Abstract: A ceramic bonding material including at least one fibrous material, a flux agent and a thickening agent wherein the ceramic bonding material fired at a set temperature to bond the two adjacent substrate faces.

Abstract: Multilayered polymer films are configured so that successive constituent layer packets can be delaminated in continuous sheet form from the remaining film. The films are compatible with known coextrusion manufacturing techniques, and can be made without adhesive layers between layer packets that are tailored to be individually peelable from the film. Instead, combinations of polymer compositions are used to allow non-adhesive polymer layers to be combined such that irreversible delamination of the film is likely to occur at interfaces between layer packet pairs. Some polymer layers, including at least one embedded layer, may include an ultraviolet (UV) light stabilizer such as a UV absorber, antioxidant, or hindered amine light stabilizer (HALS), and these layers may be positioned at the front of each layer packet. After the UV-stabilized layer of one packet has been used, the packet can be peeled away to expose a new UV-stabilized layer of the next layer packet.

Abstract: Multilayered polymer films are configured so that successive constituent layer packets can be delaminated in continuous sheet form from the remaining film. The films are compatible with known coextrusion manufacturing techniques, and can be made without adhesive layers between layer packets that are tailored to be individually peelable from the remainder of the film. Instead, combinations of polymer compositions are used to allow non-adhesive polymer layers to be combined such that irreversible delamination of the film is likely to occur at interfaces between layer packets pairs. Some of the polymer layers, including at least one embedded layer, comprise an antimicrobial agent, and these layers may be positioned at the front of each layer packet. After the antimicrobial layer of one layer packet has been used, the packet can be peeled away to expose a pristine antimicrobial layer of the next layer packet. The antimicrobial agent may be organic.

Abstract: A transparent conductive film having a transparent resin film containing a cyclic olefin resin, an undercoating layer formed on the transparent resin film, and a conductive layer and having a thermal dimensional change rate in hot water at 100° C. for 60 seconds of from 0.01 to 0.2%, which shows excellent adhesion between the transparent resin film and the conductive layer.

Abstract: Provided is a transparent conductive film-equipped glass substrate that, during patterning by laser of a transparent conductive film formed on an underlying glass layer, can prevent the transparent conductive film or the underlying glass layer from being discolored or damaged, and a manufacturing method thereof. A transparent conductive film-equipped glass substrate 6 includes a glass substrate, an underlying glass layer provided on the glass substrate, and a transparent conductive film 3 provided on the underlying glass layer and subjected to patterning by laser. The underlying glass layer has an absorptance of a wavelength of the laser lower than the transparent conductive film 3 and higher than the glass substrate. A patterned region 10 formed by removing part of the transparent conductive film 3 by the patterning by laser includes a first linear portion 11, a second linear portion 12, and a connecting portion 13 connecting between the first linear portion 11 and the second linear portion 12.

Abstract: Provided are a multi-layer flexible metal-clad laminate, and a manufacturing method thereof, and more particularly, a multi-layer flexible metal-clad laminate in which at the time of manufacturing a multi-layer polyimide film on a surface of a metal-clad having a predetermined surface roughness value (Rz, Ra) and having roughening particles having a predetermined size or less attached thereon, a multi-coating scheme is used to form each polyimide mixed layer, such that a light reflection on a surface of the polyimide film and a light reflection generated at an interlayer interface of the polyimide in the multi-layer polyimide film are decreased to have an improved light transmittance of a polyimide laminate film after the metal-clad is removed, and a manufacturing method thereof.

Abstract: The invention relates to a solar selective absorbing coating and a preparation method thereof. The solar selective absorbing coating comprises a substrate, an infrared reflective layer, an absorbing layer and an antireflective layer in sequence from bottom to surface. The absorbing layer consists of a first sublayer, a second sublayer and a third sublayer. The first sublayer and the second sublayer contain metal nitride, and the third sublayer is metal oxynitride. The first sublayer is in contact with the infrared reflective layer, and the third sublayer is in contact with the antireflective layer. The preparation method comprises: depositing an infrared reflective layer on a substrate; depositing an absorbing layer on the infrared reflective layer; and depositing the antireflective layer on the absorbing layer.

Abstract: To provide a resin composition having excellent mechanical strength and elongation, its melt-kneaded product and a molding product thereof. A resin composition comprising a fluororesin having a hydroxy group or a carbonyl group, an ester bond-containing resin having no fluorine atom and a transesterification catalyst, a melt-kneaded product obtained by melt-kneading the resin composition, a molding product, film or sheet obtained from the resin composition or the melt-kneaded product, a laminated product, a backsheet for a solar cell, and a method for producing a molding product using the resin composition or the melt-kneaded product.

Abstract: The semiconductor processing sheet of the present invention is a semiconductor processing sheet including a base material and a pressure sensitive adhesive layer provided on one surface of the base material, wherein the pressure sensitive adhesive layer contains an acrylic polymer (A) having a molecular weight distribution of 3.0 or less and an acrylic polymer (B) having a molecular weight distribution of more than 3.0; and a gel fraction of the pressure sensitive adhesive layer is 50 to 70%, and a number average molecular weight of a sol content thereof is 60,000 or more.

Abstract: A filament network for a composite structure may include a number of fiber layers, wherein each fiber layer includes a fiber bundle and a filament layer at least partially covering the fiber bundle, the filament layer including discontinuous filaments including at least one of different length filaments including first length filaments and second length filaments, wherein the first length filaments include a first length and the second length filaments include a second length, and wherein the first length is different than the second length and different type filaments including first type filaments and second type filaments, wherein the first type filaments include a first material composition, wherein the second type filaments include a second material composition, and wherein the first material composition is different that the second material composition, and a resin binding the number of fiber layers together.

