Patents Examined by Michael Feely
  • Patent number: 6828028
    Abstract: A medical material having a surface which is safe and excellent in stability with the lapse of time and has a high durability as needed in establishing a long-lasting surface lubricity in a wet state and an excellent compatibility with blood, and a method for producing the same. These materials are obtained by forming a coating layer with a coating material containing a polymeric substance (A) having a heterocyclic group represented by the formula (1) on at least a part of a surface of a medical material base, and then ring-opening the heterocyclic group remaining in the coating layer by a nucleophilic compound (N): wherein X represents O, NH or S; and R1 represents H or CH3.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: December 7, 2004
    Assignee: NOF Corporation
    Inventors: Hiroki Fukui, Ken Suzuki, Kenshiro Shuto, Nobuyuki Yamamoto, Kazuhiko Ishihara, Nobuo Nakabayashi
  • Patent number: 6779656
    Abstract: The invention relates to polymerizable preparations which contain: (a) 3 to 80 wt. % of an epoxy or of a mixture of epoxies of general formula (I), whereby n and m, independent of one another, represent 0, 1, 2 or 3, and n+m ranges from 2 to 6, and whereby the molar mass of the epoxy or the average molar mass of the mixture of epoxies ranges from 250 to 1000 g/mol; (b) 0 to 80 wt. % of an epoxy or of a mixture of epoxies that differ from (a); (c) 3 to 85 wt. % of fillers; (d) 0.001 to 25 wt. % of initiators, retarders and/or accelerators, and; (e) 0 to 25 wt. % of auxiliary agents, whereby the specified percentages refer to the total weight of the preparation.
    Type: Grant
    Filed: July 11, 2002
    Date of Patent: August 24, 2004
    Assignee: 3M Espe AG
    Inventors: Thomas Klettke, Wolfgang Weinmann
  • Patent number: 6777090
    Abstract: Composition curable thermally and with actinic radiation (dual-cure composition) comprising A) at least one constituent containing on average per molecule at least one primary or secondary carbamate group and at least one bond which can be activated with actinic radiation and preparable by from polyfunctional compounds containing at least two isocyanate-reactive, acid-reactive or epoxide-reactive functional groups and suitable monoisocyanates, monoacids or monoepoxides or from polyisocyanates, polyacids or polyepoxides and suitable compounds which contain an isocyanate-reactive, acid-reactive or epoxide-reactive functional group; and B) at least one constituent containing on average per molecule at least one carbamate-reactive functional group and also, where appropriate, at least one bond which can be activated with actinic radiation; and its use as adhesive, sealing compound and coating material.
    Type: Grant
    Filed: June 19, 2002
    Date of Patent: August 17, 2004
    Assignee: BASF Coatings AG
    Inventors: Hubert Baumgart, Uwe Meisenburg, Heinz-Peter Rink, Paul J. Harris, Reinhold Schwalm
  • Patent number: 6770373
    Abstract: A water-based metal surface treatment composition for forming a lubricating film with excellent marring resistance, characterized in that it comprises (a) a water-compatible urethane resin which contains bisphenol skeletons and carboxyl groups in the resin backbone and has an average molecular weight of 3,000 or higher and which has been synthesized through reaction of an isocyanate in which the content of nitrogen atoms participating in the isocyanate reaction is 2 to 13 wt. % and the ratio of nitrogen atoms participating in urea bond formation to the nitrogen atoms participating in the isocyanate reaction is 10/100 to 90/100, (b) a hardener, (c) silica, and (d) a polyolefin wax, and that the sum of the ingredients (a) and (b) is 50 to 95 wt. % based on the whole composition (e) on a solid basis, the amount of functional groups contained in the ingredient (b) is 0.10 to 1.00 equivalent to the carboxyl groups contained in the backbone of the ingredient (a), the amount of the ingredient (c) is 3 to 40 wt.
