Patents Examined by Murtin Sulsky
  • Process for fabricating a crack resistant resin encapsulated semiconductor chip package
    Patent number: 6046072
    Abstract: A heat-resistant adhesive is provided for use in an adhesive member for the fabrication of a semiconductor package by bonding a semiconductor chip to a lead frame with the adhesive member and sealing at least the semiconductor chip and a bonded part between the semiconductor chip and the lead frame with a sealant. The adhesive has a coming-out length of not more than 2 mm and a water absorption rate of not more than 3 wt. %. Preferably, the adhesive has a glass transition point of at least 200.degree. C.
    Type: Grant
    Filed: March 19, 1998
    Date of Patent: April 4, 2000
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hidekazu Matsuura, Yoshihide Iwazaki, Naoto Ohta