Abstract: An integrated electrical module has a set of regular elements and a set of redundant elements, the elements being split over at least two blocks which are individually selectable by an input address and respectively containing regular elements and redundant elements. The integrated electrical module further has two repair circuits, each repair circuit being associated to a block, the two repair circuits being conditioned as a pair for a partner mode of operation, in which the addressing of an element from a first half-group of regular elements in the first block is diverted to a first half-group of elements in the second block and the addressing of an element from a second half-group of regular elements in the first block is diverted to a second half-group of elements in the second block.

Abstract: The EEPROM cell includes a writing unit having a flash cell Metal Oxide Semiconductor (MOS) for receiving from outside a gate selection signal via a gate and a drain selection signal via a drain, and writing one bit data, and a high-voltage MOS whose source is connected to a source of the flash cell MOS to have a symmetrical structure and for receiving the gate selection signal via a gate, and a sensing unit having a first sensing MOS whose source is connected to a power supply voltage, gate to a drain of a second sensing MOS and drain to the drain of the flash cell MOS, and the second sensing MOS whose source is connected to the power supply voltage, gate to the drain of the first sensing MOS and drain to the drain of the high-voltage MOS.

Abstract: A supply instruction signal attains the H-level before data is written into a plurality of memory cells. A P-channel MOS transistor is arranged between a power supply node and an input node. The P-channel MOS transistor is turned off to open the input node according to the supply instruction signal. In this case, a write driver discharges electric charges accumulated on the input node and electric charges accumulated on a bit line pair. However, a through-current does not flow from the power supply node to a ground node so that flow of the through-current to a CMOS inverter circuit forming each memory cell can be prevented. Accordingly, such a static semiconductor memory device can be provided that can prevent the flow of the through-current to the CMOS inverter circuit forming each memory cell when simultaneously writing data into the plurality of memory cells.

Abstract: Part of the latency from memory read or write operations is for data to be input to or output from the data latches of the memory via an I/O bus. Methods and circuitry are present for improving performance in non-volatile memory devices by allowing the memory to perform some of these data caching and transfer operations in the background while the memory core is busy with a write operation. In the exemplary embodiment, when the multiple phases of a write operation vary as to the number of states to track, a phase-dependent coding enables efficient utilization of the available data latches, thereby allowing a maximum of surplus latches for background cache operations.

Abstract: Part of the latency from memory read or write operations is for data to be input to or output from the data latches of the memory via an I/O bus. Methods and circuitry are present for improving performance in non-volatile memory devices by allowing the memory to perform some of these data caching and transfer operations in the background while the memory core is busy with a write operation. In the exemplary embodiment, when the multiple phases of a write operation vary as to the number of states to track, a phase-dependent coding enables efficient utilization of the available data latches, thereby allowing a maximum of surplus latches for background cache operations.

Abstract: Source line bias is an error introduced by a non-zero resistance in the ground loop of the read/write circuits. During sensing the source of a memory cell is erroneously biased by a voltage drop across the resistance and results in errors in the applied control gate and drain voltages. This error is minimized when the applied control gate and drain voltages have their reference point located as close as possible to the sources of the memory cells. In one preferred embodiment, the reference point is located at a node where the source control signal is applied. When a memory array is organized in pages of memory cells that are sensed in parallel, with the sources in each page coupled to a page source line, the reference point is selected to be at the page source line of a selected page via a multiplexor.

Abstract: A boost voltage generating circuit and method thereof. The example boost voltage generating circuit may include a voltage comparator comparing an input voltage and a reference voltage and generating a control signal based on a result of the voltage comparison, the input voltage based on a feedback boost voltage, a voltage generator generating a boost voltage in response to the control signal and a boost voltage controller including a first resistor with a first end connected to the boost voltage and a second end connected to the voltage comparator, the boost voltage controller controlling a level of current flowing through the first resistor based on one of a number of memory cells to be programmed and a number of cell groups including at least one memory cell to be programmed.

Abstract: Shifts in the apparent charge stored on a floating gate (or other charge storage element) of a non-volatile memory cell can occur because of the coupling of an electric field based on the charge stored in adjacent floating gates (or other charge storing elements). To account for this coupling, the read process for a targeted memory cell will provide compensation to an adjacent memory cell (or other memory cell) in order to reduce the coupling effect that the adjacent memory cell has on the targeted memory cell. The compensation applied is based on a condition of the adjacent memory cell. To apply the correct compensation, the read process will at least partially intermix read operations for the adjacent memory cell with read operations for the targeted memory cell.

Abstract: In sensing a group of cells in a multi-state nonvolatile memory, multiple sensing cycles relative to different demarcation threshold levels are needed to resolve all possible multiple memory states. Each sensing cycle has a sensing pass. It may also include a pre-sensing pass or sub-cycle to identify the cells whose threshold voltages are below the demarcation threshold level currently being sensed relative to. These are higher current cells which can be turned off to achieve power-saving and reduced source bias errors. The cells are turned off by having their associated bit lines locked out to ground. A repeat sensing pass will then produced more accurate results. Circuitry and methods are provided to selectively enable or disable bit-line lockouts and pre-sensing in order to improving performance while ensuring the sensing operation does not consume more than a maximum current level.

Abstract: In sensing a group of cells in a multi-state nonvolatile memory, multiple sensing cycles relative to different demarcation threshold levels are needed to resolve all possible multiple memory states. Each sensing cycle has a sensing pass. It may also include a pre-sensing pass or sub-cycle to identify the cells whose threshold voltages are below the demarcation threshold level currently being sensed relative to. These are higher current cells which can be turned off to achieve power-saving and reduced source bias errors. The cells are turned off by having their associated bit lines locked out to ground. A repeat sensing pass will then produced more accurate results. Circuitry and methods are provided to selectively enable or disable bit-line lockouts and pre-sensing in order to improving performance while ensuring the sensing operation does not consume more than a maximum current level.

