Abstract: In order to prevent the formation of condensation in a cooling device for a current converter module, the cooling device has a cooling liquid channel, which conducts a liquid coolant and which is connected to a cooling circuit, a heat exchanger, which is connected in the cooling circuit and to which a power component is coupled in a thermally conductive manner, and a cooler for cooling the liquid coolant, which cooler is connected in the cooling circuit, wherein there is a heater in the cooling circuit such that the heat exchanger can be heated upon demand by heating the coolant.

Abstract: A display device is disclosed. The display device includes a display unit including a display panel, a back cover positioned on a back surface of the display panel, and a light shielding plate positioned between the display panel and the back cover, a housing into which at least a portion of a lower area of the display unit is inserted, and on which a printed circuit board (PCB) is mounted, a link bar connecting the housing to the display unit, and a front deco entirely positioned inside the housing and shielding at least a portion of a lower portion of the display unit.

Abstract: A rollable display is disclosed. In one aspect, the rollable display includes a flexible display panel, a protective film configured to be placed on the flexible display panel, and a first jig connected to a first end of the flexible display panel and a first end of the protective film. The flexible display panel and the protective film are configured to be rolled around the first jig. The rollable display also includes a second jig connected to a second end of the protective film. The protective film is configured to be rolled around the second jig. The rollable display further includes a first housing for the first jig. The first housing is configured to accommodate the flexible display panel and the protective film.

Abstract: An electrical assembly includes a first electrical component with a first conductor, a second electrical component with a second conductor, and an accommodating chamber which is formed on the electrical assembly and in which an electrical contact point between the first and second conductors is arranged. The first conductor is arranged in a first insulating part and has at a free conductor end that protrudes from the first insulating part. The second conductor is arranged in a second insulating part and has a free conductor end that protrudes from the second insulating part. The accommodating chamber is partially filled with a potting mass such that the contact point and the free conductor ends are covered by the potting mass and the potting mass is bounded by an inner wall of the accommodating chamber. The inner wall of the accommodating chamber is formed by wall surfaces of the insulating parts.

Abstract: A heat dissipation device and an electronic device thereof are provided. The heat dissipation device includes a heat dissipation body including a closed chamber; and at least two pumps in the closed chamber to drive heat dissipation medium contained in the closed chamber to flow in one or more loops.

Abstract: An input/output module baffle is adapted to an electronic device. The electronic device includes a motherboard and a casing. The motherboard is located inside the casing and includes a connector module. The input/output module baffle includes a fixing plate, a conductive component and a frame. The fixing plate includes a plurality of retaining clips to clamp the fixing plate on the connector module. The conductive component is located between the fixing plate and the connector module. The frame is located between the fixing plate and the casing. Moreover, a motherboard with the input/output module baffle is also disclosed herein.

Abstract: The present disclosure relates to a cold plate and vapor chamber for conduction cooling of one or more printed circuit boards in a printed circuit board (PCB) enclosure. The cold plate may include a planar surface at an oblique angle relative to an axis along which the PCB assembly is inserted into the enclosure. The PCB assembly may include a vapor chamber having a complementary obliquely angled surface. The complementary angled surfaces of the cold plate and vapor chamber may exert forces against each other upon insertion of the printed circuit board assembly into the enclosure and contact between the cold plate and vapor chamber.

Abstract: A liquid immersion cooling apparatus that cools an electronic device including a heat generating element, the apparatus includes a liquid immersion tank that accommodates a cooling liquid and the electronic device to be immersed in the cooling liquid, a wall that is disposed within the liquid immersion tank, the wall having a protrusion protruding toward the electronic device, and a drive mechanism that moves a position of the protrusion along the electronic device.

Abstract: An information processing apparatus is disclosed. The information processing apparatus includes a first heat emitting device and a heat exchanger. The heat exchanger includes a first layered structure of layers of a plurality of first flow channel members having one or more first flow channels formed therein for a first coolant that is liquid, a first header in fluid communication with the first flow channel members, a second layered structure of layers of a plurality of second flow channel members having one or more second flow channels formed therein for a second coolant that is liquid, and a second header in fluid communication with the second flow channel members. The first and the second layered structures are overlapped in a first region when viewed in a layered direction, and at least one of the first and the second layered structures has space between layers in a second region.

Abstract: An electronic assembly including a machine body and a docking station is provided. The machine body includes a casing, a heat transfer plate, and a heat dissipation fin set. The casing has a first hole and a second hole. The heat transfer plate and the heat dissipation fin set are disposed in the casing. The heat dissipation fin set includes heat dissipation fins, and a diversion portion of at least one of the heat dissipation fins is aligned to the first hole and the second hole. The docking station includes a body and a fan. The body has a third hole. The fan is disposed in the body. When the machine body is assembled to the docking station, an air flow generated by the fan flows into the casing via the third the first holes, and the air flow is divided into two flows by the diversion portion.

