Patents Examined by Michael V. Datskovskly
  • Electronic package with direct cooling of active electronic components
    Patent number: 7064953
    Abstract: A cooling assembly includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components. A coolant port allows a coolant to enter the package and directly cool the active electronic components of the dies.
    Type: Grant
    Filed: December 27, 2001
    Date of Patent: June 20, 2006
    Assignee: FormFactor, Inc.
    Inventor: Charles A Miller