Abstract: Circuits and methods for damping out parasitic resonance within a packaged integrated circuit (IC) are provided. A conductive path including a resistor and a conductor is added in parallel with a conductive path that provides power to components within a die of the packaged IC. When implemented in a packaged laser driver integrated circuit (IC), a conductive path including a resistor and a conductor in placed in parallel with a conductive path that provides a laser driver output, of the packaged laser driver IC, to a laser diode. This abstract is not intended to be a complete description of the various embodiments of the present invention.