Patents Examined by Minh T Tran
  • Encapsulated wafer level package with protection against damage and manufacturing method
    Patent number: 8026601
    Abstract: A packaged semiconductor device may include a substrate including at least one device layer and at least one connector arranged thereon, and a resin cover covering each side of the substrate, the resin cover on at least one side of the substrate including an opening exposing the connector and the resin cover on at least one other side of the substrate exposing a portion of the substrate.
    Type: Grant
    Filed: March 25, 2008
    Date of Patent: September 27, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: In Sik Cho