Patents Examined by Monique R. Jackson
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Patent number: 10792892Abstract: The invention relates to the use of an aluminium alloy for an aluminium-plastic composite part or for the production thereof, wherein the aluminium alloy has the following composition: Si: 0.05-0.35 wt. %, Fe: 1.3-1.75 wt. %, Cu:?0.02 wt. %, Mn: 0.015-0.035 wt. %, Mg:?0.003 wt. %, Cr:?0.03 wt. %, Ni:?0.02 wt. %, Zn:?0.03 wt. %, Ti:?0.03 wt. %, contaminants individually up to 0.05 wt. %, in total up to 0.15 wt. %, the remainder being aluminium. The invention further relates to the use of an aluminium sheet product made from an alloy of this type for an aluminium-plastic composite part or the manufacture thereof. Finally, the invention also relates to an alloy of this type and to an aluminium sheet product made from an alloy of this type.Type: GrantFiled: January 3, 2017Date of Patent: October 6, 2020Assignee: Hydro Aluminium Rolled Products GmbHInventors: Andreas Siemen, Volker Denkmann
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Patent number: 10781319Abstract: An environmental protective coating (“EPC”) for protecting a surface subjected to high temperature environments of more than 3000 degree F. The coating includes a dense platelet lamellar microstructure with a self-sealing, compliant binder material for holding the platelets together. The platelets may be formed from materials that are resistant to high temperatures and impermeable, such as ceramics. The lamellar microstructure creates a tortuous path for oxygen to reach the surface. The binder material includes engineered free internal volume, which increases the elastic strain of the EPC. The binder is softer than the platelets, which in combination with its free volume increases pliability of the EPC. The binder may have sufficient glass content and glass-forming content for initial and long-term sealing purposes.Type: GrantFiled: July 15, 2016Date of Patent: September 22, 2020Inventor: Daniel H. Hecht
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Patent number: 10745099Abstract: A conductor in composite is disclosed. In various embodiments, an electrically conductive structure, such as an electrically conductive metal, is sandwiched between insulating material and two or more layers of fiber reinforced composite material, to form a stack that is used to form a composite structure that includes the electrically conductive layer. The layer may comprise an electrical line, trace, bus, etc. to conduct electricity from one location to another within the composite structure, such as to connect a battery or other power source at one location to an electrical load at another location.Type: GrantFiled: August 31, 2017Date of Patent: August 18, 2020Assignee: WISK AERO LLCInventor: Geoffrey Alan Long
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Patent number: 10724809Abstract: Polymer-based selective radiative cooling structures are provided which include a selectively emissive layer of a polymer or a polymer matrix composite material. Exemplary selective radiative cooling structures are in the form of a sheet, film or coating. Also provided are methods for removing heat from a body by selective thermal radiation using polymer-based selective radiative cooling structures.Type: GrantFiled: February 27, 2017Date of Patent: July 28, 2020Assignees: The Regents of the University of Colorado, a Body Corporate, University of WyomingInventors: Ronggui Yang, Xiaobo Yin, Gang Tan, Dongliang Zhao, Yaoguang Ma, Yao Zhai
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Patent number: 10697066Abstract: An object of the present invention is to provide a method for forming a multilayer coating film, the method capable of achieving excellent finished appearance and excellent corrosion resistance without affecting electrodeposition coatability even when a part or all of the water-washing step is omitted after chemical conversion treatment, and to provide a coated article.Type: GrantFiled: July 30, 2014Date of Patent: June 30, 2020Assignee: KANSAI PAINT CO., LTD.Inventor: Yukihiro Nemoto
