Patents Examined by Muhammad Azam
  • Patent number: 10622795
    Abstract: A transition for passage of cables (4), wires, and/or pipes through a wall or other barrier and also a module (3) forming a part of the transition, wherein the transition includes a frame (1, 22, 26, 28, 30, 31, 33), having one or more through openings, a compression unit (2) inside each through opening of the frame (1, 22, 26, 28, 30, 31, 33), and one or more modules (3) for receiving the cables (4), wires, and/or pipes. Each module (3) includes two module halves (5, 11-15, 35). Each module (3) includes an outer shell of a compressible material and an intumescent material (6) placed inside the outer shell of the module (3).
    Type: Grant
    Filed: November 7, 2016
    Date of Patent: April 14, 2020
    Assignee: Roxtec AB
    Inventor: Milton Karlsson
  • Patent number: 10442613
    Abstract: A container has a base, sides and a top, the base, sides and top together defining a void within which items can be located in use, an electromagnetic shield fully surrounding at least part of the void to provide an electromagnetic shield between an exterior of the container and items located within the said part of the void, an antenna located within the said part of the void and a signal generator connected to the antenna and operable to apply a signal to the antenna to cause the transmission of an impeding signal within the said part of the void to impede the reception of signals transmitted from locations external to the container by items located within the said part of the void.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: October 15, 2019
    Assignee: KIRINTEC LIMITED
    Inventor: Roy Peter Peers-Smith
  • Patent number: 10374521
    Abstract: A busbar arrangement for making electrical contact with a semiconductor module includes at least two busbars overlapping in an overlap region and electrically insulated from one another. Each busbar includes a web having a connection element, with the webs of the busbars being arranged without an overlap. The webs are oriented such as to define a first axis which runs through the connection element of an associated one of the webs and a point of a transition of the web to the overlap region of the busbar arrangement, and which intersects a second axis which is formed by a connection between two connection elements of the webs at an angle between 0° and 45°. The busbar arrangement includes an insulating region to reduce or prevent a current in the web in a direction perpendicular to the second axis. The overlap region and the webs are each located in one plane.
    Type: Grant
    Filed: November 25, 2016
    Date of Patent: August 6, 2019
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Jürgen Böhmer, Rüdiger Kleffel, Eberhard Ulrich Krafft, Andreas Nagel, Jan Weigel
  • Patent number: 9598030
    Abstract: A wire harness (9) includes an exterior member (16) with a tubular shape which covers a high-voltage conductive path (15), and a drain hole (27) is formed in the exterior member (16). The drain hole (27) is covered with a clamp (20), that is, a post-installed member in a state that the function of the drain hole is ensured. The clamp (20) includes a tube attachment portion (32), and the tube attachment portion (32) includes a drain function ensuring portion (34). A gap (35) is formed between the drain hole (27) and the clamp (20). A foreign substance entry preventing portion (36) is formed in a side of the gap (35) in a vehicle progress direction P. An outside communication hole (37) is formed in an opposite side in the vehicle progress direction P.
    Type: Grant
    Filed: June 19, 2014
    Date of Patent: March 21, 2017
    Assignee: Yazaki Corporation
    Inventors: Shinichi Inao, Tatsuya Oga, Hideomi Adachi
  • Patent number: 9526185
    Abstract: A hybrid printed circuit board may include a top layer, a bottom layer, and a plurality of internal layers stacked up between the top layer and the bottom layer. The plurality of internal layers may include a first internal layer below the top layer and a second internal layer above the bottom layer. The hybrid printed circuit board may include first unreinforced laminate placed between the top layer and the first internal layer. The hybrid circuit board may additionally include second unreinforced laminate placed between the second internal layer and the bottom layer. The hybrid printed circuit board may include third laminate placed between adjacent internal layers of the plurality of internal layers.
    Type: Grant
    Filed: April 8, 2014
    Date of Patent: December 20, 2016
    Assignee: FINISAR CORPORATION
    Inventors: Henry Meyer Daghighian, Steven C. Bird, Gerald Douglas Babel