Abstract: A semiconductor structure including a semiconductor substrate, a first patterned dielectric layer, a grating coupler and a waveguide is provided. The semiconductor substrate includes an optical reflective layer. The first patterned dielectric layer is disposed on the semiconductor substrate and covers a portion of the optical reflective layer. The grating coupler and the waveguide are disposed on the first patterned dielectric layer, wherein the grating coupler and the waveguide are located over the optical reflective layer.

Abstract: A connector for use in coupling an optical signal between an optical fiber in an optical plug mounted to a bottom of a silicon photonics (SiPh) chip is provided. The connector comprises: a curved mirror; and a tilted flat mirror; wherein at least one of the curved mirror and the tilted flat mirror is formed on a hardened stamped imprint material that was deposited on the SiPh chip at least in a cavity thereof.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to a bidirectional optical grating coupler that may be used for testing. A photonic apparatus includes a first layer with electro-optical circuitry that is optically coupled with a bidirectional optical grating coupler. A second layer is physically coupled with a first side of the first layer and includes a first light path to optically coupled with the bidirectional optical grating coupler. A third layer is physically coupled with a second side of the first layer opposite the first side of the first layer, and includes a second light path that optically couples with the bidirectional grating coupler. Operational testing of the electro-optical circuitry is based in part on light received or transmitted through the second light path. Other embodiments may be described and/or claimed.

Abstract: A method of making a photonic device includes depositing a cladding layer over a silicon layer. The method further includes patterning the cladding layer to expose a first portion of the silicon layer, wherein a second portion of the silicon layer is covered by the patterned cladding layer, and a waveguide portion is in the second portion of the silicon layer. The method further includes depositing a low refractive index layer directly over the patterned cladding layer, wherein a refractive index of the low refractive index layer is less than a refractive index of silicon nitride.

Abstract: One example LIDAR device comprises a substrate and a waveguide disposed on the substrate. A first section of the waveguide extends lengthwise on the substrate in a first direction. A second section of the waveguide extends lengthwise on the substrate in a second direction different than the first direction. A third section of the waveguide extends lengthwise on the substrate in a third direction different than the second direction. The second section extends lengthwise between the first section and the second section. The LIDAR device also comprises a light emitter configured to emit light. The waveguide is configured to guide the light inside the first section toward the second section, inside the second section toward the third section, and inside the third section away from the second section.

Abstract: A grating coupler integrated in a photonically-enabled circuit and a method for fabricating the same are disclosed herein. In some embodiments, the grating coupler includes a substrate comprising a silicon wafer, a first grating region etched into the substrate, wherein the first grating region comprises a first plurality of gratings having a first predetermined height, and a second grating region etched into the substrate, wherein the second grating region comprises a second plurality of gratings having a second predetermined height and wherein the first and second predetermined heights are not identical.

Abstract: Various embodiments of silicon photonic (SiP) chips are provided that are configured for backside or frontside optical fiber coupling. An SiP chip includes a photonic integrated circuit formed on a first surface of a first substrate. The photonic integrated circuit includes at least one optical component and at least one coupling element. The at least one optical component is configured to propagate an optical signal therethrough in a waveguide propagation direction that is substantially parallel to a plane defined by the first surface. The at least one coupling element is configured to couple an optical signal propagating along an optical path transverse to the waveguide propagation direction into the at least one optical component to enable the backside or frontside coupling of an optical fiber to the SiP chip.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to incorporating photonics integrated circuitry into a base die, the base die including an optical interconnect at a bottom of the base die to transmit and to receive light signals from outside the base die. The top of the base die includes one or more electrical connectors that are electrically coupled with the photonics integrated circuitry. The base die may be referred to as the photonics die. A system-on-a-chip (SOC) may be electrically coupled with and stacked onto the top of the photonics die. Other embodiments may be described and/or claimed.

Abstract: A package assembly includes a package substrate including a first die that includes a photonic integrated circuit, a second die located on the first die, the second die including an electronic integrated circuit electrically connected to the photonic integrated circuit, and an interposer module on the package substrate, at least a portion of the interposer module being located on the first die and electrically connected to the photonic integrated circuit.

Abstract: An optical system for directing image illumination injected at a coupling-in region towards a user for viewing includes a light-guide optical element (LOE) (12) with a pair of parallel major external surfaces (24). A first region (16) of the LOE contains a first set of partially-reflecting surfaces (17) oriented to redirect image illumination propagating within the LOE towards a second region of the LOE (18), which contains a second set of partially-reflecting surfaces (19) oriented to couple out the image illumination towards the user. The first set of partially-reflecting surfaces (17) extend across at least 95 percent of a thickness of the LOE, while the second set of partially-reflecting surfaces (19) are contained within a subsection of the thickness spanning less than 95 percent of the thickness, so that the second set of partially-reflecting surfaces (19) are excluded from one or both surface layers of the second region (18).

