Abstract: A substrate polishing method capable of reducing an influence of variation in spectrum of reflected light from a substrate, such as a wafer, and determining an accurate film thickness is disclosed. The method includes: polishing a surface of a substrate by pressing the substrate against a polishing pad on a rotating polishing table; producing a spectrum of reflected light from the surface of the substrate each time the polishing table makes one rotation; creating a three-dimensional data containing a plurality of spectra arranged along polishing time; and determining a film thickness of the substrate based on the three-dimensional data.

Abstract: A magnetic element for strengthening a magnetic field formed in an object and an eddy current sensor using the magnetic field are provided. The eddy current sensor includes a bottom face portion which is a magnetic body, a magnetic core portion provided at the middle of the bottom face portion and a peripheral wall portion provided on the periphery of the bottom face portion. The eddy current sensor further includes an excitation coil disposed on an outer periphery of the magnetic core portion and capable of generating a magnetic field and an excitation coil disposed on an outer periphery of the peripheral wall portion and capable of generating a magnetic field.

Abstract: Diamond-containing articles such as composite materials shaped as some specific article, can be engineered such that bodies that contact the article only contact diamond. In an embodiment, the article may be in the form of equipment for handling semiconductor wafers such as vacuum or electrostatic chucks. In one embodiment, the diamond-containing article can be a composite of diamond particulate reinforcing a Si/SiC body such as reaction-bonded SiC. Lapping the diamond-reinforced RBSC body with progressively finer diamond grit removes some of the SiC/Si matrix material, leaving diamond particles of uniform height “standing proud” above the rest of the surface of the formed article. Further, if the diamond-containing article is sufficiently electrically conductive, it may be machinable using electrical discharge machining.

Abstract: A grasping and positioning tool is provided that can be used to position a channel insert within channel framing. The tool includes an expandable member that can frictionally engage the channel insert in one position of the tool and release the channel insert in another position of the tool. The tool can be used to permit single handed placement of a channel nut or similar insert into channel framing.

Abstract: The present invention provides unique portable or stationary hose retraction systems in a single compact unit having an elongated hose, a chamber or plenum for storing the hose, a primary vacuum source for creating suction in the hose, and a secondary vacuum source for retracting the hose into the chamber. Embodiments may include one or more switches located at a distal end of the hose for controlling the primary and secondary vacuum sources. Other embodiments include a movable robotic unit with a proximity generating signal at the distal end of the hose, whereby the robotic unit may withdraw the hose as needed during use, and the secondary vacuum source may retract slack in the hose during use, or may retract the entire hose and the robotic unit after use.

Abstract: A management method of a machining system includes a chuck table, a machining unit, a transfer unit that transfers a wafer onto the chuck table, a camera unit that acquires an image containing a pattern formed on a side of a front surface of the wafer, and an information recording section. The management method is applied when the pattern is recorded in association with machining conditions in the information recording section; and records in the information recording section new machining conditions to be used when machining a new type of wafer, causes an automatic machining program, which automatically machines the new type of wafer, to start, forms an image, which contains a new pattern of the new type of wafer, by the camera unit, and records the new pattern in association with the new machining conditions in the information recording section.

Abstract: A wheel elevating dock including a body member, a first plurality of ramp members attached to a first end of the body member and defining gaps between each ramp member of the first plurality of ramp members, and a second plurality of ramp members attached to a second end of the body member. The gaps defined by the first plurality of ramp members are configured to permit ramp members from an adjacent wheel elevating dock to be positioned within the gaps.

Abstract: A dust collecting treatment apparatus is connected to a dry type polishing apparatus, sucks dust-containing air from the dry type polishing apparatus, and separates the dust and the air from each other. The apparatus includes a cylindrical main body connected to the dry type polishing apparatus; a suction box disposed on an upper plate of the cylindrical main body, a suction source connected to the suction box through a ventilating duct, a filter unit that includes a flange section supported on the upper plate of the cylindrical main body, a pipe formed integrally with the flange section and formed of a plurality of minute holes, and a filter formed of a water-soluble material and externally fitted to the pipe in a detachable manner. The filter is disposed inside the cylindrical main body. A water jet nozzle is disposed inside the suction box and jets water into the filter unit.

Abstract: The method generally involves the steps of filling the cavities in a production tool each with an individual abrasive particle. Aligning a filled production tool and a resin coated backing for transfer of the abrasive particles to the resin coated backing. Transferring the abrasive particles from the cavities onto the resin coated backing and removing the production tool from the aligned position with the resin coated backing. Thereafter the resin layer is cured, a size coat is applied and cured and the coated abrasive article is converted to sheet, disk, or belt form by suitable converting equipment.

Abstract: There is disclosed a substrate processing apparatus which can align a center of a substrate with a central axis of a process stage with high accuracy to prevent a defective substrate from being produced. The substrate processing apparatus includes: an eccentricity detecting mechanism configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, held on the centering stage, from a central axis of the centering stage; and an aligner configured to align the center of the substrate with a central axis of a process stage. The aligner obtains, after the substrate is transferred from the centering stage to the process stage, an amount of eccentricity and an eccentricity direction of the center of the substrate from the central axis of the process stage by use of the eccentricity detecting mechanism; and confirms that the obtained amount of eccentricity of the center of the substrate from the central axis of the process stage is within a predetermined allowable range.

