Patents Examined by Monsour M Said
  • Electronic module, methods of manufacturing and driving the same, and electronic instrument
    Patent number: 8432382
    Abstract: An electronic module includes an EL section; a first substrate on which the EL section is formed; a second substrate attached to the first substrate; an integrated circuit chip mounted on the second substrate; a plurality of first power supply interconnects formed on the first substrate, extending through a pair of regions located on both sides of the EL section; and a plurality of second power supply interconnects formed on the second substrate, extending through a pair of regions located on both sides of the integrated circuit chip.
    Type: Grant
    Filed: March 8, 2011
    Date of Patent: April 30, 2013
    Assignee: Seiko Epson Corporation
    Inventor: Takaaki Hayashi