    Type: Grant
    Filed: November 26, 2001
    Date of Patent: August 3, 2004
    Assignee: Henkel Corporation
    Inventors: Yasuhiro Kinoshita, Ryoji Morita
  • Patent number: 6761673
    Abstract: A liquid form addition curable silicone rubber composition for forming a fluororesin covered fixing roller is provided. This composition includes (a) 100 parts by weight of an organopolysiloxane with at least two alkenyl groups bonded to non-terminal silicon atoms; (b) an organohydrogenpolysiloxane with at least two silicon-bonded hydrogen atoms, in a sufficient quantity to produce a molar ratio of silicon-bonded hydrogen atoms within said constituent (b) relative to silicon-bonded alkenyl groups within said constituent (a) of 0.4 to 5.0; (c) an effective quantity of a platinum based catalyst; (d) 0.1 to 10 parts by weight of dry process silica; and (e) 0.05 to 5 parts by weight of a cyclic diorganopolysiloxane with at least three silicon-bonded alkenyl groups. This composition is used for formation of the silicone rubber layer of a fixing roller made up of a metal core, a silicone rubber layer on the core, and a fluorine based coating provided on the rubber layer.
    Type: Grant
    Filed: April 4, 2002
    Date of Patent: July 13, 2004
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Shigeki Shudo
  • Patent number: 6733893
    Abstract: A coated silicone rubber article comprising a silicone rubber substrate having a cured polyisobutylene coating on a surface thereof; and a method of preparing a coated silicone rubber article, comprising the steps of (a) applying a curable polyisobutylene composition to a surface of a silicone rubber substrate; and (b) curing the polyisobutylene composition.
    Type: Grant
    Filed: August 2, 2002
    Date of Patent: May 11, 2004
    Assignee: Dow Corning Corporation
    Inventors: Toshio Suzuki, Simon Toth
  • Patent number: 6726997
    Abstract: An aqueous dispersion which is excellent in storage stability, and can form a coating film excellent in leveling properties, anti-checking properties, water resistance, etc., transparent and high in hardness, which is obtained by mixing and emulsifying (A) at least one selected from an organosilane represented by (R1)4−n—(Si)—(OR2)n, a hydrolysate of the organosilane and a partial condensation product of the hydrolysate, (B) a radical polymerizable monomer, (C) an emulsifier and (D) a hydrolytic catalyst for component (A) to reduce the particle size of an emulsion, as well as to allow hydrolysis of component (A) to proceed, and adding (E) a radical polymerization initiator to allow polymerization of component (B) to proceed, has a concentration of alcohols having a boiling point of 100° C. or less of 0.1 to 2.0 wt %, and further contains (F) a component having ultraviolet absorption and/or light stabilization action as needed.
    Type: Grant
    Filed: May 1, 2002
    Date of Patent: April 27, 2004
    Assignee: JSR Corporation
    Inventors: Kouji Tamori, Hirotaka Shida, Kenji Ishizuki
  • Patent number: 6680122
    Abstract: The present invention provides a cationic paint composition which contains, as resin component, an amino group-containing epoxy resin obtained by making an epoxy resin having an epoxy equivalent of 300-2500 react with a hydroxyl group-containing carboxylic acid, which is prepared by allowing caprolactone to react to a hydroxyl group of a hydroxy monocarboxylic acid, and with an amino group-containing compound.
    Type: Grant
    Filed: November 28, 2001
    Date of Patent: January 20, 2004
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Nishiguchi Shigeo, Kamikado Koji
  • Patent number: 6605363
    Abstract: The invention features a method for preparing a high-density functional slide by coating a sol-gel containing amine-group bearing silanes and a solution containing polyaldehyde groups onto an organic or inorganic substrate, respectively. The resulting slide is useful in the preparation of highly homogeneous functional-group slides and the high-density and high-efficiency bio-chip/microarray.
