Abstract: Thin silicon films of high thickness uniformity and thicknesses of from 0.1 ?m to 200 ?m are prepared by applying a crosslinkable silicone composition to a moving carrier by means of a slot die, removing solvent, if present, and subsequently crosslinking the silicone layer formed on the carrier.
Type:
Grant
Filed:
February 23, 2017
Date of Patent:
April 24, 2018
Assignee:
WACKER CHEMIE AG
Inventors:
Andreas Koellnberger, Alfred Schwinghammer