Abstract: Process and apparatus for fabricating an extended scanning or printing array in which plural smaller scanning or printing chips are bonded end-to-end onto the surface of a glass substrate having an opaque thermally and/or electrically conductive coating thereon, with the coating removed at discrete sites to allow a photocurable adhesive placed at the sites to be cured through exposure to UV light from underneath the substrate, the photocurable adhesive holding the chips in place while a chip bonding adhesive deposited on the conductive coating where the chips are located is cured to provide a permanent structure.