Patents Examined by Michael Matey
  • Patent number: 10416735
    Abstract: A head-mounted display (HMD) device includes a printed circuit board having one or more processors. A heat transfer plate having a heat-generating component facing surface is thermally coupled to the printed circuit board. The HMD exterior-facing surface of the heat transfer plate opposite from the heat-generating component facing surface is thermally coupled to a heat pipe. The heat pipe is thermally coupled to a heat transfer shell, which is configured as a heat sink to receive heat from the heat pipe. In operation, heat flows from the heat-generating components of the HMD (e.g., the HMD's processor and other electronic components) to the heat transfer plate. Thermal energy removed from the heat-generating components is transferred to the heat transfer shell via the heat pipe, which in turn transfers the heat to the external surface of the HMD to be dissipated into ambient room temperature of the surrounding environment.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: September 17, 2019
    Assignee: GOOGLE LLC
    Inventor: Ihab Ali
  • Patent number: 10409342
    Abstract: A cooling mount for portable electronic devices is provided that includes a cooling unit for preventing portable electronic devices housing the cooling mount from reaching critical temperatures during operation to avoid undesired shut down of the electronic device.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: September 10, 2019
    Inventor: Darren Saravis
  • Patent number: 10381287
    Abstract: This application discloses an device disposed on a substrate, and a heat sink disposed on the substrate over the device. The heat sink disposed on the substrate forms a cavity to hold a fluid between the heat sink and the device. The fluid can absorb heat emitted by the device and transfer at least a portion of the absorbed heat to the heat sink. A gasket can be disposed between and in contact with the substrate and the heat sink. The gasket can prevent the fluid from exiting the cavity formed by the heat sink disposed on the substrate. The heat sink can have an opening to the cavity, which can be detachably sealed by a plug. The plug can reduce a pressure within the cavity or allow removal of gas bubbles in the fluid held in the cavity.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: August 13, 2019
    Assignee: Mentor Graphics Corporation
    Inventors: Spencer Saunders, Terry Goode
  • Patent number: 10375839
    Abstract: A cover window of a flexible display device includes a base substrate including an out-folding area, an in-folding area, and peripheral areas disposed on opposing sides of at least one of the out-folding area and the in-folding area, a first hard coating layer at a top surface of the base substrate, the first hard coating layer having a substantially uniform thickness, and a second hard coating layer at a bottom surface of the base substrate opposite to the top surface, the second hard coating layer having a thickness different from the thickness of the first hard coating layer. A thickness of a first area of the second hard coating layer that overlaps with the out-folding area and the in-folding area of the base substrate is less than a thickness of a second area of the second hard coating layer that overlaps with the peripheral areas of the base substrate.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: August 6, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jae-Hoon Jung, Jong-Whan Cho, Suk-Man Yang, Young-Sik Yoon, Jong-In Lee
  • Patent number: 10368459
    Abstract: An apparatus includes a clamping assembly configured to receive and secure a component in a support structure. The clamping assembly includes a faceplate configured to be coupled to the support structure. The clamping assembly also includes first and second side rails configured to be coupled to the support structure and to apply frictional forces to the component. The clamping assembly further includes first and second spring assemblies configured to be coupled to the faceplate. The spring assemblies are also configured to pull clamps mounted to the side rails toward the faceplate in order to apply clamping forces to the component.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: July 30, 2019
    Assignee: Raytheon Company
    Inventor: Brian M. White
  • Patent number: 10362708
    Abstract: Technology is provided for a device sled with a fan cartridge. The device sled includes a sled chassis having a bottom wall and first and second opposed sidewalls. A pair of spaced apart channels are each coupled to the bottom wall and include an associated latch aperture. A fan cartridge is removably inserted between the pair of spaced apart channels. The fan cartridge includes a cartridge frame and one or more fans coupled to the cartridge frame. One or more latches are positioned on the cartridge frame to engage a corresponding latch aperture when the fan cartridge is inserted between the pair of spaced apart channels.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: July 23, 2019
    Assignee: Facebook, Inc.