Abstract: A main unit of a director-class switch including a wire-based backplane located in a chassis, having a plurality of slots configured to receive switch boards. The wire-based backplane includes a plurality of harnesses each including first and second cartridges, a plurality of interface port units mounted on each of the first and second cartridges and cables connecting each of the interface port units of the first cartridge to each of the interface port units of the second cartridge. The harnesses are mounted in the chassis such that the interface port units face ends of the slots in a manner configured to mate with corresponding connectors of switch boards inserted into the slots. A plurality of interface port units are mounted in each slot. Each cartridge includes interface port units which are located in a plurality of different slots.

Abstract: An apparatus, comprising a linecard including a circuit board having a front side connectable to a pluggable optical module and a back side opposite the front side; a heat relay apparatus comprising a heat pipe on the circuit board; a pluggable optical module generating a first amount of heat and being in thermal contact with the heat pipe; and a cooling module including a heat sink in thermal contact with the heat pipe, the cooling module generating a second amount of heat in a range from the first amount of heat to no heat; and wherein heat from the pluggable optical module is transferable through the heat pipe to the cooling module for dispersal from the heat sink.

Abstract: An external auxiliary heat dissipation device includes an external connection head module, a fluid driving module, a heat dissipation module, and a plurality of first pipes. The external connection head module includes a first carrier body and at least two first fluid connection disposed on the first carrier body. The first pipes connect to the first fluid connection head, the fluid driving module, and the heat dissipation module to form a first fluid pathway. The electronic system includes an internal connection head module and a plurality of second pipes. The second pipes connect to the internal connection head module to form a second fluid pathway. The internal connection head module is detachably connected to the external connection head module, so that the first and the second fluid pathways are in fluid communication with each other to form a loop fluid pathway.

Abstract: An electronic circuit unit in which a mold exclusion part, having a rear surface side covered by mold resin and a front surface side exposed from an outer case, is provided at a part of a plate surface of a circuit board which is mounted with electronic components and is covered by the outer case formed by the mold resin. The outer case is multi-material molded using plural kinds of resin having different fluidities. A rear wall of the outer case located on the rear surface side of the mold exclusion part is made of one of the plural kinds of the resin having a fluidity higher than a fluidity of another one of the plural kinds of the resin constituting the other portion of the outer case.

Abstract: A shelf thermostat device and a thermostat system. The shelf thermostat device includes a fixing bracket and a heat exchanger. An electronic device is detachably disposed at the fixing bracket. The heat exchanger is detachably disposed at the fixing bracket and layer arranged in a row with the electronic device. The heat exchanger has a heat exchanging core. The heat exchanging core has a first side and a second side opposite to the first side, and a plurality of internal channels and a plurality of external channels. The internal channels and the external channels are disposed staggered and isolated with each other. An internal air flows between the internal channels and the electronic device. An external air flows to the second side of the heat exchanging core from the first side of the heat exchanging core through the external channels.

Abstract: An information processing system includes a chiller configured to cool a primary refrigerant; a liquid immersion tank in which a processing device including a first electronic component is immersed in a secondary refrigerant; a second electronic component coupled to the processing device; a blower configured to blow or inhale air for the second electronic component; a coil in which the secondary refrigerant is cooled by the air; an air tank that is coupled to the coil and that includes a refrigerant pipe through which the secondary refrigerant flows; a heat exchanger configured to exchange heat between the primary refrigerant and the secondary refrigerant; and a pump configured to circulate the secondary refrigerant from the liquid immersion tank to the heat exchanger.

Abstract: A server includes a tray that has a front portion and a back portion. A motherboard is disposed in the front portion of the tray and the motherboard is coupled to a heat sink. A fan is disposed in the back portion of the tray. A hard drive is disposed between the motherboard and the fan and the hard drive is operatively connected to the motherboard. The server also includes a heat pipe that has a body longitudinally bounded by an inlet and an outlet. The inlet is coupled to the heat sink, while the outlet is coupled to the fan. The body of the heat pipe extends past the hard drive. A power supply is also disposed in the tray and is operatively connected to the motherboard, the fan, and the hard drive.

Abstract: An electronic device may be provided with electrical components such as a power supply that produce heat. Speakers and other components may be controlled using control circuitry within the electronic device. The electronic device may play audio signals through the speakers. Audio data may be received from external equipment or may be maintained locally within the device. A speaker such as a subwoofer may be mounted in a device housing above the power supply so that airflow from the speaker cools the power supply. To enhance cooling, the control circuitry may supply inaudible signals to the speaker that enhance airflow produced by the speaker. The inaudible signals may be supplied in response to detecting current heat-producing audio playback conditions, to predicting future heat-producing conditions, or real-time temperature measurements.

Abstract: The present disclosure provides a heat spreader and a power module. The heat spreader comprises: a base plate comprising a first surface and a second surface opposite to the first surface; an insulating frame fixedly connected to the first surface of the base plate; and an insulating material attached to at least a part of a surface of the insulating frame. The present disclosure can effectively satisfy design requirements for both heat dissipation and insulation, and significantly increase a layout space for a printed circuit board.

Abstract: A subsea electronic device includes a housing, a chassis within the housing to which one or more electronic cards are mounted and heat transfer sections in thermal contact with the electronic cards. The heat transfer sections are in interference fit with an inner surface of the housing thereby to transfer, in use, heat from the electronic cards through the heat transfer sections to the housing. There is also a subsea electronic device housing and a method of assembling a subsea electronic device.