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Patent number: 10689496Abstract: The resin composition according to the present invention is a resin composition including a cyanate compound (A) and/or a maleimide compound (B), and an inorganic filler (C), wherein the inorganic filler (C) includes a boron nitride particle aggregate including primary hexagonal boron nitride particles, wherein (0001) planes of the primary hexagonal boron nitride particles are stacked on top of each other to thereby form the boron nitride particle aggregate.Type: GrantFiled: August 23, 2017Date of Patent: June 23, 2020Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Yoshihiro Nakazumi, Daisuke Ueyama, Kentaro Takano
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Patent number: 10662348Abstract: Disclosed is an aluminium-zinc hot-plated steel plate having excellent weather resistance, corrosion resistance and alkali resistance, and an environmental-friendly surface treating agent therefor, wherein after the surface treatment of the aluminium-zinc hot-plated steel plate using an environmental-friendly surface treating agent consisting of the components of a matrix resin compounded from a particular solvent-free aqueous aliphatic polyurethane dispersion and aqueous polyurethane-acrylic acid copolymer, an organic silicon compound, a matrix resin curing agent, a water-soluble metal salt compound and a high-density polyethylene lubrication auxiliary etc., the formed surface-treated aluminium-zinc hot-plated steel plate has comprehensive properties of excellent weather resistance, corrosion resistance and alkali resistance, and good machine formability etc.Type: GrantFiled: March 26, 2014Date of Patent: May 26, 2020Assignee: Baoshan Iron & Steel Co., Ltd.Inventors: Yuan Ma, Yuling Ren, Yigang Dai, Jianping Zhang, Lan Zhu
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Patent number: 10604641Abstract: The present invention provides a thermosetting resin composition comprising (A) a metal salt of disubstituted phosphinic acid, (B) a maleimide compound having a N-substituted maleimide group in a molecule, (C) a 6-substituted guanamine compound or dicyandiamide and (D) an epoxy resin having at least two epoxy groups in a molecule and a prepreg and a laminated plate which are prepared by using the same. The prepregs obtained by impregnating or coating a base material with the thermosetting resin compositions of the present invention and the laminated plates produced by laminating and molding the above prepregs are balanced in all of a copper foil adhesive property, a glass transition temperature, a solder heat resistance, a moisture absorption, a flame resistance, a relative dielectric constant and a dielectric loss tangent, and they are useful as a printed wiring board for electronic instruments.Type: GrantFiled: October 3, 2016Date of Patent: March 31, 2020Assignee: HITACHI CHEMICAL COMPANY, LTD.Inventors: Shinji Tsuchikawa, Masanori Akiyama, Tomohiko Kotake
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Patent number: 10604848Abstract: An electrical steel sheet (1) includes a base material (2) of electrical steel, and an insulating film (3) formed on a surface of the base material (2). Three conditions (1.8?3[Fe]/[P]+?nM[M]/[P]?3.6, 0.6??nM[M]/[P]?2.4, and 0.6?3[Fe]/[P]?2.4) are satisfied in a region of 50 area % or more of a cross section parallel to a thickness direction of the insulating film. [Fe] denotes a proportion (atom %) of Fe, [P] denotes a proportion (atom %) of P, [M] denotes a proportion (atom %) of each of Al, Zn, Mg and Ca, and nM denotes a valence of each of Al, Zn, Mg and Ca.Type: GrantFiled: December 21, 2015Date of Patent: March 31, 2020Assignee: NIPPON STEEL CORPORATIONInventors: Masaru Takahashi, Shuichi Yamazaki, Kazutoshi Takeda, Hiroyasu Fujii
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Patent number: 10569456Abstract: A resin molded article includes an insert component and a synthetic resin member sealing the insert component. The insert component is provided by a primary molded product of a thermosetting resin, or a metal component, and has a functional group. The synthetic resin member is provided by a synthetic resin including a base polymer of a thermoplastic resin and a bonding component bonding with the functional group included in the insert component. The synthetic resin member has a sea structure formed of a continuous phase including the base polymer, and at least a part of the bonding component is present as a dispersed component in the sea structure. The dispersed component bonds with the functional group included in the insert component.Type: GrantFiled: December 21, 2015Date of Patent: February 25, 2020Assignee: DENSO CORPORATIONInventors: Ryosuke Izumi, Noritaka Inoue, Hodaka Mori
