Abstract: A modular switchboard provides an adjustable length bus bridge for electrically connecting two adjacent switchboards, where the length of the bus bridge can be adjusted on site if needed. The bus bridge comprises a first set of busbars, each being electrically insulated from one another, and a second set of busbars, each being electrically insulated from one another. The first and second sets of busbars are arranged such that the busbars in the first set of busbars and the busbars in the second set of busbars are slidable relative to one another to adjust a length of the bus bridge. A longitudinal slot is formed in each busbar in either the first or the second set of busbars, or both, to accommodate a through bolt in the bus bridge when the first and second set of busbars slide relative to one another.

Abstract: A circuit board including: a first board material layer having a first planar surface and a first sidewall surface perpendicular to the first planar surface; a first conductive layer on the first planar surface; a second board material layer stacked on the first board material layer and having a second planar surface and a second sidewall surface perpendicular to the second planar surface; a second conductive layer on the second planar surface; and a plating on the first sidewall surface and the second sidewall surface and electrically connecting the first conductive layer and the second conductive layer.

Abstract: An improved RF interface board and a laminated assembly having a RF interface board having an inner and an outer part. The laminated assembly includes a dielectric support having a first and a second surfaces and at least a first and a second RF transmission strips disposed on the dielectric support. The first and the second RF transmission strips are electrically isolated from each other, are configured to be connected to a connector at the outer part, and are each configured to be connected to a different conductive element at the inner part. The first RF transmission strip is on the first surface of the dielectric support.

Abstract: A grommet assembly includes a grommet through which a wiring material is inserted, that is attached to a through hole formed on a panel, and a protector through which the wiring material is inserted, that is attached to the panel to house the grommet. The grommet includes a lip part that is formed toward the panel to abut on the panel, and the protector includes a wall part that is extended toward the panel to cover an outer side of the lip part.

Abstract: A capacitor includes a first die with a first side and a second side, wherein the first side of the first die includes a trace pattern. The capacitor also includes and a second die with a first side and a second side, wherein the first side of the second die includes the trace pattern. The first side of the first die and the first side of the second die are coupled to form a trace pattern of the capacitor, wherein the trace pattern of the capacitor comprises an interdigitated pattern, a first pad, and a second pad at an interface of the first side of the first die and the first side of the second die, the first pad at a first side of the interdigitated pattern, and the second pad at a second side of the interdigitated pattern, the second side laterally opposite the first side.

Abstract: A grommet assembly includes: a grommet through which a wiring material is inserted, that is attached to a through hole formed on a panel for a vehicle; a resin inner arranged to abut on a side of the grommet opposite to the panel for the vehicle; and a protector through which the wiring material is inserted, the protector being locked to the resin inner and attached to the panel for the vehicle to hold the grommet and the resin inner between the protector and the panel for the vehicle.

Abstract: An apparatus includes a printed circuit board (PCB), a power component disposed on the PCB, the power component to generate heat, and a multilayered coating disposed over the power component and at least a portion of the PCB to dissipate heat from the power component, the multilayered including: an electrical insulation layer comprising a non-polar compound and disposed on the power component and the at least a portion of the PCB; a chromium layer disposed on the electrical insulation layer; and a copper layer disposed on the chromium layer that is at least 10 microns (?m) thick, the copper layer conformally adhered to a top of the power component and to the PCB.

Abstract: A stretchable substrate includes a cell and an electrode wiring. The cell is divided by cutting lines to form a plurality of cells. The electrode wiring is continuously provided on the plurality of cells not to cross the cutting line. A cell is connected to a neighboring cell by a connection portion in which a cutting line is not formed, and when a tensile force is applied, the cell is hinge-rotated around the connection portion, and the electrode wiring maintains a continuous state even when the cell is hinged.

Abstract: A circuit board includes an input side and an output side oppositely arranged, and the output side is configured to electrically connect to a display substrate. The circuit board includes a plurality of signal lines extending in a direction from the input side to the output side. Each of the plurality of signal lines includes a main body and a plurality of output branches. Each of the plurality of output branches is connected to one end of the main body close to the output side and has a same line width. A line width of the main body is greater than a sum of line widths of all the output branches belonging to same signal line.

Abstract: The present disclosure relates to a printed circuit board. The printed circuit board includes a plurality of insulating layers each having a plurality of concave portions; a plurality of conductor pattern layers disposed in a plurality of concave portions of each of the plurality of insulating layers; first and second via holes connected to one of the plurality of concave portions independently of each other and penetrating through at least two of the plurality of insulating layers independently of each other; and first and second via conductors disposed in the first and second via holes, respectively, and connecting two of the plurality of conductor pattern layers independently of each other. An average width of the first via conductor is greater than that of the second via conductor on a cross-section.