Abstract: A mount structure having a joining capable of withstanding development of cracks generated by thermal stress due to repeated temperature changes in a mount structure having the joining of a large area is formed by joining a ceramic substrate electrode of a ceramic substrate and a metal substrate electrode of a metal substrate by a laminate, in which the laminate is formed by stacking a first interface layer, a first solder joining portion, a second interface layer, a first buffer material electrode, a buffer material, a second buffer material electrode, a third interface layer, a second solder joining portion and a fourth interface layer in this order from the ceramic substrate electrode toward the metal substrate electrode, a thickness of the laminate is 30 ?m or more and 100 ?m or less, a difference between a thickness of the first solder joining portion and a thickness of the second solder joining portion is within 25%, and differences in elastic moduli and in linear expansion coefficients between the firs

Abstract: In various exemplary embodiments described herein, an absorbent structure (e.g., a paper material) having an applied absorbent material (e.g., an absorbent film) may be formed by treating a fiber (e.g., a cellulosic fiber) with an applied absorbent material forming system (also referred to as a “film forming system”), absorbent materials, compositions, methods of making absorbent materials, and the like.

Abstract: Provided is a polarizing film laminate comprising: an element substrate; a polarizer; a transparent electroconductive layer patterned so as to function as a touch sensor; and a pressure-sensitive adhesive layer, wherein the adhesive layer comprises: a base adhesive zone made of a transparent base pressure-sensitive adhesive material and formed over a given range from the adhesive layer in a thickness direction of the adhesive layer; and a refractive index adjustment zone formed over a given range from the adhesive layer in the thickness direction and comprising the base adhesive material and material infiltrated into the base adhesive material and different from the base adhesive material, the refractive index adjustment zone having an average refractive index greater than a refractive index of the base adhesive material, and wherein the base adhesive material zone of the adhesive layer is located on the side of the element substrate.

Abstract: A nanoscale structure includes an array of pillars over an underlying layer, a separation wall layer including first separation walls formed over sidewalls of the pillars, and a block co-polymer (BCP) layer formed over the separation wall layer and filling gaps between the pillars. The BCP layer is phase-separated to include first domains that provide second separation walls formed over the first separation walls and second domains that are separated from each other by the first domains.

Abstract: Tool with main body made of carbide, cermet, ceramic, steel or high-speed steel and multi-layer wear-protection coating applied on the main body using a PVD process. The wear-protection coating comprises at least one layer (A) of TiaAl(1?a)N where 0.33?a?1 with layer thickness of 20 nm to 3 ?m and at least one layer (B) comprising a sequence of at least 4 sub-layers arranged alternately in a stack, of TibSi(1?b)N and AlcCr(1?c)N where 0.70?b?0.98 and 0.3?c?0.75 with sub-layer thickness of 0.5 nm to 15 nm, and optionally further comprises a layer (C) of TidSi(1?d)N where 0.70?d?0.98 with layer thickness of 50 nm to 1 ?m. The wear-protection coating can have further carbide layers and layers (A), (B) and (C) can contain up to 10 at. % of other metals, B, C and/or O per layer, depending on the process.

Abstract: Problems to be Solved: To provide a metal foil coil with a planarization film, with which an electronic device can be formed by a roll to roll process. Solution: A quick curable coating liquid for a planarization film prepared by adding into an organic solvent, with respect to 1 mol of a phenyltrialkoxysilane, 0.1 mol to 1 mol of acetic acid and 0.005 mol to 0.05 mol of organic tin as a catalyst, hydrolyzing the silane with 2 mol to 4 mol of water, then distilling away the organic solvent at a temperature of 160° C. to 210° C. under reduced pressure to yield a resin, and dissolving the resin in an aromatic hydrocarbon solvent, is coated on a metal foil coil to a film thickness of 2.0 ?m to 5.0 ?m. When an insulation coating is provided on a metal foil coil before a planarization film is formed, high reliability for insulation can be obtained. When a stainless steel foil provided with a reflection film is used, a highly efficient light emitting device can be obtained.

Abstract: A laminate includes a base having a surface; an atomic layer deposition film that covers the surface of the base and has a film thickness of about 3 nm to about 500 nm (inclusive); and an overcoat layer that covers the atomic layer deposition film. A relationship of ta<toc<50 ta is met, where ta denotes the thickness of the atomic layer deposition film and toc denotes the thickness of the overcoat layer.

Abstract: A floorboard, includes a carrier plate and a veneer arranged on a topside of the carrier plate, wherein the carrier plate and the veneer are connected with each other via a resin, wherein an edge strip made of the resin is provided on at least two side margins of the veneer, and wherein a surface of the edge strip extends in a same plane as a surface of the veneer.

Abstract: The present invention relates to a substrate structure in which organic-inorganic hybrid thin films are laminated and a method for preparing the same and more specifically to a substrate structure in which organic-inorganic hybrid thin films are laminated that can be used for light emitters, display devices and solar cell devices wherein the organic-inorganic hybrid thin film including a stable new functional group, an inorganic precursor and an organic precursor are alternately used to afford stability in air and a method for preparing the same.

Abstract: A glass protective film includes a base film formed by melting a weak adhesive polymer to be adhered to a glass plate by weak adhesion; a first surface of the base film prepared into a weak adhesive surface, which is a mirror surface; and a second surface thereof prepared into a non-adhesive surface which is a rough bead surface. Beads for preparing the rough bead surface are hexagonal, rectangular or triangular beads or ball beads prepared by cutting a film; and the ceiling reach rate of the beads of the rough bead surface is 30% or more.