    Inventor: Jon Brian Ehlen
  • Patent number: 10361143
    Abstract: An apparatus includes a substrate and a matrix having multiple cells embedded within the substrate. The matrix is configured to generate electrostatic fields to define at least one flow path for liquid metal. The apparatus also includes a pump configured to create movement of the liquid metal through the at least one flow path defined by the matrix. The matrix is configured to transport the liquid metal through the at least one flow path in order to remove thermal energy from one or more areas of the substrate. The matrix could include a matrix of capacitors, and polarities of charges stored on the capacitors could define which cells allow passage of the liquid metal and which cells block or restrict passage of the liquid metal. The cells that block or restrict passage of the liquid metal could be configured to increase a viscosity of the liquid metal.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: July 23, 2019
    Assignee: Raytheon Company
    Inventor: Jason D. Adams
  • Patent number: 10356940
    Abstract: An air-cooled antenna comprising one or more separate antenna arrays (4) and a plurality of separate respective radio transmitter and/or receiver modules (3) each adapted for generating and/or receiving radio-frequency (RF) transmissions for an antenna array associated therewith. An antenna housing (2) contains the transmitter and/or receiver modules and has a ventilation inlet (8) for receiving air into the housing to an exhaust outlet (9) for outputting the air from the housing. A ventilation driver (6) drives an air flow rate through the housing from the ventilation inlet to the exhaust outlet.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: July 16, 2019
    Assignee: BAE SYSTEMS plc
    Inventor: Adrian Thomas Rowe
  • Patent number: 10342160
    Abstract: Structures and methods for providing heat sink attachments on existing heat sinks. According to a device, a first heat sink comprises a first base and fins extending from the first base. The first base comprises a cutout therein and a first base bottom surface contacting a first electronic component. A second heat sink comprises a second base and fins extending from the second base. The second heat sink is located in the cutout of the first heat sink. The second base comprises a second base bottom surface contacting a second electronic component. A pressure plate is attached to the first heat sink and overlays the second heat sink. The pressure plate contacts the second heat sink and applies pressure between the second heat sink and the second electronic component.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: July 2, 2019
    Assignee: International Business Machines Corporation
    Inventors: Louis-Marie Achard, Kenneth C. Marston, Janak G. Patel, David L. Questad
  • Patent number: 10338648
    Abstract: A low-profile electrical connector that can be coupled to an electronic device without significantly increasing the effective size of the electronic device. When coupled to a compatible mating connector on the electronic device, the electrical connector does not extend significantly beyond the footprint of the electronic device or increase the thickness of the electronic device. Conductors in the electrical connector that electrically couple to contacts in the mating connector are routed to exit the electrical connector on a different side than the side opposite the mating connector.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: July 2, 2019
    Assignee: Toshiba Memory Corporation
    Inventors: Philip A. Kufeldt, Rodney B. Ngai
  • Patent number: 10334762
    Abstract: The present disclosure relates to a movable rack. For example, the movable rack includes an umbilical connection to deliver a fluid, an electrical current, or a network connection to the movable rack. The present disclosure further relates to the movable rack to include a translating frame to move the umbilical connection to correspond with a movement of the movable rack.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: June 25, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventor: John Franz
  • Patent number: 10334760
    Abstract: Systems, apparatuses, and methods for realizing more efficient cooling for a set of computing components that may be operating as a part of a server farm in a helical structure of computing components. Arranging a rack of computing components in a helical pattern situated about a central axis member allows for helical and/or vortical air flow throughout the helical stack of racks. The airflow may be enhanced using large fans as part of an exhaust system located above the exhaust vents or situated below each stack of racks of computing components thereby increasing air flow across all computing components and dissipating heat at a faster rate.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: June 25, 2019
    Inventor: Jed A. Darland
  • Patent number: 10324505
    Abstract: A heat dissipation assembly includes a pressing unit and a heat dissipation module. The pressing unit includes a pressing plate, a plurality of elastic cantilevers and contacting members. The pressing plate can be secured on a bottom plate so that a heat source can be sandwiched between the pressing plate and the bottom plate. The elastic cantilevers are respectively disposed on the pressing plate and protruded outwards from the pressing plate to be suspended in midair. The contacting members are respectively disposed on the elastic cantilevers for abutting the bottom plate. The heat dissipation module is fixedly connected to the pressing plate and a carrier member for thermally guiding the heat source.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: June 18, 2019
    Assignee: Quanta Computer Inc.
