containing 1 to 4 carbon atoms, and an aryl group; and n=0 to 10.

Abstract: Novel organopolysiloxanes are disclosed which comprise ##STR1## wherein R.sup.1 is methyl or phenyl, with the proviso that at least 90% of R.sup.1 is methyl; andR.sup.2 is(a) R.sup.1,(b) linear or branched alkinoxy with 3 to 25 carbon atoms, or(c) a polyalcohol with 2 to 6 hydroxyl groups from which the H-atom of the OH-groups is eliminated, with all but one of the OH-groups being etherified with allyl alcohol.The siloxanes must meet the conditions that at least one--C.tbd.C-- group is contained in the average molecule and that the numerical ratio of the --C.tbd.C-- group to the allyl ether groups is 5:1 to 1:250.The novel organopolysiloxanes, mixed with hydrogenpolysiloxanes and a catalyst, are stable at room temperatures and cure rapidly at elevated temperatures. The cured mixtures have adhesive properties and exhibit no malfunctions due to migration of portions not linked chemically. A process for preparing the organopolysiloxanes is also disclosed.

Abstract: The present invention relates to a grafted cellulose ester prepared by reacting a cellulose ester containing residual hydroxyl groups with an acrylic based compound and m-isopropenyl-.alpha.,.alpha.'-dimethylbenzyl isocyanate. The grafted cellulose ester is a urethane-containing product having pendant (meth)acrylate and .alpha.-methylstyrene moieties. The grafted cellulose ester is readily self-polymerizable in the presence of a photoinitiator upon exposure to ultraviolet radiation. It does not require the presence of vinyl monomers to become crosslinked. The grafted cellulose ester is useful as a protective/decorative coating for wood, metal, plastics, and other substrates.

Abstract: A process for preparing organopolysiloxane emulsion comprised of dispersed particles having an average particle size of 0.5.mu. or less, comprising emulsifying a liquid organopolysiloxane with use of an emulsifying agent by means of a composite emulsifying apparatus equipped with(A) a stirring means having a stirring blade capable of stirring contents of a container at a low speed over the whole of the container, and at least one stirring means selected from(B) a disc type stirring means capable of rotating at a high speed and having tooth-like projections on its peripheral edge, and(C) a stirring means having a stator and a turbine blade disposed in the inside of the stator and capable of rotating at a high speed. According to this process, an organopolysiloxane having a high viscosity up to 500,000 cP can be emulsified to prepare an emulsion of high stability.

Abstract: There are provided an alkali-soluble siloxane polymer, an alkali-soluble silmethylene polymer, and an alkali-soluble polyorganosilsesquioxane polymer. They are useful as a photoresist for the fabrication of semiconductor devices. They are suitable for dry etching because of their superior resistance to oxygen plasmas.

Abstract: The radiation-curable organopolysiloxane composition of the invention is quite free from the problem of the migration of silicone toward the surface of a body in contact with the surface of the cured film of the composition even by curing with an extremely small dose of radiation, e.g. ultraviolet light and electron beams, for curing. The mechanism for curing is in principle the radiation-induced addition reaction between the aliphatically unsaturated bonds in a first organopolysiloxane and the mercapto groups in a second organopolysiloxane but the aliphatically unsaturated bond in the first organopolysiloxane is bonded preferably remotely from the silicon atom with an electron-attractive atom or group intervening therebetween such as the divalent groups of the formula --O--CH.sub.2).sub.2 S-- and --CH.sub.2 --O--CH.sub.2 --S--.