Patents Examined by Michael S. Lebentriti
  • Patent number: 6885605
    Abstract: A power-up signal generator uses a deep power down power-up signal, which should be in a standby state in a deep power down entry, for an initialization of other semiconductor elements in a DRAM device that operates after an internal power supply voltage is generated. The generator also uses the power-up signal, which is disabled in the deep power down entry and enabled in a deep power down exit by the internal power supply voltage. The generator may include a power-up detector for generating a power-up detection signal, a deep power down power-up signal generator for generating a deep power down power-up signal, a power-up signal generator for generating a power-up signal and a power-up controller for determining whether or not to enable the power-up signal in the deep power down entry.
    Type: Grant
    Filed: September 26, 2002
    Date of Patent: April 26, 2005
    Assignee: Hynix Semiconductor Inc.
    Inventors: Kang Seol Lee, Jae Jin Lee, Kee Teok Park
  • Patent number: 6834014
    Abstract: An integrated circuit memory device for use in a memory system receives predetermined command/address signals from a memory controller and reads and writes data in response to the command/address signals. The memory device includes at least one input/output terminal that inputs/outputs data from/to the memory controller via a data input/output bus, at least one termination resistor, and an active termination control signal generator that generates a control signal to control active termination of the at least one data input/output terminal in response to a chip selection signal from the memory controller.
    Type: Grant
    Filed: July 19, 2002
    Date of Patent: December 21, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chang-sik Yoo, Kye-hyun Kyung
  • Patent number: 6784099
    Abstract: A dual-sided semiconductor device is formed on a wafer with a resistive element that is formed through the wafer. By forming the resistive element through the wafer, a resistive element, such as a large resistive element, can be formed on the wafer that requires very little silicon surface area.
    Type: Grant
    Filed: March 6, 2002
    Date of Patent: August 31, 2004
    Assignee: National Semiconductor Corporation
    Inventor: Abdalla Aly Naem