Abstract: Etching residue, etching mask and silicon nitride and/or silicon dioxide are etched or removed employing a composition containing a fluoride containing compound, water and certain organic solvents.
Type:
Grant
Filed:
November 13, 1997
Date of Patent:
March 7, 2000
Assignee:
International Business Machines Corporation
Inventors:
David L. Rath, Rangarajan Jagannathan, Kenneth J. McCullough, Harald F. Okorn-Schmidt, Karen P. Madden, Keith R. Pope