Abstract: An integrated circuit includes a memory cell array coupled to a bitline and a first wordline and a negative-type metal-oxide-semiconductors (NMOS) pull-down structure coupled to the bitline and PMOS transistors. The positive-type metal-oxide-semiconductors (PMOS) transistors may be coupled to a second wordline, where a logic value carried on the second wordline is based on a logic value carried on the first wordline, and the PMOS transistors are structured to pre-charge respective drains of the NMOS pull-down structure to a high logic value based on a low logic value carried on the second wordline. The NMOS pull-down structure may be structured to discharge the bitline based on a high logic value carried on the second wordline.

Abstract: Methods, systems, and devices related to page policies for signal development caching in a memory device are described. In one example, a memory device in accordance with the described techniques may include a memory array, a sense amplifier array, and a signal development cache configured to store signals (e.g., cache signals, signal states) associated with logic states (e.g., memory states) that may be stored at the memory array (e.g., according to various read or write operations). The memory device may be configured to receive a read command for data stored in the memory array and transfer the data from the memory array to the signal development cache. The memory device may be configured to sense the data using an array of sense amplifiers. The memory device may be configured to write the data from the signal development cache back to the memory array based on one or more policies.

Abstract: There is provided a method for accessing a memory cell of a plurality of memory cells that are part of a memory unit, the memory cells being grouped into a plurality of memory cell groups, wherein each memory cell group is associated with one or more local bit lines with each of the one or more local bit lines being operatively connected to a corresponding global bit line via a passgate comprising a PMOS transistor. The method comprises connecting each of the one or more local bit lines to the corresponding global bit line by decreasing a gate voltage that is applied to a gate of the corresponding PMOS transistor to a value that is sufficient to allow the PMOS transistor to conduct, wherein the value of the gate voltage that is sufficient to allow the PMOS transistor to conduct is either a positive or negative voltage.

Abstract: A memory apparatus and method of operation is provided. The apparatus includes a block having memory cells connected to word lines and arranged in strings and is divided into a first sub-block and a second sub-block each configured to be erased as a whole in an erase operation. The apparatus has a temperature measuring circuit configured to detect an ambient temperature of the apparatus. A control circuit is configured to determine a word line inhibit voltage based on the ambient temperature. The control circuit applies an erase voltage to each of the strings while simultaneously applying a word line erase voltage to the word lines associated with a selected one of the first and second sub-blocks to encourage erasing and the word line inhibit voltage to the word lines associated with an unselected one of the first and second sub-blocks to discourage erasing in the erase operation.

Abstract: A memory device includes a memory array with memory blocks each having a plurality of memory cells, and one or more current monitors configured to measure current during post-deployment operation of the memory device; and a controller configured to identify a bad block within the memory blocks based on the measured current, and disable the bad block for preventing access thereof during subsequent operations of the memory device.

Abstract: An integrated circuit includes: a cell array including a plurality of memory cells in a plurality of first rows and a plurality of write assistance cells in at least one second row; a plurality of word lines respectively extending on the plurality of first rows; at least one write assistance line respectively extending on the at least one second row; and a row driver connected to the plurality of word lines and the at least one write assistance line, the row driver being configured to, during a write operation, activate at least one of the plurality of write assistance cells through the at least one write assistance line, wherein each of the plurality of write assistance cells includes the same transistor configuration as each of the plurality of memory cells and has the same footprint as each of the plurality of memory cells.

Abstract: Systems and methods for read level tracking and optimization are described. Pages from a wordline of a flash memory device read and the raw page data read from the wordline may be buffered in a first set of buffers. The raw page data for each of the pages may be provided to a decoder for decoding and the decoded page data for each of the pages buffered in a second set of buffers. First bin identifiers may be identified for memory cells of the wordline based on the raw page data and second bin identifiers may be identified for the memory cells of the wordline based on the decoded page data. Cell-level statistics may be accumulated based on the first bin identifiers and the second bin identifiers, and a gradient may be determined for respective read levels based on decoding results for each of the pages and the cell-level statistics. Settings for the read levels may be configured in the flash memory device based on the determined gradients.

Abstract: A method for compensating for external magnetic fields in memory devices that includes positioning at least one external magnetic field sensing element adjacent to at least one array of memory cells, wherein a write driver is in electrical communication with at least one external magnetic field sensing element and at least one array of memory cells. The at least one external magnetic field sensing element is monitored for signals indicative of the present of an external magnetic field. The write current to the at least one array of memory cells can be adjusted by trimming the write driver to operate the memory device while compensating for the external magnetic field.

Abstract: A multi-level signal receiver includes a data sampler circuit and a reference voltage generator circuit. The data sampler includes (M?1) sense amplifiers which compare a multi-level signal having one of M voltage levels different from each other with (M?1) reference voltages. The data sampler generates a target data signal including N bits, M is an integer greater than two and N is an integer greater than one. The reference voltage generator generates the (M?1) reference voltages, At least two sense amplifiers of the (M?1) sense amplifiers have different sensing characteristics.