Abstract: The present disclosure provides a carbide blade grinding forming processing production line, relates to the field of blade processing in forming, and provides a production line for grinding forming processing of a carbide blade with inscribed circular holes, which has functions of blade grinding forming processing, blade cleaning and drying and detection of external dimension of a formed blade, and has an automatic loading and uninstalling function. In most processing course of the blade, the cutter head is taken as a carrier, and an overturning device is configured to overturn a whole cutter die box, such that integral end surface overturning of the cutter head in the cutter die box after single end surface grinding is realized, and blade filling processes in different processing links are reduced.

Abstract: A grinding device is operated by grinding of a surface of the workpiece with at least one grinding medium while recording actual data of the surface after grinding with at least one data collection device. Actual data recorded during grinding is then compared with target data stored in an electronic memory in an electronic data processing device. Based on the comparison, adjustments are made to at least one grinding parameter if a deviation of the actual data from the target data exceeds a predetermined limit.

Abstract: A method of conditioning a polishing pad includes positioning a conditioning head to bring a conditioning pad into contact with a polishing surface of a polishing pad. The method further includes generating a first pressure signal using a first pressure sensor based on a force being applied to the polishing surface by the conditioning pad. The method further includes generating a surface condition signal using an optical scanner. The method further includes adjusting the positioning of the conditioning pad in response to at least one of the first pressure signal or the surface condition signal.

Abstract: There is provided a processing apparatus that polishes the back surface side of a wafer on which devices are formed on the front surface side. The processing apparatus includes a chuck table that holds the wafer and rotates and a polishing unit that forms scratches on the back surface side of the wafer while polishing the back surface side of the wafer. The processing apparatus includes also a scratch determining unit that determines whether or not the scratches exist on the back surface side of the wafer polished by the polishing unit and an informing unit that informs that a region in which the scratches do not exist is included in the wafer when a region for which it has been determined that the scratches do not exist by the scratch determining unit is included in the wafer.

Abstract: A surface cleaning apparatus such as a vacuum cleaner includes a suction source, a recovery container, and a base assembly with at least one agitator within an agitator chamber. The recovery container can be coupled to a separator assembly configured to remove dirt and debris from working fluid through the vacuum cleaner. In addition, a brake assembly can be provided on an upper portion of the base assembly and be configured to engage at least one wheel of the base assembly.

Abstract: In an automatic polishing system configured such that under control of a polishing robot and/or a polishing tool by a polishing controller, the polishing tool provides a polishing action on a polishing subject face, a color intensity measurement instrument is provided for measuring an intensity of a specified color in the polishing subject face. Based on the intensity of the specified color measured by this color intensity measurement instrument, the polishing controller controls the polishing robot and/or the polishing tool, so that an amount of polishing work by the polishing tool onto the polishing subject face is adjusted according to the intensity of the specified color.

Abstract: A grinding and/or polishing machine (10) for slabs of stone material, such as natural or agglomerated stone, ceramic or glass, comprises a support bench (12) for the slabs to be machined and at least one machining station (14) with a pair of bridge-like support structures (16, 18) arranged opposite each other with, above, a beam supporting a plurality of machining spindles (26). First relative movement means (19) move the slab in a longitudinal direction with respect to the machining station (14), while the beam moves transversely with respect to its length by means of second movement means (21). Each spindle is supported on the beam so that it can be swivelled by associated movement means (34, 35, 40, 50, 60) about an oscillation axis (33) which is parallel to, but separate from the motorized vertical axis (32) of the spindle.

Abstract: A cleaner is provided. The cleaner includes a transfer device, and a dust collecting apparatus connectable to the transfer device and configured to filter out rubbish transferred from the transfer device. The dust collecting apparatus includes a housing in which a first dust chamber is formed, and including a guide recessed inwardly from an outer surface, a handle configured to be movable on the outside of the housing and provided to cover at least a portion of the guide, a first rubbish removal member configured to be movable inside the housing based on the movement of the handle, and configured to discharge rubbish collected in the first dust chamber, and a link configured to connect the handle to the first rubbish removal member, and having a movement guided by the guide.

Abstract: An air cylinder that changes the posture of an automatic wet sanding unit main body having sandpaper mounted thereon is provided with a guide rod, and an outer circumferential surface of the guide rod has grooves that extend along a shaft centerline of the guide rod and have an arc-shaped cross-section. Balls are interposed between a bottom of each groove and an inner surface of a bush that is provided inside the air cylinder. Thus, it is possible to make two objects compatible with each other: to achieve high-accuracy automatic wet sanding by enhancing the adaptability of the sandpaper to the shape of a painted surface through a reduction of the diameter of the piston rod; and to enhance the durability of the automatic wet sanding apparatus.

Abstract: A dust collector including a body with an intake portion and an exhaust portion includes a filter, a filter support that supports the filter, a motor case protruding from an inner surface of the body, and a vibration motor accommodated in the motor case. The body accommodates the filter support. A portion on the tip side of the motor case is at a position where it is allowed to come into contact with the filter support when the vibration motor is driven.