Abstract: A substrate structure includes a carrier board and a laminated structure. The carrier board has a board body, through holes and conductive portions. The board body has a first surface and a second surface. The through holes communicate the first and second surfaces. Each through hole has a first opening and a second opening. The conductive portions are arranged on the first surface, and the first opening is sealed by a corresponding conductive portion. The laminated structure includes a viscid layer and conductive elements. One surface of the viscid layer is in surface contact with the second surface. Each conductive element passes through and accommodates in the viscid layer, and corresponds to one through hole in a projection direction of the carrier board. One end of each conductive element is electrically connected to one conductive portion through the corresponding through hole.

Abstract: A multilayer substrate module includes a first substrate portion including a first substrate portion body including first insulator layers stacked in a vertical direction and a first conductor layer and/or a first interlayer connection conductor provided at the first substrate portion body. A second substrate portion includes a second substrate portion body including second insulator layers stacked in the vertical direction and a second conductor layer and a second interlayer connection conductor provided at the second substrate portion body, and is mounted on an upper surface of the first substrate portion. A mount device is mounted on an upper surface or a lower surface of the second substrate portion. At least a portion of an inductance component is defined by the first conductor layer and the first interlayer connection conductor.

Abstract: A compact keyboard, monitor, and mouse (KMM) system includes a tray subsystem including a pair of drawer slides configured to mate with the equipment rack, each drawer slide having a bottom plane parallel to the ground when installed in the equipment rack. The system further includes a console housing supported by the tray subsystem. The console housing has a top surface that defines recesses for a keyboard and a monitor. The system also includes a keyboard. When secured in the keyboard recess, the keyboard is positioned parallel to the bottom plane of the tray subsystem. When positioned in the monitor recess, the monitor is canted at an angle relative to the bottom plane of the tray subsystem.

Abstract: A composite electronic component includes a ceramic electronic component including a body, comprising a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode; and an interposer including a substrate, disposed below the body, and a connection electrode disposed on the substrate and connected to the external electrode by a connection member. The external electrode includes a first electrode layer including metal particles and an insulating resin.

Abstract: An electronic device includes at least a housing, a mainboard, a conductive coil, and a conductive adapter. The housing includes an inner surface and an outer surface provided opposite to each other. The mainboard is arranged on the inner surface. The conductive coil is arranged on the inner surface and is integrally arranged with the housing. The conductive coil includes a winding portion, an outer connection terminal, and an inner connection terminal. In a radial direction of the winding portion, the mainboard is located at an outer side of the winding portion. The outer connection terminal is connected to the winding portion and is located at the outer side of the winding portion. The outer connection terminal is electrically connected to the mainboard.

Abstract: A guarded coaxial cable assembly include one or more conductors, one or more rails, and an outer jacket, the orientation of the rail and the conductor(s) within the outer jacket operative to limit conductor or conductor jacket deformations such as deformations due to bends and transverse loads when the cable assembly is squeezed between a sash and a jamb.

Abstract: An insulated electric wire with a water-stopping portion, and a wire harness including the insulated electric wire. The insulated electric wire includes a conductor with multiple metal material elemental wires twisted together, and an insulation covering covers an outer circumference of the conductor. The insulated electric wire includes an exposed portion wherein the insulation covering is removed, a covered portion where the insulation covering covers the conductor, the exposed and covered portions are adjacent to each other in a longitudinal axis direction, and a water-stopping portion wherein gaps between the wires in the exposed portion are filled with a water-stopping agent. At least a portion of the water-stopping agent contacting the wires is made of a resin material that cures upon contact. A wire harness includes the insulated electric wire, and electric connections at both ends, each capable of other device connection.

Abstract: An electronic device includes a conductive layer, a first dielectric layer, and a second dielectric layer, in which the second dielectric layer is disposed on the first dielectric layer, the conductive layer is disposed between the first dielectric layer and the second dielectric layer, the first dielectric layer has a first transmittance for a light, the second dielectric layer has a second transmittance for the light, and the first transmittance is different from the second transmittance.

Abstract: A communication enclosure includes a housing and a fiber optic organizer. The housing defines a plurality of ports. The fiber optic organizer includes a tower configured to hold one or more fiber management trays. The tower is mountable to the housing in one of at least two different tower positions. In the first tower position, the tower is disposed between a first of the ports and a second of the ports. In the second tower position, the tower is disposed between the second port and a third of the ports.

Abstract: A three-dimensional pad structure includes a substrate; a pad disposed on the substrate, wherein a perimeter of the pad is covered with a solder mask; and at least one conductive pillar protruding from a top surface of the pad.