Abstract: A system and apparatus to mount devices to a rack is disclosed. Embodiments may comprise mounting hardware configured to adaptively accommodate attachment features of a rack to mount devices such as servers to the rack. A device attachment member may couple with the device, and some of these device attachment members may comprise a bent portion to facilitate coupling the device to vertical members of a rack. Many device attachment members may have in place of or in addition to the bent portion, a slide attachment member and rack attachment slidably coupled with the device attachment member to provide tool-less attachment of the device to the rack via pins. These rack attachments may also adaptively accommodate attachment features such as round openings, square openings, and/or threaded openings of a vertical member of the rack and may advantageously provide a threaded member to secure the device attachment member to vertical members.

Abstract: A disk drive mounting system for isolating a disk drive assembly from machine vibration and shock. In one embodiment, the system includes a suspension frame and a disk drive assembly mounted to the frame using biased vibration isolation members, such as springs, which are each substantially aligned through the center of mass of the disk drive assembly. Accordingly, vibrational forces can be transmitted through the center of mass of the disk drive assembly. Preferably, the disk drive assembly includes a mounting chassis which holds a hard disk drive and includes openings through which damping bumpers can extend. In this embodiment, the bumpers each have a base portion and an extension portion, the extension portion extending through the openings in the mounting chassis to limit the transfer of shock to the disk drive. The bumpers can be attached to the suspension frame and/or to a protective cover for the assembly.

Abstract: A circuit board enclosure for housing a plurality of circuit boards has a polymer casing having upper and lower openings and an interior. The circuit board enclosure also has upper and lower heat conductive pieces formed of a metal and fitting respectively within the upper and lower openings in the casing, in a water tight sealed relationship with the casing. The upper and lower heat conductive pieces have heat transfer fins protruding from the openings in the casing. The upper and lower heat conductive pieces have an interior side facing the interior of the enclosure. The interior sides have guide grooves to receive opposing sides of the circuit board. The guide grooves of the upper and lower heat conductive pieces are substantially parallel. The polymer casing may be formed of polycarbonate. The upper and lower heat conductive pieces may be formed of aluminum.

Abstract: A modular integrated computer apparatus that includes a CPU or VLSI module connected to a printed circuit board, a power converter, and one or more associated electric power cables; and is a supporting infrastructure that ensures ease of use. The field replaceable apparatus may also function as an EMI enclosure and a heat management device. The field replaceable apparatus may be inserted and removed from a computer system by handles that are attached to the modular integrated apparatus. The installed field replaceable apparatus is positioned to ensure that the CPU module is properly connected to the printed circuit board.