Abstract: Techniques are described herein for a reconfigurable memory device that is configurable based on the type of interposer used to couple the memory device with a host device. The reconfigurable memory device may include a plurality components for a plurality of configurations. Various components of the reconfigurable memory die may be activated/deactivated based on what type of interposer is used in the memory device. For example, if a first type of interposer is used (e.g., a high-density interposer), the data channel may be eight data pins wide. In contrast, if second type of interposer is used (e.g., an organic-based interposer), the data channel may be four data pins wide. As such, a reconfigurable memory device may include data pins and related drivers that are inactive in some configurations.

Abstract: A flash memory die includes (i) a first subset of planes including blocks of flash memory cells connected to a first number of word line layers and a plurality of bit lines having a first length, (ii) a second subset of planes including blocks of flash memory cells connected to a second number of word line layers less than the first number of word line layers and a plurality of bit lines having a second length shorter than the first length, (iii) first peripheral circuitry implemented underneath the first subset of planes and including first sense amplifier circuitry and first peripheral control circuitry connected to the first subset of planes, and second peripheral control circuitry connected to the second subset of planes, and (iv) second peripheral circuitry implemented underneath the second subset of planes and including second sense amplifier circuitry connected to the second subset of planes.

Abstract: Present disclosure relates to a method and a system for searching through a Ternary Content Addressable Memory (TCAM). The system comprises a Digital Light Processing System (DLP) receiving an input query. The DLP comprises a 2-Dimensional array of digital micro mirrors configured for reflecting light from one or more input sources in the TCAM to a predefined position. The system further comprises a detection screen having a detection area. The detection area is configured for generating an image of a resultant pixel according to the reflection of the light, wherein the resultant pixel corresponds to a search result for an input query.

Abstract: Apparatuses, systems, and methods for sketch circuits for refresh binning. The rows of a memory may have different information retention times. The row addresses may be sorted into different bins based on these information retention times. In order to store information about which row addresses are associated with which bins a sketch circuit may be used. When an address is generated as part of a refresh operation, it may be used to generate a number of different hash values, which may be used to index entries in a storage structure. The entries may indicate which bin the address is associated with. Based on the binning information, the memory may refresh the address at different rates (e.g., by determining whether to provide the address as a refresh address or not).

Abstract: A three-dimensional (3D) nonvolatile memory device includes a cell string. The cell string includes a pillar structure comprising a ground selection transistor, a plurality of memory cells, and a string selection transistor stacked vertically over a substrate. The memory cells comprise a first cell group and a second cell group stacked on the first cell group, and a horizontal width of at least a portion of the pillar structure decreases in a depth direction towards the substrate. A method of programming the memory device includes initializing a channel of a memory cell of the first cell group of the cell string through the ground selection transistor of the pillar structure, and then applying a program voltage to the memory cell of the pillar structure of the cell string.

Abstract: Systems and methods for detecting a row hammer in a memory comprising a plurality of memory cells arranged in a plurality of rows may include: a plurality of detection cells in a subject row of memory cells, the detection cells to be set to respective initial states and configured to transition to a state different from their initial states in response to activations of memory cells in an adjacent row of memory cells; a comparison circuit to compare current states of the detection cells with initial states of the detection cells and to determine whether any of the detection cells have a current state that is different from their corresponding initial states; and a trigger circuit to trigger a refresh of the memory cells in the subject row based on a detection of detection cells in the subject row having current states that are different from their corresponding initial states.

Abstract: A device includes a section signal generation circuit configured to generate a section signal including bits activated during an operation section of each of internal operations included in a mode operation, and a mode command generation circuit configured to generate a mode command for performing the internal operations included in the mode operation from an oscillating signal, based on the section signal.

Abstract: Various apparatuses, systems, methods, and media are disclosed to provide over-voltage protection to a data interface of a multi-protocol memory card that includes a first communication interface and a second communication interface that enable communication using different protocols. An interface voltage protection circuit includes a control circuit configured to receive a first supply voltage for operating the first communication interface. The interface voltage protection circuit further includes a pull-down circuit operatively connected with the control circuit, configured to pull down a voltage at a supply voltage rail of the second communication interface such that a voltage at a plurality of connector terminals of the second communication interface is lower than the first supply voltage.

Abstract: A controller includes memory and a microcontroller coupled to the memory. The memory is configured to store a list of entries of data in Flash memory coupled to the controller. The microcontroller is configured to periodically update the list of entries based on data programmed into the Flash memory, and check the list of entries upon reading data from the Flash memory.

Abstract: A digital signal processing device includes a control unit that performs control to alternately burst transfer burst length audio data in a first half area of a first buffer memory and burst length audio data in a second half area of the first buffer memory to a DRAM, in which the control unit performs control to burst transfer the burst length audio data in the first half area of the first buffer memory to the DRAM while writing audio data one word at a time to the second half area of the first buffer memory in sequence and performs control to burst transfer the burst length audio data in the second half area of the first buffer memory to the DRAM while writing audio data one word at a time to the first half area of the first buffer memory in sequence.

Abstract: A nonvolatile memory apparatus performs a plurality of read operations by using a plurality of read voltages. A first read operation is performed by applying a first read voltage to a memory cell. A second read operation is selectively performed based on whether a snap-back of the memory cell occurs during the first read operation. The second read operation is performed by applying a second read voltage having a higher voltage level than the first read voltage to the memory cell.