    Inventors: Chih-Chao Chen, Pei-Yu Chang, Chia-Hung Ma, Chih-Wei Jen
  • Patent number: 10321609
    Abstract: A cooling system includes an immersion tank that includes a liquid coolant sealed therein, a housing that includes through-holes formed in a top portion and a bottom portion thereof, respectively, and disposed within the immersion tank, an electronic device disposed in the housing in a state of being immersed in the coolant, a coolant flow path formed between an inner surface of the immersion tank and an outer surface of the housing to couplet he through-hole in the top portion of the housing to the through-hole in the bottom portion of the housing so that the coolant flows therethrough, and a heat transfer member that transports heat of the coolant in the coolant flow path to an outside of the immersion tank.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: June 11, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Keita Hirai, Tsuyoshi So, Naofumi Kosugi
  • Patent number: 10321607
    Abstract: When an optical module is inserted into a compartment of a receptacle cage in a state where a heatsink is detached from the receptacle cage, a tip end portion of a protection wall portion of the optical module comes into contact with end portions of guide pieces of a guide plate even if the optical module is inserted with the protection wall portion being lifted up, and the tip end portion of the protection wall portion is thereby pushed down and guided to a clearance below the guide pieces.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: June 11, 2019
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Toshiyasu Ito, Shigeru Sato, Yosuke Takai
  • Patent number: 10306800
    Abstract: The present invention discloses a cooling trough comprising an unflat surface, surrounding an opening of the cooling trough, configured with a height essentially decreasing inwardly. At least one supporting line, running around the opening of the cooling trough, is formed on the unflat surface. The at least one supporting line contacts a baseplate of a power module after the baseplate is attached to the unflat surface of the cooling trough. In addition, the present invention also discloses a cooler comprising the cooling trough and a power module assembly comprising the cooler.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: May 28, 2019
    Assignee: Danfoss Silicon Power GmbH
    Inventors: Franke Wulf-Toke, Ronald Eisele, Reiner Hinken, Frank Osterwald, Klaus Olesen, Lars Paulsen
  • Patent number: 10292316
    Abstract: A module has a first layer with a plurality of transistors mounted thereon. Circuit traces are configured to communicate current between the transistors outwardly of the module. A second layer is in operable communication with the first layer. A third layer is in operable communication with the second layer. A baseplate is in grounded communication with the third layer. A plurality of ribs are positioned between the third layer and the baseplate. The module is configured to allow fluid to flow between the third layer and the baseplate and around the plurality of ribs. A motor drive and a method are also disclosed.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: May 14, 2019
    Assignee: Hamilton Sundstrand Corporation
    Inventor: Debabrata Pal
  • Patent number: 10289174
    Abstract: A solid state drive apparatus includes a housing having a first accommodation space and a second accommodation space; a substrate mounted in the first accommodation space, wherein at least one non-volatile memory chip is mounted on the substrate; and a heat dissipation member mounted in the second accommodation space and including an isolation barrier that defines a boundary between the second accommodation space and the first accommodation space and a plurality of fin portions that extend from the isolation barrier away from the first accommodation space, wherein a plurality of through air holes are provided in a side of the housing adjacent the second accommodation space.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: May 14, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Jung-hoon Kim
  • Patent number: 10285297
    Abstract: A power system includes a chassis, a plurality of conductors disposed within the chassis, and apertures formed within the chassis to provide consistent access to power provided by the conductors by a modular power component when the modular power component is oriented in at least two orientations relative to the chassis. The modular power components are removable from the power system and may be implemented to provide AC or DC power at a surface. The modular power components rotate relative to the chassis to extend above the surface when in use or to be flush with the surface when not in use.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: May 7, 2019
    Assignee: Bretford Manufacturing, Inc.
    Inventors: Virgil Bratcher, Christopher Petrick, Matt Banach, Andrew Goodfellow, Jeff Mowry, Yani Deros
  • Patent number: 10276512
    Abstract: A power electronics system is provided. The system includes at least one outer wall defining an outer zone including a plurality of first electronic components having a first normal operating maximum temperature and capable of generating electromagnetic fields. The system further includes at least one inner wall defining an inner zone disposed within the outer zone and including a plurality of second electronic components having a second normal operating maximum temperature, the first normal operating maximum temperature higher than the second normal operating maximum temperature, the inner zone substantially electromagnetically sealed against electromagnetic interference generated by the plurality of first electronic components.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: April 30, 2019
    Assignee: General Electric Company
    Inventors: Hendrik Pieter Jacobus de Bock, Joseph Lucian Smolenski