Abstract: The stilbene epoxy resin having two different aryl groups and an epoxy resin mixture including this stilbene epoxy resin have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture of the latter stilbene epoxy resin. Compared with the conventional resins, the present resin or resin mixture has improved working and molding properties, which. shortens the time required for the molding and working process, resulting in economic advantages and a preferred affect on productivity. The present epoxy resin or resin mixture is preferably used as an adhesive, a coating, an insulating material, an electrical or electronic material for laminated sheets or the like. It is especially suited for use as material for encapsulating electronic parts.

Abstract: A water-dispersible polymer and a coating composition containing the water-dispersible polymer are disclosed. The water-dispersible polymer is prepared from: (a) an epoxy compound having about two epoxy groups, such as an epoxy resin, (b) a linking compound having (i) conjugated carbon-carbon double bonds or a carbon-carbon triple bond and (ii) a moiety capable of reacting with an epoxy group, such as sorbic acid, and (c) acrylic monomers, at least a portion of which are capable of rendering the polymer water dispersible, such as acrylic acid, wherein the epoxy portion (a) of the polymer is covalently linked to the polymerized acrylic portion (c) by linking compound (b). The coating composition contains the water-dispersible polymer, a fugitive base to solubilize the polymer, a curing agent, and a carrier containing water.

Abstract: A highly filled, curable composition comprising (A) an addition polymerizable organic liquid which on curing forms a solid polymer, (B) 20 to 80% by volume of a finely divided particulate inorganic filler having a weight average particle size of less than 50 microns but not having a BET surface area of more than 30 m.sup.2 .multidot.cm.sup.-3, and (C) 0.05 to 0.5% by weight of a polydimethylsiloxane and molded composite articles produced therefrom are disclosed. Such articles exhibit improved resilience to thermal shock.

Abstract: The invention pertains to an dual-cure silicone adhesive composition that is extrudable and flowable at room temperature in the absence of a solvent comprising (A) 40 to 95 parts of an alkenyl functional siloxane resin said resin containing 0.01 to 22 wt% alkenyl functionality; (B) 0.5 to 20 parts of a SiH containing polyorganosiloxane having an average of at least 1.7 silicon-bonded hydrogen atoms per molecule and having a viscosity of 0.8 to 2,000 mm.sup.2 /s; (C) a silane represented by monomers of the formula R.sup.1.sub.4-y Si(OR.sup.2).sub.y or oligomeric reaction products thereof; (D) a hydrosilylation catalyst in sufficient quantity to promote curing of said composition; (E) a moisture curing catalyst to promote the moisture initiated reaction of the alkoxy radicals; (F) optionally, 0.1 to 70 parts of a polydiorganosiloxane having at least two ethylenically or acetylenicaly unsaturated groups per molecule and having a viscosity of 100 to 80,000 mm.sup.

Abstract: Silicon-modified polyimides of this invention containing a basic structure of the general formula (1) ##STR1## in which R and R' are hydrogen or alkyl, B is the amineless residue of a diamine, and X is divalent radical ##STR2## in which R.sub.1 to R.sub.4 are monovalent hydrocarbon groups with 1 to 6 carbon atoms show excellent heat resistance and solubility in various solvents and are useful for films for orientation of LCD's, junction coating resins for diodes, passivation films for IC's and LSI's, and alpha ray shielding films for VLSI's.

Abstract: Our invention concerns a continuous process for producing an impact resistant polymer wherein a vinyl aromatic compound and rubber are mass polymerized under increasing temperature conditions. The reacting mass flows through multiple reactors providing distinct reaction zones wherein specific reaction conditions are maintained.