Abstract: A circuit board includes an insulating substrate layer, a ground layer, an insulating layer, insulating through holes, a signal transmission layer and a polymer conductive member. The ground layer is disposed between the insulating layer and the insulating substrate layer. The signal transmission layer is disposed on one side of the insulating layer opposite to the ground layer. The insulating through holes penetrate through the signal transmission layer and the insulation layer to connect to the ground layer. The polymer conductive member is disposed within the insulating through holes, and one part thereof is electrically connected to the ground layer, and another part thereof extends outwards from the signal transmission layer.

Abstract: An electronic device includes a first electric element a second electric element, and a circuit board. The circuit board is configured to deliver a signal between the first electric element and the second electric element. The circuit board includes a first portion, a second portion, and a third portion. The second and third portions extend from the first portion with the first portion therebetween. The circuit board also includes at least one signal line extending from the second portion to the third portion, a plurality of ground patterns extending from the second portion to the third portion, a plurality of first conductive vias positioned at the second portion and electrically connecting the plurality of ground patterns, and a plurality of second conductive vias positioned at the third portion and electrically connecting the plurality of ground patterns. The plurality of ground patterns include a meander form at the first portion.

Abstract: An electronic assembly may include a chassis having electronic module mounting positions. Each mounting position may have associated therewith a chassis liquid dual-flow connector. A respective electronic module may be received in each electronic module mounting position and include a circuit board, a liquid cooling path associated with the circuit board, and a module liquid dual-flow connector coupled to the liquid cooling path and configured to be mateable with the chassis liquid dual-flow connector.

Abstract: A dry joint for jointing a cable with a wet or semi-wet/semi-dry design to a cable with a wet, semi-wet/semi-dry or dry design and a method of manufacturing a cable dry joint are provided. A cable with a wet or semi-wet/semi-dry design having an end of cable water barrier is also provided. A dry joint water barrier suitable for rendering a joint dry is also provided, where at least one of the jointed cables is of a wet or semi-wet/semi-dry design.

Abstract: A MIM energy storage device comprising a bottom electrode; a plurality of electrically conductive vertical nanostructures; a bottom conduction-controlling layer conformally coating each nanostructure in the plurality of electrically conductive vertical nanostructures; and a layered stack of alternating conduction-controlling layers and electrode layers conformally coating the bottom conduction-controlling layer, the layered stack including at least a first odd-numbered electrode layer at a bottom of the layered stack, a first odd-numbered conduction-controlling layer directly on the first odd-numbered electrode layer, and a first even-numbered electrode layer directly on the first odd-numbered conduction-controlling layer. Each even-numbered electrode layer in the layered stack is electrically conductively connected to the bottom electrode; and each odd-numbered electrode layer in the layered stack is electrically conductively connected to any other odd-numbered electrode layer in the layered stack.

Abstract: A wiring circuit board includes an insulating layer having a via penetrating in a thickness direction, a first conductive layer disposed on a one-side surface in the thickness direction of the insulating layer, a second conductive layer disposed on the other-side surface in the thickness direction of the insulating layer, and a conductive portion disposed on an inner peripheral surface of the via and electrically connecting the first and second conductive layers. Length L of 1 ?m-10 ?m inclusive, is measured by: drawing a segment joining first and second connection points from respectively, the one-side surface to the other-side surface in the thickness direction of the insulating layer and the inner peripheral surface in the cross-sectional view; identifying an outermost position farthest outward from the segment on the inner peripheral surface in the cross-sectional view; and measuring the length as the shortest distance from the segment to the outermost position.

Abstract: An electronic device includes an insulating base having elasticity, a plurality of lines provided on the insulating base, and a plurality of electric elements connected to the lines. The insulating base includes island-shaped portions in which the electric elements are located, and band-like portions in which the lines are provided and which connect the adjacent island-shaped portions. The band-like portions include a curved portion which meanders, and a straight line portion which connects the curved portion and the island-shaped portion. The curved portion includes a first curved portion, a second curved portion and a third curved portion. A width of the second curved portion is less than a width of the third curved portion.

Abstract: A support insulator includes a conductive member, an insulating member, and an attachment portion. Busbars included in a main circuit are attachable to the conductive member. The conductive member electrically connects the busbars to each other. The insulating member is attachable to a fixed frame, and is disposed over an outer surface of the conductive member to insulate the conductive member and the busbars from the fixed frame. An electronic component included in the main circuit is attachable to the attachment portion.

Abstract: The description relates to electronic prototyping platforms. One example can include an electrically insulative substrate having generally opposing first and second major surfaces and that includes an orientation feature that is visible on both of the first and second major surfaces. The example can include a first mounting hole through the substrate that is bordered by a first electrical conductor associated with data transmission. The example can also include a second mounting hole through the substrate that is bordered by a second electrical conductor associated with electrical ground, and a third mounting hole through the substrate that is bordered by a third electrical conductor associated with electrical power. The example can also include an edge connector tab defined by the substrate and having three exposed electrically conductive contacts that are coupled to the data electrical conductor, the ground electrical conductor, and the power electrical conductor and insulated from one another.

Abstract: A conduit outlet assembly for a rigid metal conduit raceway of an electrical system is provided. A conduit outlet assembly includes a gasket, a gripping ring, and a condulet assembly. The gasket is sized to circumscribe an outer surface of a rigid metal conduit of the rigid metal conduit raceway. The gripping ring is sized to circumscribe the outer surface of the rigid metal conduit. The condulet assembly is sized to receive the rigid metal conduit, and includes an adapter and a condulet. The adapter includes a compression section and a coupling section, wherein the compression section is sized to receive the rigid metal conduit with the gasket and the gripping ring disposed thereon. The condulet is sized to receive the coupling section of the adapter.

Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.

Abstract: A circuit board structure includes a carrier, a thin film redistribution layer disposed on the carrier, solder balls electrically connected to the thin film redistribution layer and the carrier, and a surface treatment layer. The thin film redistribution layer includes a first dielectric layer, pads, a first metal layer, a second dielectric layer, a second metal layer, and a third dielectric layer. A top surface of the first dielectric layer is higher than an upper surface of each pad. The first metal layer is disposed on a first surface of the first dielectric layer. The second dielectric layer has second openings exposing part of the first metal layer. The second metal layer extends into the second openings and is electrically connected to the first metal layer. The third dielectric layer has third openings exposing part of the second metal layer. The surface treatment layer is disposed on the upper surfaces.

Abstract: A wiring board includes a wiring layer, an insulating layer, a plurality of opening portions, and a connection terminal. The insulating layer is laminated on the wiring layer and covers a wiring pattern. Each of the plurality of opening portions penetrates through the insulating layer to the wiring pattern. The connection terminal is formed on the respective opening portions and comes into contact with the upper surface of the wiring pattern. The wiring layer includes a first wiring pattern, and a second wiring pattern that is formed of a plurality of laminated metal layers and that is thicker than the first wiring pattern. An upper surface of a metal layer serving as an uppermost layer of the second wiring pattern is a contact surface with the connection terminal and has a same width as an upper surface of a metal layer serving as a layer other than the uppermost layer.

Abstract: A wiring member including: three or more electrical wire portions extending in different directions from a branching position; and a retaining member that is an elastic member and covers base end portions of the three or more electrical wire portions. The retaining member includes three or more cylindrical portions that are joined to each other at respective base end portions thereof, one or two adjacent cylindrical portions of the three or more cylindrical portions being a base cylindrical portion provided with a slit extending over the entire length thereof on one side, and the remaining cylindrical portion being a divided cylindrical portion provided with slits extending over the entire length thereof on two sides, and the retaining member is closed via a fixing member.

Abstract: A mud ring assembly includes a base member, a raised member, a telescoping member and a plurality of drive members. The base member has a flange and an opening through the flange. The raised member extends from the base member and follows the opening in the flange to form a raised wall. The raised member has a plurality of mounting tabs extending from the raised wall toward the opening in the raised member. The telescoping member is positioned within the raised member opening and is movable relative to the raised member between a retracted position and an extended position. The telescoping member has a wall, an opening and a plurality of mounting tabs extending from the wall toward the opening in the telescoping member. The wall of the telescoping member includes a plurality of protective members. Each protective member is positioned in proximity to one of a plurality of mounting tab pairs.

Abstract: A wiring substrate includes an insulating layer, a conductor layer formed on a surface of the insulating layer and including a conductor pad, a covering layer formed on the insulating layer and covering a portion of the insulating layer, an optical waveguide positioned on the surface of the insulating layer and including a core part, and a conductor post including plating metal and formed on the conductor pad such that the conductor post is penetrating through the covering layer and connected to a component. The insulating layer has a component region covered by the component when the component is connected to the conductor post, the core part has an end surface facing the opposite direction with respect to the insulating layer and exposed in the component region and a distance between the end surface and the surface of the insulating layer is greater than a thickness of the covering layer.

Abstract: An apparatus is described. The apparatus includes a printed circuit board (PCB) dual in-line memory module (DIMM) connector having ejectors. The ejectors have a small enough vertical profile to permit unbent liquid cooling conduits to run across the DIMM's semiconductor chips.

Abstract: Enclosure assemblies employed in electrical installations, including those employed in solar power installations, which conform to NEMA 3R type rating defined by National Electrical Manufacturers Association (“NEMA”) are disclosed. In some embodiments, a base of a housing of an enclosure assembly having a seal-receiving groove, fastener retainers, fastener walls, a moisture diverter, attachment points; and conductor pass-through apertures is disclosed. In some embodiments, a base of a housing of an enclosure assembly having a forward portion with a forward fastener retainer and forward attachment points; an aft portion of the base having an aft fastener retainer and aft and attachment points, the groove located between the forward and aft portions, a moisture diverter located between the forward and aft portions; and drainage channels encompassing the forward and aft portions is disclosed. In some embodiments, a method for pre-positioning a fastener in a housing of an enclosure assembly is disclosed.

Abstract: A wire harness for connecting a vehicle body-side device and a wheel-side device includes: a first wiring member; and a second wiring member that has higher flex resistance than the first wiring member. A first outer path length of the first wiring member is defined by a length of a first outer path portion of the first wiring member. A second outer path length of the second wiring member is defined by a length of a second outer path portion of the second wiring member. The first outer path length of the first wiring member is greater than the second outer path length of the second wiring member.

Abstract: A fitting assembly may seal a wire within a tube to inhibit ingress of fluid outside the tube into the tube and into contact with the wire. The fitting assembly may optionally include a body and a nut, with a part of the nut received within the body. The nut may be threadedly connected to the body, such that threading and/or unthreading the nut translates the part of the nut within the body. Optionally, the nut may include a ring extension that is received within a ring cavity of the body, and an interfacing between the ring extension and the ring cavity may create a seal to inhibit leaking of the fluid past the seal. A method of sealing a wire within a tube may comprise positioning a tube with a wire therein within such a fitting assembly.