Abstract: A method for characterizing an integrated circuit that selecting at least two devices from an integrated circuit for measuring light emission, wherein each of the at least two devices have experienced a different level of stress, applying power to the integrated circuit, and measuring the light emission from the at least two devices. The method also includes comparing the light emission that is measured from the at least two devices, wherein a difference between the light emission that is measured from the at least two devices greater than a predetermined ratio indicates that at least one of the devices from the at least two devices has a below specification performance.

Abstract: A current sensor based on a Rogowski coil includes a polygonal cross-section tube obtained from of one or more parts of rigid PCB. The windings that form the Rogowski coil are located on the portions of rigid PCB which form the flat faces of the polygonal cross-section tube. One or more parts of rigid PCB are joined together using flexible zones which can bend in the form of an l. The polygonal cross-section tube is designed so that, during its use, the conductor whose current is required to be measured is situated along the tube's longitudinal axis.

Abstract: The present invention provides on IC test substrate for testing various signals, a combined flexible and rigid PCB included in the structure is applicable to perform a mission including for example: stabilizing power input/output, signal transfer by a connector; general, power, and high frequency signal transmission in preserved integrity state.