Abstract: A NAND flash memory having a cell string structure includes a wordline configured to transfer a wordline voltage to a memory cell. A selection line is configured to transfer a selection voltage to a selection transistor connected to the memory cell and at least one shielding line is interposed between the wordline and the selection line and is operable to reduce capacitance-coupling between the wordline and the selection line during a programming operation.

Abstract: Methods and circuitry are present for executing current memory operation while other multiple pending memory operations are queued. Furthermore, when certain conditions are satisfied, some of these memory operations are combinable or mergeable for improved efficiency and other benefits. The management of the multiple memory operations is accomplished by the provision of a memory operation queue controlled by a memory operation queue manager. The memory operation queue manager is preferably implemented as a module in the state machine that controls the execution of a memory operation in the memory array.

Abstract: Part of the latency from memory read or write operations is for data to be input to or output from the data latches of the memory via an I/O bus. Methods and circuitry are present for improving performance in non-volatile memory devices by allowing the memory to perform some of these data caching and transfer operations in the background while the memory core is busy with a read operation. A scheme for caching read data is implemented so that even when the read for a current page on a current wordline must be preceded by a prerequisite read of data on an adjacent wordline, the prerequisite read along with any I/O access is preemptively done in the cycle for reading a previous page so that the current read can be performed while the previously read page is busy with the I/O access.

Abstract: An integrated semiconductor memory that has at least one temperature measuring element and repeatedly carries out a temperature measurement during the operation of the semiconductor memory, wherein the semiconductor memory repeats the temperature measurement at instants corresponding to a measuring frequency of the temperature measuring element. According to an embodiment of the invention, the measuring frequency of the temperature measuring element is variable and the temperature measuring element is driven in such a way that the measuring frequency changes in a manner dependent on the temporal development of measured values of the repeated temperature measurements.

Abstract: Body bias can be applied to optimize performance in a non-volatile storage system. Body bias can be set in an adaptive manner to reduce an error count of an error correcting and/or detecting code when reading data from non-volatile storage elements. Also, a body bias level can be increased or decreased as a number of programming cycles increases. Also, body bias levels can be set and applied separately for a chip, plane, block and/or page. A body bias can be applied to a first set of NAND strings for which operations are being performed by controlling a first voltage provided to a source side of the first set of NAND strings and a second voltage provided to a p-well. A source side of a second set of NAND strings for which operations are not being performed is floated or receives a fixed voltage.

Abstract: A method and a test arrangement for testing an SRAM having a first cell and a second cell coupled between a pair of bitlines is disclosed. In a first step, a data value is stored in the first cell being the cell under test (CUT), and its complement is stored in a second cell, being the reference cell. Next, the bitlines are precharged to a predefined voltage. Subsequently, the wordline of the reference cell is enabled for a predefined time period, for instance by providing the wordline with a number of voltage pulses. This causes a drop in voltage of the bitline coupled to the logic ‘0’ node of the reference cell. In a subsequent step, the wordline of the CUT is enabled, which exposes the CUT to the bitline with the reduced voltage. This is equivalent to weakly overwriting the CUT. Finally, the data value in the CUT is evaluated. If the data value has flipped, the CUT is a weak cell. Cells with varying levels of weakness can be detected by varying the reduced voltage on the aforementioned bitline.

Abstract: Methods and circuitry are present for executing current memory operation while other multiple pending memory operations are queued. Furthermore, when certain conditions are satisfied, some of these memory operations are combinable or mergeable for improved efficiency and other benefits. The management of the multiple memory operations is accomplished by the provision of a memory operation queue controlled by a memory operation queue manager. The memory operation queue manager is preferably implemented as a module in the state machine that controls the execution of a memory operation in the memory array.

Abstract: A method and apparatus for minimizing errors that may occur when writing information to a magnetic memory cell array with an operating write current due to changes in the local magnetic fields and. A test write current is sent to a reference memory cell and the effect of the test current on the orientation of the magnetization in the reference cell is monitored. The write current is then modified to compensate for any changes in the optimum operating point that have occurred. Arrays of reference magnetic memory cells having varying properties may be used to more accurately characterize any changes that have occurred in the operating environment. A phase difference between a time varying current used to drive the reference cell and the corresponding variations in the orientation of the magnetization in the reference cell may also be used to further characterize changes in the operating environment.

Abstract: Method for controlling voltage in a non-volatile memory system is provided. The method includes selecting a first input value for a voltage generator system operating in one of a plurality of modes, the first input value controlling a temperature dependent component of a voltage applied to a memory cell; and selecting a second input value for the voltage generator system operating in one of the plurality of modes, the second input value controlling a temperature independent component of the voltage applied to the memory cell. The temperature dependent component of the voltage applied to the memory cell and the temperature independent component of the voltage applied to the memory cell are controlled independently in response to the first input value and the second input value.

Abstract: A memory core having an open bit line structure and a semiconductor memory device having the memory core includes an edge sub-array and a dummy bit line control circuit. The edge sub-array has a plurality of word lines, a plurality of bit lines and a plurality of dummy bit lines. The dummy bit line control circuit amplifies and latches voltage signals of the dummy bit lines in a test sensing mode. Accordingly, the semiconductor memory device having the memory core may test defects of the edge sub-array included in the memory core.