Abstract: An optical fiber array includes a V-groove substrate in which a V-groove for optical fiber alignment is formed, a pressing plate laminated and bonded on the V-groove substrate, and an optical fiber bonded and fixed in the V-groove of the V-groove substrate, wherein a distance between the optical fiber and the V-groove is less than 20 ?m.

Abstract: An isolator includes a first waveguide with a linear shape and a second waveguide with an annular shape on a substrate including a substrate surface, the first waveguide being positioned along the substrate surface. The first waveguide and the second waveguide each include a core and a cladding. The first waveguide includes a first end, a second end, and a port at each of the first end and the second end for input and output of electromagnetic waves. The core of the second waveguide includes a non-reciprocal member in at least a portion of a cross-section intersecting a direction in which the second waveguide extends.

Abstract: An optical waveguide alignment method includes a step of covering an end portion of an optical fiber, an end portion of a PLC, and a microlens with an adhesive before curing in a state in which at least one microlens is disposed between incidence and emission end faces of end portions of the optical fiber and the PLC, a step of causing light for alignment to be incident on at least one of the optical fiber or the PLC so that light enters a portion covered with the adhesive between the optical fiber and the PLC, and a step of curing the adhesive after the microlens moves onto an optical path between the optical fiber and the PLC due to radiation pressure of light. The optical fiber and the PLC are optically connected via the adhesive and the microlens, and the optical fiber, the PLC, and the microlens are mechanically connected by the adhesive.

Abstract: Phase modulation electrode lines of a semiconductor Mach-Zehnder optical modulator are formed along waveguides. Output-side lead lines are bent in a direction crossing the extending direction of the waveguides in the plane of a dielectric layer and are connected to terminal resistors. The output-side lead lines are formed in a predetermined width corresponding to a desired impedance and make the width narrower than the predetermined width only in the bent portions and portions where the output-side lead lines crosses the waveguides.

Abstract: An optical fiber coupler includes a plurality of optical fibers parallel to each other in a first direction, an optical fiber array block (FAB) configured to maintain a constant center-to-center distance between the plurality of optical fibers, and an optical waveguide block including a plurality of optical waveguides coupled to the plurality of optical fibers, respectively, and configured to transfer optical signals transmitted through the plurality of optical fibers connected to the optical FAB in a second direction in which a photonics chip is placed and which is different from the first direction.

Abstract: A silicon photonic package and a method of fabricating the package are disclosed. The silicon photonic package includes an optical waveguide structure, a heat dissipation structure, a plastic encapsulation layer, first and second structures. The optical waveguide structure is a right trapezoidal structure, and a surface where a non-right angle leg thereof is a totally reflecting surface capable of totally reflecting an optical signal that enters the optical waveguide structure from a surface where a right angle leg is disposed in a direction parallel to bases to a plane where a front face of the plastic encapsulation layer is disposed. The heat dissipation structure and the optical waveguide structure are spaced apart from each other and both embedded in the plastic encapsulation layer. The optical waveguide structure of the present invention allows a great reduction in loss of an optical signal incurred by its propagation in the optical waveguide structure.

Abstract: An orthopedic pin (100) for optically analyzing a bone region (110) includes an elongate shaft (101) and at least one optical fiber (105). The elongate shaft has a circular outer cross section with a first diameter (D1), a distal end (102) for insertion into bone, a proximal end (103), and an optical connector portion (104) disposed towards the proximal end (103). The at least one optical fiber (105) extends within the elongate shaft (101) between the optical connector portion (104), and the distal end (102) for transmitting optical radiation between the optical connector portion (104) and the bone region (110) when the distal end (102) is inserted into the bone region (110). The optical connector portion (104) comprises a reduced-diameter portion (106). The reduced-diameter portion (106) extends along at least a portion of the elongate shaft (101), and has an outer cross section comprising a width (Drd) perpendicularly with respect to the elongate shaft (101).

Abstract: Disclosed are apparatus and methods for optical coupling.

Abstract: The application discloses an optical waveguide device for image display and a display device. The optical waveguide device comprises a coupling-in grating and a coupling-out grating provided on a waveguide substrate. The coupling-out grating is used to couple, at least a portion of light propagating into it along an input direction, out of the waveguide substrate, and has a receiving end located upstream and a coupling-out end located downstream along the input direction. The receiving end is divided into a first grating area, a second grating area and a blank area between the first and second grating areas in a width direction perpendicular to the input direction. The blank area can prevent central light from being prematurely diffracted and splitted by the coupling-out grating, thereby reducing the loss of light energy while ensuring effective coupling-out into an eyebox range, maximizing coupling-out efficiency, and improving the optical effect.

Abstract: A fusion splicer management system for managing progress of a fusion splicing work performed by each splicing technician by using a fusion splicer. This management system includes an acquisition unit, a determination unit, and a notification unit. The acquisition unit acquires fusion splicing data regarding the fusion splicing work performed by each splicing technician who uses each fusion splicer whenever each fusion splicing work is performed. The determination unit determines a progress status of each fusion splicing work by comparing the fusion splicing data with work plan data indicating a work plan. The notification unit notifies of the progress status of each fusion splicing work determined by the determination unit.