Abstract: A method for processing a visitor request includes filling-out and submitting a visitor request form over an intranet, and creating a database on the visitor based upon the filled-out visitor request form. A visitor approval request message is transmitted via e-mail to at least one evaluator based upon the visitor database if approval is required. The visitor approval request message has a hyperlink to the filled-out visitor request form. An approval recommendation by the evaluator is submitted via e-mail, and the filled-out visitor database is updated. If approval is received from all evaluators, then the filled-out visitor request form is validated. A visitor badge is issued based upon a validated filled-out visitor request form.
Type:
Grant
Filed:
November 20, 2001
Date of Patent:
October 21, 2008
Assignee:
Lockheed Martin Corporation
Inventors:
Cathy A. Lue Chee Lip, Jill E. Garrison, Frederick M. Korich, Elizabeth R. Washington
Abstract: In one aspect, the invention includes a method of forming a gated semiconductor assembly, comprising: a) forming a silicon nitride layer over and against a floating gate; and b) forming a control gate over the silicon nitride layer. In another aspect, the invention includes a method of forming a gated semiconductor assembly, comprising: a) forming a floating gate layer over a substrate; b) forming a silicon nitride layer over the floating gate layer, the silicon nitride layer comprising a first portion and a second portion elevationally displaced from the first portion, the first portion having a greater stoichiometric amount of silicon than the second portion; and c) forming a control gate over the silicon nitride layer.
Type:
Grant
Filed:
January 30, 2004
Date of Patent:
November 28, 2006
Assignee:
Micron Technology, Inc.
Inventors:
Mark A. Helm, Mark Fischer, John T. Moore, Scott Jeffrey DeBoer
Abstract: A semiconductor device includes a first semiconductor package and a second semiconductor package which is mounted onto the first semiconductor package. The first semiconductor package has lands on an upper surface for mounting the second semiconductor package and lands on the lower surface for external connection, which are used for connection with a mounting substrate. The second semiconductor package has external leads which are connected to the lands for mounting the second semiconductor package.
Type:
Grant
Filed:
July 18, 2001
Date of Patent:
September 3, 2002
Assignee:
Mitsubishi Denki Kabushiki Kaisha
Inventors:
Hideki Ishii, Kazunari Michii, Jun Shibata, Moriyoshi Nakashima