Patents Examined by Michail V Datskovkiy
  • Patent number: 8760864
    Abstract: A heat-dissipation structure for a portable folding electronic apparatus includes a hinge support and a heat-conducting device. The portable folding electronic apparatus includes a first casing, a second casing, a hinge, a panel module, and the heat-dissipation structure. The first casing and the second casing are pivotally connected by the hinge. The panel module includes a frame and a light source disposed at a corner of the frame. The hinge support is connected to the hinge and the frame. The heat-conducting device is fixed on the hinge support near the light source. Therefore, heat produced by the light source can be dissipated through the heat-conducting device for improving the optical effect of the panel module; deformation of the heat-conducting device can be reduced by use of the stiffness of the hinge support.
    Type: Grant
    Filed: April 29, 2012
    Date of Patent: June 24, 2014
    Assignee: AU Optronics Corp.
    Inventor: Ho-Hsing Chiang
  • Patent number: 8072774
    Abstract: An apparatus includes a substrate which includes an electronic component mounted on the substrate, the electronic component for processing a pair of signals, the substrate including a first wire for transmitting one of the signals, the first wire being formed on a first layer of the substrate, and a second wire for transmitting another one of the signals, the second wire being formed on a second layer of the substrate in a first region under the electronic component and being formed on a third layer in a second region of an other part of the first region.
    Type: Grant
    Filed: March 26, 2008
    Date of Patent: December 6, 2011
    Assignee: NEC Corporation
    Inventor: Tomokazu Tokoro