    Type: Grant
    Filed: April 18, 2001
    Date of Patent: August 12, 2003
    Assignee: Industrial Technology Research Institute
    Inventors: Chih-Wei Ho, Zu-Sho Chow, Bor-Iuan Jan, Jia-Huey Tsao, Chao-Chi Pan, Wen-Hsun Kuo, Yao-Sung Chang, Cheng-Tao Wu, Yu-Ching Liu
  • Patent number: 6569532
    Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.
    Type: Grant
    Filed: November 20, 2001
    Date of Patent: May 27, 2003
    Assignees: Sony Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazutoshi Tomiyoshi, Kazuhiro Arai, Toshio Shiobara, Koki Oitori, Hironori Sakamoto, Yuji Kishigami, Koji Tsuchiya, Masato Kanari
  • Patent number: 6562477
    Abstract: The invention concerns a heat sealing composition including an adhesive framework and a framework forming constituent, the adhesive constituent being a maleic vinyl-anhydride ethylene-acetate polymer or a vinyl ethylene-acetate polymer modified to have epoxy functions and the framework forming constituent being selected from among a block polyether amide, modified or not, and a block polyether ester. The composition is useful for making closure plugs.
    Type: Grant
    Filed: May 2, 2001
    Date of Patent: May 13, 2003
    Assignee: Rapid S.A.
    Inventors: Jean-Pierre Leon, Jean Michel Pierrot, Philippe Vigouroux
  • Patent number: 6558797
    Abstract: An adhesive-coated copper foil which comprises a copper foil and disposed on one side thereof a layer of an adhesive composition comprising (a) an epoxy resin, (b) a polyfunctional phenol, (c) a curing accelerator as an optional ingredient, and (d) a compound having a triazine ring or isocyanuric ring. The adhesive layer has low hygroscopicity, excellent heat resistance, and satisfactory adhesion to copper foils. By using the adhesive-coated copper foil, a copper-clad laminate and a printed circuit board both having excellent properties can be obtained.
    Type: Grant
    Filed: June 22, 2001
    Date of Patent: May 6, 2003
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Michitoshi Arata, Nozomu Takano, Kazuhito Kobayashi
  • Patent number: 6447914
    Abstract: The present invention comprises a method of making a circuitized structure. The method comprises the steps of providing a substrate coated with a polymeric dielectric layer, treating the substrate with alkali, baking the substrate to modify the surface of the polymeric dielectric layer, applying a seed layer to the polymeric dielectric layer and applying conductive layer to the seed layer. The invention also comprises a printed circuit structure produced by the method of the present invention.
    Type: Grant
    Filed: July 3, 2000
    Date of Patent: September 10, 2002
    Assignee: International Business Machines Corporation
    Inventors: Anastasios P. Angelopoulos, Gerald W. Jones, Luis J. Matienzo, Thomas R. Miller, William D. Taylor
  • Patent number: 6241866
    Abstract: Electrodeionization apparatus for purifying water that includes a cathode, an anode, and a plurality of alternating anion permeable membranes and cation permeable membranes between the cathode and anode that define concentrating and diluting flow channels between adjacent pairs of membranes. The diluting channels include cation exchange materials and anion exchange materials that are fixed in close contacting position with respect to each other and provide conductive paths for cations and anions to the adjacent membranes and provide flow passages for water between the materials. The anion exchange materials and cation exchange materials each have a characteristic dimension that is smaller than the characteristic dimensions of the flow passages.
    Type: Grant
    Filed: September 13, 1999
    Date of Patent: June 5, 2001
    Inventor: Leon Mir
  • Patent number: 6231743
    Abstract: A substrate (155) is placed into a plating bath (19, 59), a current in the bath is measured, and a film (110) is plated onto the substrate (155). In one embodiment the current is measured using a sensing array (57) positioned within the bath, and the measurement is used to control a plating deposition parameter. In an alternative embodiment the current is measured using the sensing array (57) and a characteristic of the plated film is controlled using a corresponding control array (53) also positioned within the plating bath (59).
    Type: Grant
    Filed: January 3, 2000
    Date of Patent: May 15, 2001
    Assignee: Motorola, Inc.
    Inventor: Gregory S. Etherington