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Patent number: 10568211Abstract: A resin composition, comprising: (a) a resin of formula (I): (b) triallyl isocyanurate (TAIC) as a first hardener; and (c) a hardening promoter, which is a metallic salt compound of formula (II): wherein, R1, R2, R3, R4, A1, A2, Ma+, b, and n are as defined in the specification, and wherein the weight ratio of the resin (a) to the first hardener (b) is about 10:1 to about 1:1, and the content of the hardening promoter (c) is about 0.1 wt % to less than 15 wt % based on the total weight of the resin (a) and the first hardener (b), and the weight ratio of the resin (a) to the total amount of the first hardener (b) and BMI is not lower than 1:1.Type: GrantFiled: July 24, 2015Date of Patent: February 18, 2020Assignee: TAIWAN UNION TECHNOLOGY CORPORATIONInventors: Shur-Fen Liu, Meng-Huei Chen
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Patent number: 10549315Abstract: An electrical steel sheet (1) includes a base material (2) of electrical steel, and an insulating film (3) formed on a surface of the base material (2), the insulating film (3) containing a polyvalent metal phosphate and Fe. A maximum value of a parameter Q expressed by “Q=CFe—O/CP” is equal to or less than 1.3 times and equal to or more than 1.09 times an average value of the parameter Q in a region from a first depth from a surface of the insulating film to a second depth, CFe—O denoting a proportion (atom %) of Fe bonded to O relative to all elements, and CP denoting a proportion (atom %) of P relative to all elements. The first depth is 20 nm from the surface, and the second depth is a depth where the proportion of P is equal to a proportion of metal Fe.Type: GrantFiled: December 21, 2015Date of Patent: February 4, 2020Assignee: NIPPON STEEL CORPORATIONInventors: Masaru Takahashi, Shuichi Yamazaki, Kazutoshi Takeda, Hiroyasu Fujii
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Patent number: 10538841Abstract: A water-barrier laminate having a water-trapping layer (1) in which a hygroscopic agent is dispersed, wherein a hygroscopic agent has such a hygroscopic property that the ratio (Ax/Ay) of a hygroscopic amount Ax at a relative humidity of 80% and a hygroscopic amount Ay at a relative humidity of 30% is not less than 3, and the water-trapping layer is positioned between the two inorganic barrier layers (3a) and (3b). The water-barrier laminate exhibits barrier property against the water over extended periods of time.Type: GrantFiled: July 29, 2015Date of Patent: January 21, 2020Assignee: TOYO SEIKAN GROUP HOLDINGS, LTD.Inventors: Naru Kawahara, Shunya Nangou, Kota Mori, Shinpei Okuyama
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Patent number: 10515801Abstract: Self-assembling materials, such as block copolymers, are used as mandrels for pitch multiplication. The copolymers are deposited over a substrate and directed to self-assemble into a desired pattern. One of the blocks forming the block copolymers is selectively removed. The remaining blocks are used as mandrels for pitch multiplication. Spacer material is blanket deposited over the blocks. The spacer material is subjected to a spacer etch to form spacers on sidewalls of the mandrels. The mandrels are selectively removed to leave free-standing spacers. The spacers may be used as pitch-multiplied mask features to define a pattern in an underlying substrate.Type: GrantFiled: October 20, 2010Date of Patent: December 24, 2019Assignee: Micron Technology, Inc.Inventor: Gurtej Sandhu
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Patent number: 10504864Abstract: There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a1) having a melting point equal to or higher than the reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) includes a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).Type: GrantFiled: December 9, 2015Date of Patent: December 10, 2019Assignee: HITACHI CHEMICAL COMPANY, LTD.Inventors: Kaoru Konno, Hiroki Hayashi, Takashi Kawamori
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Patent number: 10502505Abstract: Polymer-based selective radiative cooling structures are provided which include a selectively emissive layer of a polymer or a polymer matrix composite material. Exemplary selective radiative cooling structures are in the form of a sheet, film or coating. Also provided are methods for removing heat from a body by selective thermal radiation using polymer-based selective radiative cooling structures.Type: GrantFiled: February 29, 2016Date of Patent: December 10, 2019Assignees: The Regents of the Univeristy of Colorado, a Body Corporate, University of WyomingInventors: Ronggui Yang, Xiaobo Yin, Gang Tan, Dongliang Zhao, Yaoguang Ma, Yao Zhai
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Patent number: 10438866Abstract: A heat-insulating sheet includes a heat storage sheet, a first insulating sheet, and a thermally conductive sheet. The heat storage sheet contains a first resin and a plurality of microcapsules containing latent heat storage material and mixed in the form of aggregates with each other. The first insulating sheet has a first face bonded to the heat storage sheet and a second face opposite to the first face. The thermally conductive sheet is bonded to the second face of the first insulating sheet. The content of the microcapsules in the heat storage sheet is falls within a range from 40 wt % to 90 wt %, inclusive. The heat storage sheet includes a layer free from the microcapsules at a portion in contact with the first insulating sheet.Type: GrantFiled: January 8, 2014Date of Patent: October 8, 2019Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Masafumi Nakayama, Yoshiya Sakaguchi, Hirofumi Yamada
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Patent number: 10424529Abstract: It is an object of the present invention to obtain a ceramic circuit substrate having high bonding strength, excellent heat cycle resistance, enhanced reliability of operation as an electronic device, and excellent heat dissipation properties. The present invention provides a ceramic circuit substrate in which metal plates, particularly copper plates, and both main surfaces of a ceramic substrate are bonded vial silver-copper brazing material layers. The silver-copper brazing material layers are formed from a silver-copper brazing material including i) 0.3-7.5 parts by mass of carbon fibers, and ii) 1.0-9.0 parts by mass of at least one active metal selected from titanium, zirconium, hafnium, niobium, tantalum, vanadium, and tin; with respect to iii) a total of 100 parts by mass of a) 75-98 parts by mass of silver powder and b) 2-25 parts by mass of copper powder. The carbon fibers having an average length of 15-400 ?m, an average diameter of 5-25 ?m and an average aspect ratio of 3-28.Type: GrantFiled: February 20, 2015Date of Patent: September 24, 2019Assignee: DENKA COMPANY LIMITEDInventors: Ryota Aono, Kosuke Wada, Masao Tsuichihara, Takeshi Miyakawa
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Patent number: 10384426Abstract: Disclosed is a polyolefin microporous membrane including a multilayer film having two or more layers. In this polyolefin microporous membrane, at least one surface layer has a thickness of not less than 0.2 ?m but not more than 5 ?m and contains inorganic particles, while at least one layer contains a polyethylene and has an air permeability of not less than 50 second/100 cc but not more than 1000 second/100 cc and a puncture strength of not less than 3.0 N/20 ?m.Type: GrantFiled: June 20, 2017Date of Patent: August 20, 2019Assignee: ASAHI KASEI CHEMICALS CORPORATIONInventors: Masahiro Ohashi, Hiroshi Sogo
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Patent number: 10377110Abstract: A copper-clad laminate is prepared by laminating a copper foil on one side or both sides of a polyimide film by thermocompression bonding. The flexibility of the copper-clad laminate is remarkably improved by employing a polyimide film having a thickness of 5 to 20 ?m and a copper foil having a thickness of 1 to 18 ?m.Type: GrantFiled: December 7, 2015Date of Patent: August 13, 2019Assignee: UBE INDUSTRIES, LTD.Inventors: Kohji Narui, Masafumi Hashimoto, Takuro Kochiyama